A heat dissipation device includes: a heat spreader having a first plate and a second plate, wherein the plates are connected to form a receiving space therebetween; a first capillary material provided on the first plate, the second plate, or both; at least one heat pipe having a cavity in communication with the receiving space, wherein the heat pipe is connected to the heat spreader at one end and is outside the heat spreader and closed at the other end; a second capillary material provided on the inner wall of the heat pipe; at least one fiber bundle of an elongated shape, wherein the fiber bundle has a portion in the receiving space and in contact with the first capillary material and another portion extending into the cavity and in contact with the second capillary material; and a working fluid in the receiving space and the cavity.

A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.

A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.

In some examples, a method for additively manufacturing a heat pipe, the method including depositing, via a filament delivery device, a filament to form a heat pipe preform, wherein the filament includes a binder and a metal or alloy powder; and sintering the heat pipe preform to form the heat pipe, the heat pipe including an outer shell, a wicking region, and a vapor transport region defined by the metal or alloy.

The present invention relates generally to a manifold for a parallel flow heat exchanger and a heat exchanger incorporating that manifold. The manifold comprising a first plurality of channels each having a first opening facing a first direction and a second opening facing a second direction different from the first direction. The manifold further comprises a second plurality of channels interleaved with the first plurality of channels, the second plurality of channels having a third opening facing a third direction and a fourth opening facing the first direction, wherein the third direction is different from the first direction and the second direction.

A heat exchanger header includes a primary fluid duct extending between a fluid port and a first branched region, a plurality of secondary fluid ducts fluidly connected to the primary fluid duct at the first branched region, wherein an overhang region is formed laterally between adjacent ones of the plurality of secondary fluid ducts, and wherein each of the plurality of secondary fluid ducts extends between the first branched region and a second branched region, a plurality of tertiary fluid ducts fluidly connected to each of the plurality of secondary fluid ducts at the second branched regions, a primary horn integrally formed with and extending from the overhang region, an at least one secondary horn integrally formed with and extending from one of the plurality of tertiary fluid ducts, and a sacrificial support structure extending between the primary horn and the at least one secondary horn.

A heat exchanger has a first plurality of passages extending in a first direction and to receive a first fluid and a second plurality of passages extending in a second direction, and to receive a second fluid, and the first plurality of passages being formed across a cross-sectional face of the heat exchanger, and there being distinct combined flow cross-sectional areas of the first plurality of passages in different locations across the cross-sectional face of the heat exchanger. A gas turbine engine and a method of forming a heat exchanger are also disclosed.

A heat exchanger header includes a primary fluid duct extending between a fluid port and a first branched region, a plurality of secondary fluid ducts fluidly connected to the primary fluid duct at the first branched region, wherein an overhang region is formed laterally between adjacent ones of the plurality of secondary fluid ducts, and wherein each of the plurality of secondary fluid ducts extends between the first branched region and a second branched region, a plurality of tertiary fluid ducts fluidly connected to each of the plurality of secondary fluid ducts at the second branched regions, a primary horn integrally formed with and extending from the overhang region, an at least one secondary horn integrally formed with and extending from one of the plurality of tertiary fluid ducts, and a sacrificial support structure extending between the primary horn and the at least one secondary horn.

A sintered heat tube and a semiconductor cooling refrigerator having the same, the sintered heat tube comprises: a main tube segment with its both ends closed, and a manifold tube segment/manifold tube segments extending from one or more portions of one side of the main tube segment (respectively), wherein a work chamber of each manifold tube segment communicates with that of the main tube segment. In the sintered heat tube and the semiconductor cooling refrigerator having the sintered heat tube of the present invention, as the sintered heat tube includes manifold tube segments, the sintered heat tube of the present invention greatly improves the heat radiating or cold transferring efficiency. The sintered heat tube is particularly suitable for heat radiation of heat sources of a high heat flow density such as semiconductor cooling plates.

The present invention relates to a plate heat exchanger comprising a plate package and a manifold both made of metal. The plate package comprises a plurality of heat exchanger plates stacked between end plates. The heat exchanger plates being sealed to each other and form alternating first plate interspaces for a first medium and second plate interspaces for a second medium. The plate package defines at least two port channels communicating with the first plate interspaces. At least one of the end plates define connection ports communicating with a respective port channel. The manifold defines a port opening, a distant opening and a flow passage extending between the port opening and the distant opening. The manifold being fixedly attached to one of the end plates such that the port opening of the manifold covers one of the connection ports. The manifold being made by additive manufacturing, moulding or casting.