A pump assembly includes a housing with an air inlet and an air outlet, a motor supported by the housing, the motor including a drive shaft rotatable about a drive shaft axis, a first plurality of diaphragms supported by the housing, the first plurality of diaphragms positioned along a first plane, and a second plurality of diaphragms supported by the housing, the second plurality diaphragms positioned along a second plane, the second plane spaced apart from the first plane. Rotation of the drive shaft is operable to move each diaphragm of the first plurality of diaphragms and each diaphragm of the second plurality of diaphragms from an intake position to a compression position to pump a fluid from the air inlet through the air outlet.

A pump includes a housing, a piezoelectric device, a plurality of first holes, a plurality of second holes, and a plurality of first valves. The housing has a pump chamber defined by a first major plate, a second major plate, and a peripheral plate. The piezoelectric device is provided on the first major plate. The plurality of first holes each extend through the first major plate and are arranged annularly. The plurality of second holes each extend through the second major plate. The plurality of first valves are provided at the plurality of first holes, respectively. When the piezoelectric device is activated, the first major plate undergoes bending vibration with a node defined between a center and a peripheral edge of the first major plate. The plurality of first holes are provided between the node and the peripheral edge.

A pump includes a housing, a piezoelectric device, a plurality of first holes, a plurality of second holes, and a plurality of first valves. The housing has a pump chamber defined by a first major plate, a second major plate, and a peripheral plate. The piezoelectric device is provided on the first major plate. The plurality of first holes each extend through the first major plate and are arranged annularly. The plurality of second holes each extend through the second major plate. The plurality of first valves are provided at the plurality of first holes, respectively. When the piezoelectric device is activated, the first major plate undergoes bending vibration with a node defined between a center and a peripheral edge of the first major plate. The plurality of first holes are provided between the node and the peripheral edge.

A micropump device is formed in a monolithic semiconductor body integrating a plurality of actuator elements arranged side-by-side. Each actuator element has a first chamber extending at a distance from a first face of the monolithic body; a membrane arranged between the first face and the first chamber; a piezoelectric element extending on the first face over the membrane; a second chamber, arranged between the first chamber and a second face of the monolithic body; a fluidic inlet path fluidically connecting the second chamber with the outside of the monolithic body; and a fluid outlet opening extending in a transverse direction in the monolithic body from the second face as far as the second chamber, through the first chamber. The monolithic formation of the actuator elements and the possibility of driving the actuator elements at different voltages enable precise adjustment of flows, from very low values to high values.

A micropump device is formed in a monolithic semiconductor body integrating a plurality of actuator elements arranged side-by-side. Each actuator element has a first chamber extending at a distance from a first face of the monolithic body; a membrane arranged between the first face and the first chamber; a piezoelectric element extending on the first face over the membrane; a second chamber, arranged between the first chamber and a second face of the monolithic body; a fluidic inlet path fluidically connecting the second chamber with the outside of the monolithic body; and a fluid outlet opening extending in a transverse direction in the monolithic body from the second face as far as the second chamber, through the first chamber. The monolithic formation of the actuator elements and the possibility of driving the actuator elements at different voltages enable precise adjustment of flows, from very low values to high values.

A gas control device includes a pump, a valve, a cuff, and a controller. The valve includes a first plate having a first vent hole and a first vent hole, a channel forming plate having an exhaust hole and an exhaust channel, a second plate having a second vent hole, and an edge separation plate. A manchette rubber tube in the cuff is joined to the periphery of the second vent hole in the second plate by an adhesive, and thus the valve is connected to the cuff. The exhaust hole is opened to the atmosphere. The pump includes a pump housing having a discharge hole and a discharge hole. The upper surface of the pump housing is joined to the bottom surface of the edge separation plate.

A gas control device includes a pump, a valve, a cuff, and a controller. The valve includes a first plate having a first vent hole and a first vent hole, a channel forming plate having an exhaust hole and an exhaust channel, a second plate having a second vent hole, and an edge separation plate. A manchette rubber tube in the cuff is joined to the periphery of the second vent hole in the second plate by an adhesive, and thus the valve is connected to the cuff. The exhaust hole is opened to the atmosphere. The pump includes a pump housing having a discharge hole and a discharge hole. The upper surface of the pump housing is joined to the bottom surface of the edge separation plate.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A cooling system including a support structure, a cooling element, and a bottom plate is described. The cooling element has a central region and a perimeter. The cooling element is supported by the support structure at the central region. At least a portion of the perimeter is unpinned. The cooling element undergoes vibrational motion when actuated to drive a fluid toward a heat-generating structure. The bottom plate has orifices and at least one cavity therein. The at least one cavity is adjacent to and fluidically connected with the orifices. The at least one cavity and the orifices define an orifice distance between the orifices and the heat-generating structure and an orifice length within the bottom plate. The heat-generating structure and the bottom plate define a gap between a portion of the bottom plate and a portion of the heat-generating structure.