A thermal module includes a copper base seat, at least one U-shaped aluminum heat pipe, an aluminum radiating fin assembly and a copper embedding layer. The copper base seat has a heat absorption side and a heat conduction side. The heat absorption side or the heat conduction side is recessed to form at least one first heat pipe receiving channel. The U-shaped aluminum heat pipe has a horizontal section as a heat absorption section and two vertical sections as condensation sections. The heat absorption section is positioned in the first heat pipe receiving channel. The aluminum radiating fin assembly has multiple radiating fins. The copper embedding layer is disposed on a surface of the heat absorption section of the U-shaped aluminum heat pipe. By means of the copper embedding layer, two different materials can be directly welded.

A thermal module structure includes an aluminum base having an upper and a lower surface, at least one L-shaped copper heat pipe, a first aluminum fin assembly, a second aluminum fin assembly, and at least one copper embedding layer. The copper heat pipe includes a heat absorption section fitted on the aluminum base, and a heat dissipation section connected to the second aluminum fin assembly. The copper embedding layers are provided on the aluminum base at areas corresponding to the first aluminum fin assembly and the heat absorption section of the copper heat pipe, and on a bottom surface of the first aluminum fin assembly that is to be connected to the aluminum base. Thus, the first aluminum fin assembly and the copper heat pipe can be directly welded to the aluminum base via the copper embedding layers without the need of electroless nickel plating.

A thermal module assembling structure includes an aluminum base seat which has a heat absorption side, a heat conduction side and a connection section. The connection section is selectively disposed on the heat absorption side, the heat conduction side or embedded in the aluminum base seat (between the heat absorption side and the heat conduction side). The connection section is correspondingly connected with at least one copper heat pipe. A copper embedding layer is disposed on a portion of the connection section, which portion is in contact and connection with the copper heat pipe. A welding material layer is disposed between the copper embedding layer and the copper heat pipe, whereby the aluminum base seat and the copper heat pipe can be more securely connected with each other. The conventional chemical nickel plating is replaced with the copper embedding layer so as to improve the problem of environmental pollution, etc.

A heat dissipation device assembly includes an aluminum base seat, an aluminum radiating fin assembly and at least one U-shaped copper heat pipe, which is upright arranged or horizontally arranged. The aluminum base seat has at least one connection section. A copper embedding layer is disposed on the connection section. The aluminum radiating fin assembly is assembled and disposed on the aluminum base seat. The copper heat pipe has a heat dissipation section and a heat absorption section respectively connected on the aluminum radiating fin assembly and the connection section of the aluminum base seat. By means of the copper embedding layer, the aluminum base seat and the copper heat pipe can be directly welded and connected with each other without chemical nickel treatment.

Heat exchangers include a first heat exchange section joined to a second heat exchange section. In some embodiments, channels of one or more of the heat exchange sections may be positioned such that adjacent channels are collinear in at least one direction. In some embodiments, sidewalls of one or more of the heat exchange sections may exhibit a substantially constant thickness along a section of the heat exchanger that includes the channels.

A cooling array for cooling of an electronic component includes the electronic component, a housing which at least partially enclosing the electronic component, a heat sink support connected to the housing in a fluid-tight manner, and a heat sink which is accommodated in the heat sink support. The heat sink is thermally coupled to the electronic component in order to disperse heat generated by the electronic component.

A method of manufacturing a heat exchanger array that includes stacking a plurality of heat exchanger units in an aligned configuration with respective first ports of the heat exchanger units aligned. The heat exchanger units can include a first and second sheet coupled together to define an cavity between the first and second sheets; the first port at a first end of the heat exchanger unit defined by the first and second sheets; and a second port at a second end of the heat exchanger unit defined by the first and second sheets. The method further includes stacking the plurality of heat exchanger units in an aligned configuration with the first ports of the plurality of heat exchanger units aligned and generating a first plurality of respective couplings between adjacent sheets of adjacent heat exchanger units about adjacent first ports. The coupling can be generated by an adhesive.

A method of making and operating a heat exchanger that includes introducing a first fluid into a fluid chamber of a membrane heat exchanger to change the membrane heat exchanger from a flat configuration to a non-flat configuration while the membrane heat exchanger is disposed within a chamber with the membrane heat exchanger extending from a first end to a second end of the chamber and generating a fluid flow of the first fluid within the fluid chamber of the membrane heat exchanger between first and second ends of the membrane heat exchanger, the first fluid generating heat exchange with a second fluid disposed within the chamber. The membrane heat exchanger includes sheets that form a fluid chamber.

A hot water device includes a heat exchanger and an apparatus to which the heat exchanger is to be connected. First and second cases for the heat exchanger and the apparatus to which the heat exchanger is to be connected include first and second flange portions laid over each other and welded together. The first and second flange portions are each demarcated into a corner flange portion corresponding to one of first and second corner portions, and into a non-corner flange portion other than the corner flange portion. The non-corner flange portions protrude more to the outside of the first and second cases than the corner flange portions.

A method for forming a hybrid heat exchanger is provided. The method includes laser-texturing a metal surface to create a plurality of microstructures and subsequently melt-bonding a plastic component to the plurality of microstructures. During melt-bonding, plastic material penetrates the plurality of microstructures and conforms to the plastic component to the metal surface. After hardening inside the microstructures, the plastic component adheres to the metal surface as a hybrid component. As a result, a fastener or snap connection is not required, and the plastic-metal joint provides a barrier to water, glycol-based fluids, air, and other fluids.