In an aspect, a tensioner for an endless drive member, comprising a shaft and base that are mountable to be stationary relative to an engine, a tensioner arm that is pivotable relative to the shaft about a tensioner arm axis, a pulley on the tensioner arm rotatable about a pulley axis that is offset from the tensioner arm axis, and that is engageable with an endless drive member, a tensioner spring that is positioned to urge the tensioner arm towards a free arm position, a damping element that engages the tensioner arm and that is engaged by a plurality of axially spaced segments of the tensioner spring.

In an aspect, a tensioner for an endless drive member, comprising a shaft and base that are mountable to be stationary relative to an engine, a tensioner arm that is pivotable relative to the shaft about a tensioner arm axis, a pulley on the tensioner arm rotatable about a pulley axis that is offset from the tensioner arm axis, and that is engageable with an endless drive member, a tensioner spring that is positioned to urge the tensioner arm towards a free arm position, a damping element that engages the tensioner arm and that is engaged by a plurality of axially spaced segments of the tensioner spring.

One aspect is an insert molded friction torque device with a rotatable shaft, a friction element mounted over the rotatable shaft in an interference fit, a rigid enclosure structure at least partially enclosing the friction elements, and a single-piece molded housing enclosing the friction element and at least partially enclosing the rigid enclosure structure such that a first portion of the housing is between the friction elements and the rigid enclosure structure within the rigid enclosure structure and a second portion of the housing is outside the rigid enclosure structure.

One aspect is an insert molded friction torque device with a rotatable shaft, a friction element mounted over the rotatable shaft in an interference fit, a rigid enclosure structure at least partially enclosing the friction elements, and a single-piece molded housing enclosing the friction element and at least partially enclosing the rigid enclosure structure such that a first portion of the housing is between the friction elements and the rigid enclosure structure within the rigid enclosure structure and a second portion of the housing is outside the rigid enclosure structure.

An apparatus is provided. The apparatus includes an equipment support structure configured to support a semiconductor fabrication component. The apparatus includes a damper assembly configured to resist a lateral force induced by a seismic event to the equipment support structure. The damper assembly includes a gear rack coupled to the equipment support structure. The damper assembly includes a first flywheel assembly including a first mass damper flywheel and a first gear meshed with the gear rack and selectively engaged with the first mass damper flywheel.

An apparatus is provided. The apparatus includes an equipment support structure configured to support a semiconductor fabrication component. The apparatus includes a damper assembly configured to resist a lateral force induced by a seismic event to the equipment support structure. The damper assembly includes a gear rack coupled to the equipment support structure. The damper assembly includes a first flywheel assembly including a first mass damper flywheel and a first gear meshed with the gear rack and selectively engaged with the first mass damper flywheel.

An apparatus is provided. The apparatus includes an equipment support structure configured to support a semiconductor fabrication component. The apparatus includes a damper assembly configured to resist a lateral force induced by a seismic event to the equipment support structure. The damper assembly includes a gear rack coupled to the equipment support structure. The damper assembly includes a first flywheel assembly including a first mass damper flywheel and a first gear meshed with the gear rack and selectively engaged with the first mass damper flywheel.

An apparatus is provided. The apparatus includes an equipment support structure configured to support a semiconductor fabrication component. The apparatus includes a damper assembly configured to resist a lateral force induced by a seismic event to the equipment support structure. The damper assembly includes a gear rack coupled to the equipment support structure. The damper assembly includes a first flywheel assembly including a first mass damper flywheel and a first gear meshed with the gear rack and selectively engaged with the first mass damper flywheel.