According to the present invention, a semiconductor device includes a first metal plate, a second metal plate provided above the first metal plate, a third metal plate provided above the second metal plate, a first semiconductor chip provided between the first metal plate and the second metal plate, a second semiconductor chip provided between the second metal plate and the third metal plate and a cooling member, wherein the first metal plate has a first cooling portion that is in contact with the cooling member, the second metal plate has a second cooling portion that is in contact with the cooling member, and the third metal plate has a third cooling portion that is in contact with the cooling member.

A temperature control system, the system comprising a cooling block configured to be in conductive communication with a heat source, said cooling block comprising a stem and a base, a cooling fluid configured to circulate through the base of the cooling block, and an electrical barrier formed in the base of the cooling block between the heat source and the cooling fluid.

A heat exchanger comprising an ion wind generating part configure to generate an ion wind having directionality charged positive or negative, a heat exchanging part provided at an upstream side in the direction of flow of the ion wind and configured to exchange heat with the ion wind, and a charge removing part provided at a downstream side in the direction of flow of the ion wind and electrically neutralizing the ion wind exchanged in heat with the heat exchanging part.

A method includes printing, using a 3D printer, a cold plate, printing, using a 3D printer, an electrical insulation layer embedded in a top surface of the cold plate, and printing, using a 3D printer, a conductor substrate embedded in the electrical insulation layer embedded in the top surface of the cold plate.

In one general aspect, a microchannel heat exchanger is disclosed. It includes a cover, a base, and thermally conductive sheets between the cover and the base that each define a series of side-by-side lanes aligned with a flow direction. The lanes each include aligned slots that define microchannel segments and are separated by cross ribs. The sheets are stacked between the base and cover so as to cause at least some of the ribs to be offset from each other and allow the microchannel segments in the same lane in adjacent sheets to communicate with each other along the flow direction to define a plurality of microchannels in the heat exchanger.

According to the present invention, a semiconductor device includes a first metal plate, a second metal plate provided above the first metal plate, a third metal plate provided above the second metal plate, a first semiconductor chip provided between the first metal plate and the second metal plate, a second semiconductor chip provided between the second metal plate and the third metal plate and a cooling member, wherein the first metal plate has a first cooling portion that is in contact with the cooling member, the second metal plate has a second cooling portion that is in contact with the cooling member, and the third metal plate has a third cooling portion that is in contact with the cooling member.

An arrangement may include an electrical component and a heat exchanger arranged on the electrical component for controlling a temperature of the component. An electrically insulating isolation layer may be arranged at least partially between the heat exchanger and the component. The isolation layer may be connected to at least one of the component and the heat exchanger via a materially cohesive connection.

A two-phase cooling system for an X-ray high-voltage generator comprises a heat sink block and a heat sink. The heat sink block spatially surrounds a cooling duct loop, wherein the cooling duct loop is at least partially filled with a working medium and is configured to act as an oscillating heat pipe. The heat sink is configured to dissipate heat from a heat source. The heat sink block includes a material including a polymer.

A heat transfer system includes fluid transfer cells that vibrationally move a fluid and a thermally conductive cover that conducts heat from the cells while avoiding transfer of mechanical energy between the cells. A fluid transfer module includes outer and inner walls, a support member, and a membrane. The outer wall has an outer opening. The inner wall has an inner opening. The support member is disposed laterally on the inner wall such that a flow chamber is defined between the outer and inner walls. The membrane is supported by the support member along the outer wall. A fluid transfer module includes an inlet port and an actuator. The actuator undergoes vibrational motion and has first and second vibrational modes. The first vibrational mode causes fluid to enter the inlet port. The second vibrational mode expels fluid from the inlet port, which reduces clogging of the inlet port.

A temperature control system, the system comprising a cooling block configured to be in conductive communication with a heat source, said cooling block comprising a stem and a base, a cooling fluid configured to circulate through the base of the cooling block, and an electrical barrier formed in the base of the cooling block between the heat source and the cooling fluid.