Disclosed is a flow device including an inlet, an outlet, and a plurality of fluid flow paths hydraulically connected in parallel to the inlet and the outlet, wherein the plurality of fluid flow paths forms a first ring of fluid flow paths circumferentially arranged at a first radial distance from a centerline of the fluid flow device a second ring of fluid flow patch circumferentially arranged at a second radial distance from the centerline of the fluid flow device, each of the plurality of fluid flow paths has a first hydraulic resistance in a forward flow direction and a second hydraulic resistance in a reverse flow direction, and the second hydraulic resistance is greater than the first hydraulic resistance.

A method of driving a pump is used in a pressure-applying apparatus, the apparatus including a flow passage, a pump configured to impart pressure into the flow passage, an opening and closing valve configured to open and close the flow passage, a pressure detector configured to detect pressure in the flow passage, and an atmospheric air open valve configured to open an interior of the flow passage to atmospheric air. The method includes driving the pump after closing the opening and closing valve and opening the atmospheric air open valve, and evaluating a state of the pump, based on one of: the pressure detected by the pressure detector at a time at which a predetermined time period has elapsed after closing the atmospheric air open valve, and a time from closing of the atmospheric air open valve until detection of a predetermined pressure by the pressure detector.

A cooling system and method for using the cooling system are described. The cooling system includes an array of cooling elements and a controller. The array of cooling elements corresponds to regions of the heat-generating structure where heat is generated in response to operation of the semiconductor. The controller is configured to activate portions of the array of cooling elements based on a determination that operation of the heat-generating structure is likely to generate heat in a given region of the heat-generating structure.

A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.

A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A pump is provided with a pump housing, a vibrating portion, a driving portion, and a displacement regulating portion. The pump housing internally has a pump chamber. The vibrating portion is supported against the pump housing in the pump chamber and divides the pump chamber into a first pump chamber and a second pump chamber. The driving portion drives the vibrating portion so as to bend and vibrate the vibrating portion in a predetermined direction. The displacement regulating portion is positioned to prevent displacement of the vibrating portion that results in plastic deformation.

An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

A compressor (10), in particular a compressor for compressing a coolant, including one or more pistons (12), a cylinder block (16), and a compressor housing which at least partially houses the compressor (10), the piston(s) (12) being arranged in corresponding cylinder bores or cylinders (14) arranged at least partially in the cylinder block (16) and/or in the compressor housing so that they can move back and forth. The compressor (10) also includes an impedance tube (36) and an outlet (30) for releasing the coolant from the compressor, (10) in particular an outlet flange (32). Said compressor (10) has an associated high pressure volume (24), for one or more, in particular, for respectively two cylinders (14), and a common high pressure volume (26), in which the individual high pressure volumes (24) join, the common high pressure volume (26) being connected to the outlet (30) and the impedance tube (36) being arranged in the connection between the common high pressure volume (26) and the outlet (30) or the connection is created between the common high pressure volume (26) and the outlet (30). The invention also relates to a corresponding coolant circuit and to a corresponding air-conditioning system.