Embodiments described herein relate to a bi-functional thermal cooling system. The bi-functional thermal cooling system includes a first body, a second body, and a third body. The second body has a first plurality of Weyl semimetal nanostructures. The second body is spaced apart from the first body. The third body has a second plurality of Weyl semimetal nanostructures. The third body is spaced apart from the second body. The second body and the third body are each configured to independently rotate with respect to the first body to change an optical property of the first plurality of Weyl semimetal nanostructures of the second body and an optical property of the second plurality of Weyl semimetal nanostructures of the third body.

The present application discloses two-phase cooling devices that may include at least three substrates, a metal with a wicking structure, an intermediate substrate, and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

Transport of a vaporizable liquid containing at least one solute through a material containing nanochannels is performed by contacting material with at least one vaporizable liquid component and inducing liquid transport along nanochannel interior wall surfaces, wherein the material contains nanochannels having an average diameter up to about 300 nm, preferably up to about 100 nm, and liquid transport is induced by partial liquid vaporization. A film of solid material is deposited onto an interior nanochannel wall surface by removing the transport liquid.

Transport of a vaporizable liquid containing at least one solute through a material containing nanochannels is performed by contacting material with at least one vaporizable liquid component and inducing liquid transport along nanochannel interior wall surfaces, wherein the material contains nanochannels having an average diameter up to about 300 nm, preferably up to about 100 nm, and liquid transport is induced by partial liquid vaporization. A film of solid material is deposited onto an interior nanochannel wall surface by removing the transport liquid.

An apparatus includes a heat exchanger configured to transfer heat to a fluid and to absorb heat from the fluid as the fluid flows between a warm end and a cold end of a cryocooler. The heat exchanger includes at least one section having a substrate of at least one allotropic form of carbon and a layer of nanoparticles on or over the substrate. The heat exchanger could include multiple sections, and each section could include one of multiple substrates and one of multiple layers of nanoparticles. The heat exchanger can further include pores through the multiple sections of the heat exchanger, where the pores are configured to allow the fluid to flow through the heat exchanger and to contact the substrates and the layers of nanoparticles. The nanoparticles could include at least one lanthanide element or alloy, and the substrate could include carbon nanotubes or graphene.

A helical fractal heat exchanger comprises a heat exchanger core defining a plurality of helical, first fluid conduits arranged in a two-dimensional grid configuration, and plurality of helical, second fluid conduits in thermal communication with the first fluid conduits. A first fluid inlet structure splits a first fluid from a first fluid inlet of the heat exchanger and supplies it to each of the plurality of first fluid conduits, and a first fluid outlet structure recombines the first fluid from the plurality of first fluid conduits and conveys it to a first fluid outlet of the heat exchanger. The first fluid inlet and outlet structures are each fractal structures comprising at least two multi-furcation stages in which a parent channel divides into two or more sub-channels that diverge away from each other.

A cooling device includes a substrate defining a substrate upper surface, and a fin positioned on the substrate upper surface, the fin including a deformable encapsulating layer coupled to the substrate upper surface and defining an interior region, and a phase-change material encapsulated within the interior region, where the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer.

A method of fabricating an oscillating heat pipe includes building the oscillating heat pipe with a layer-by-layer additive manufacturing process such that the oscillating heat pipe includes a body of solid material, an array of channels, an evaporator portion, and a condenser portion. The array of channels are disposed in the body and define a continuous loop through which a fluid flows. The array of channels is formed by cavities in the body as the body is formed with layer-by-layer additive manufacturing. An inner surface of a channel includes a flow directing feature that is configured to promote a first direction of flow and that is configured to provide resistance against a second direction of flow that is opposite the first direction of flow.

A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.

A high-performance thermal interface material comprising a heterogeneous copper-tin nanowire array that is ultra-compliant and that can reduce thermal resistance by two times as compared with the state-of-the-art thermal interface materials. The high-performance thermal interface material can be further used in electronic systems, ranging from microelectronics to portable electronics to massive data centers, to operate at lower temperatures, or at the same temperature but with higher performance and higher power density.