A reactor containing a heat exchanger is disclosed, which can be operated with co-current or counter-current flow. Also disclosed is a system that includes a reactor having a reformer and a vaporizer, a fuel supply, and a water supply. The reactor includes a source of combustion gas, a reformer operative to receive reformate, and a vaporizer operative to receive water. The reformer and vaporizer each include a stack assembly formed by a combination of separator shims and channel shims. The separator shims and channel shims are stacked in a regular pattern to form two sets of channels within the stack assembly. One set of channels will have vertical passageways at either end and a horizontal flowpath between them, while the other set of channels has only a horizontal flowpath.

A heat exchanger, such as for example, a condenser coil constructed as a fin and microchannel tube is fluidly connected with a volume constructed and configured to store refrigerant in certain operations, such as for example during a pump down operation. The volume is fluidly connected to a fluid port of the heat exchanger, where the fluid port is an inlet (in the cooling mode) to the heat exchanger, such as the high side condensing section of the heat exchanger. The volume receives refrigerant exiting the heat exchanger from the fluid port in a mode other than a cooling mode, e.g., a pump down operation.

The present application discloses a microchannel flat tube and a microchannel heat exchanger. The microchannel flat tube includes a flat tube body and a row of channels. The row of channels is arranged in the flat tube body along a width direction. The row of channels extends through the flat tube body along a length direction. A cross-section of each channel includes a first width in the width direction and a first height in a thickness direction. The row of channels at least includes a first channel, a second channel and a third channel along the width direction. The first widths of the first channel, the second channel and the third channel are decreased at a fixed ratio, thereby facilitating the control of the thickness of the microchannel flat tube and improving the heat exchange efficiency of the third channel.

A plate-like fluid container for guiding a fluid, container having two at least partially abutting layers, an inlet for inflow of the fluid into the fluid container and an outlet for outflow of the fluid from the fluid container, in particular at least intermittently continuous inflow and outflow of the fluid, whereby, between the layers along at least one recess present at least in one of the layers, at least one fluid channel associated with the recess is present for guiding a fluid from the inlet to the outlet.

A system for testing circuits of an integrated circuit semiconductor wafer includes a tester system for generating signals for input to the circuits and for processing output signals from the circuits for testing the wafer and a test stack coupled to the tester system. The test stack includes a wafer probe for contacting a first surface of the wafer and for probing individual circuits of the circuits of the wafer, a wafer thermal interposer (TI) layer operable to contact a second surface of the wafer and operable to selectively heat areas of the wafer, and a cold plate disposed under the wafer TI layer and operable to cool the wafer. The system further includes a thermal controller for selectively heating and maintaining temperatures of the areas of the wafer by controlling cooling of the cold plate and by controlling selective heating of the wafer TI layer.

In one general aspect, a microchannel heat exchanger is disclosed. It includes a cover, a base, and thermally conductive sheets between the cover and the base that each define a series of side-by-side lanes aligned with a flow direction. The lanes each include aligned slots that define microchannel segments and are separated by cross ribs. The sheets are stacked between the base and cover so as to cause at least some of the ribs to be offset from each other and allow the microchannel segments in the same lane in adjacent sheets to communicate with each other along the flow direction to define a plurality of microchannels in the heat exchanger.

The present disclosure provides materials and methods related to passive cooling systems. In particular, the present disclosure provides a condensorator heat exchanger with a single microchannel coil that integrates the evaporator and condenser into one assembly. The passive heat exchanger systems of the present disclosure provide enhanced cooling capacity and airflow in environments ranging from outdoor electronic enclosures to commercial and residential buildings.

A heat exchanger for receiving an airflow having an uneven intensity distribution across the heat exchanger and for flowing refrigerant within the heat exchanger. The heat exchanger includes sections of microchannel tubes for flowing refrigerant through at least one pass through the heat exchanger, wherein the sections are configured according to the airflow across the heat exchanger. The heat exchanger may be used in an HVAC system. A method may also be performed to manufacture the heat exchanger.

Several innovative technologies, including pressure-drop minimization, advanced refractory high entropy alloys, and advanced manufacturing can provide a compact heat exchanger that extends the state-of-the-art heat-exchanger operating range. The compact heat exchanger can reduce pressure drop losses by 100 to 500%, while retaining most of the heat transfer. The compact heat exchanger can be fabricated from refractory high entropy alloys that have favorable corrosion, thermal fatigue, and creep properties at high temperatures and pressures. Therefore, the compact heat exchanger using high entropy alloys can operate at >800° C. and 80 bars.

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.