An embodiment of a heat exchanger assembly includes a first manifold adapted for receiving a first medium, a core adapted for receiving and placing a plurality of mediums, including the first medium, in at least one heat exchange relationship, and a core meeting the first manifold at a first core/manifold interface; The mounting structure supports a heat exchanger, and is metallurgically joined to at least one heat exchanger assembly component at a first joint integrally formed with the mounting structure.

An additively manufactured heat exchanger can include a plurality of vertically built fins, and a plurality of non-horizontally built parting sheets. The plurality of vertically built fins can extend between and connect to the plurality of parting sheets. The heat exchanger can include a plurality of layers of fins and parting sheets. The heat exchanger can include first and second flow circuits for allowing separate fluid flows to flow through the heat exchanger to exchange heat therebetween.

In one general aspect, a microchannel heat exchanger is disclosed. It includes a cover, a base, and thermally conductive sheets between the cover and the base that each define a series of side-by-side lanes aligned with a flow direction. The lanes each include aligned slots that define microchannel segments and are separated by cross ribs. The sheets are stacked between the base and cover so as to cause at least some of the ribs to be offset from each other and allow the microchannel segments in the same lane in adjacent sheets to communicate with each other along the flow direction to define a plurality of microchannels in the heat exchanger.

A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.

The present disclosure relates to particles for heat transfer and/or heat storage. Particularly, by coating metal oxides on the silica surface, the solar absorptivity becomes higher than the conventional ceramic proppant. The particles the present disclosure are durable at ultra-high temperatures while their solar absorptivity is recoverable multiple time as heat transfer and/or heat storage. The present disclosure can be applied to concentrating solar power industry. The present disclosure significantly reduces the Levelized cost of the energy due to low-cost product and high solar absorptivity.

A heat dissipation device, includes a vapor chamber including a heat conduction chamber and a first wick structure, the heat conduction chamber having a recessed portion, and the first wick structure disposed in the heat conduction chamber; and a heat pipe including a pipe body and a second wick structure disposed in the pipe body, the pipe body positioned in the recessed portion of the heat conduction chamber. The first wick structure and the second wick structure are metallically bonded.

A spiral heat exchanger features: a cold fluid inlet manifold, a hot fluid inlet manifold and at least one spiral fluid pathway. The cold fluid inlet manifold receives cold fluid and provide cold inlet manifold fluid. The hot fluid inlet manifold receives hot fluid and provide hot inlet manifold fluid. The at least one spiral fluid pathway includes cold spiral pathways configured to receive the cold inlet manifold fluid and provide cold spiral fluid pathway fluid, and hot spiral pathways configured to receive the hot inlet manifold fluid and provide hot spiral fluid pathway fluid. The cold spiral pathways and the hot spiral pathways are configured in relation to one another to exchange heat between the cold spiral pathway fluid and the hot spiral pathway fluid so that the hot spiral fluid pathway fluid warms the cold spiral fluid pathway fluid, and vice versa.

A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.

The present disclosure provides a heat pipe capable of preventing deformation of even a thin container and having excellent heat transfer characteristics by preventing freezing of a working fluid even if the longitudinal direction of the container is set substantially parallel to the direction of gravity in cold regions. A heat pipe includes a container having a tubular shape with both ends sealed, a wick structure stored in the container, and a working fluid sealed in the container, wherein, in at least one of cross sections perpendicular to the longitudinal direction of the container, the wick structure is in contact with the inner surface of the container at two points but both side surfaces of the wick structure are not in contact with any inner surface of the container, and a sintered metal layer is formed on the container inner surface being not in contact with the wick structure.

A heat exchanger includes a body, a plurality of first flow channels defined in the body; and a plurality of second flow channels defined in the body. The second flow channels are fluidly isolated from the first flow channels. The first flow channels and second flow channels are arranged in a checkerboard pattern.