A heat exchanger includes a core comprising a single piece continuous boundary having a first surface defining a first labyrinth, and an opposing second surface defining a second labyrinth; a first inlet manifold connected to the first labyrinth and configured to supply a first fluid to the first labyrinth; and a second inlet manifold connected to the second labyrinth and configured to supply a second fluid to the second labyrinth; wherein the core comprises a plurality of identical three dimensional unit cell structures replicated in three orthogonal spatial dimensions.

A method of forming a thermal energy storage unit for a surface to be cooled or heated includes using an additive manufacturing process to form a plurality of non-rectilinear structures having a plurality of thermally conductive substructures, the substructures defining a plurality of interior cavities within the substructures and a plurality of exterior fluid channels that cross over or under the plurality of interior cavities, arranging the plurality of non-rectilinear structures in a plurality of housings, wherein each of the plurality of non-rectilinear structures is arranged in a corresponding one of the plurality of housings, and connecting the plurality of housings to each other to build up the thermal energy storage unit whereby the thermal energy storage unit is modular.

A hot-press sintering method to prepare a loop heat pipe evaporator includes: putting a shell of the evaporator into a mould, uniformly and compactly filling corresponding positions in the mould with material powders of an evaporation core, a heat insulation core and a transmission core, applying a pressure high enough to tightly fit the evaporation core and the transmission core to the shell at corresponding sintering temperatures of powder materials for the evaporation core and the transmission core, carrying out hot-press sintering for molding, carrying out cooling after metallurgically bonding the powder materials of the evaporation core and the transmission core, and carrying out demolding to obtain the loop heat pipe evaporator, wherein the mould is provided with corresponding structures shaped like steam channels on positions where the evaporation core is provided with the steam channels.

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

Processes produce a compound material structure by producing a composite material which extends along an axis of elongation from carbon nanostructures anchored in a matrix of a first metal extending along the axis of elongation of the composite material. The processes comprise dividing the composite material into segments of the composite material, arranging the segments in a plane of a die matrix, filling free spaces in the die matrix with a filler material and subsequently sintering in the die matrix to form a compound material structure or squeeze casting in the die matrix, and exposing the carbon nanostructures of the composite material on at least one surface of the compound material structure such that the carbon nanostructures protrude out of this surface. Compound material structures and uses thereof as a heat conductor and/or a heat exchanger are also provided.

A heat conduction device with an inner loop includes a vapor chamber having at least one hole edge and a heat pipe having an outer pipe and an inner pipe. The outer pipe has a closed end and an open end communicating with the hole edge. Two ends of the inner pipe are open. The inner pipe has one end communicating with the vapor chamber through the hole edge and the other end extended along the axial direction of the outer pipe to form at least one port for communicating the closed end of the outer pipe with the inner pipe. The inner pipe is located inside the outer pipe to form a gap annularly. The port communicates with the gap, so that the inner loop is formed between the vapor chamber and the heat pipe.

A heat exchanger includes a first flow circuit structure having at least a first portion defined by a plurality of conduits and a second flow circuit structure having at least a second portion disposed at the first portion such that walls of the second portion are disposed between the conduits and are free to move relative to the conduits. Fluid flowing through the first flow circuit structure is fluidically isolated from fluid flowing through the second flow circuit structure.

A method of building a heat exchanger includes forming the heat exchanger with layer-by-layer additive manufacturing. A first hollow annulus is formed. A body of the heat exchanger is formed to be integrally connected to and grown upwards from the first hollow annulus. The body includes an exterior wall and a heat exchanger core disposed within the exterior wall. The body defines an interior that is cylindrically shaped with an axis oriented parallel to a direction of gravity. The first annulus is disposed on a gravitational bottom of the body. A second hollow annulus is formed integrally connected to and grown upwards from a gravitational top of the body. Residual powder is removed from a bottom of the heat exchanger.

A heat dissipation device includes an upper cover, a lower cover, an upper wick, a first wick, a plurality of second wicks, a third wick, and a gas-liquid separation plate. The lower cover and the upper cover together form a sealed vacuum chamber therebetween. The upper wick is attached on a first inner surface of the upper cover and is in fluid communication with the second wicks and the third wick. The first wick is attached on a second inner surface of the lower cover. The second wicks are attached on the lower cover. Third wick is attached on a third inner surface of the lower cover and is connected to and in fluid communication with the first wick. The gas-liquid separation plate is attached on a planar area of the third wick so as to separate a vapor from a liquid in the sealed vacuum chamber.

A heat exchanger includes: a low temperature side channel through which low temperature liquid helium flows; a high temperature side channel through which high temperature liquid helium flows; and a thermal conduction unit that conducts heat from the high temperature side channel to the low temperature side channel. The thermal conduction unit has a partition member that separates the high temperature side channel and the low temperature side channel from each other and a thermal resistance reduction unit that reduces the thermal resistance between the partition member and the liquid helium. The thermal resistance reduction unit has a porous body having nano-size pores and fine metal particles having higher thermal conductivity than that of the porous body.