A covering device for fully or partially covering one or more of a recess, a flat portion, a curved portion, and a stepped portion of at least one of a vehicle body component and a vehicle part includes a cover element provided by a strip element or a cap element, and at least one lip element which is fixedly or detachably connected to the cover element on at least one of its longitudinal sides, the covering device is designed so that light from a lighting device can shine through at least a portion of the covering device, at least one of the cover element and the at least one lip element is made at least partly of a polymeric substrate which is coated with a chromium-based reflective coating material, and the polymeric substrate and the chromium-based reflective coating are at least partially translucent.

A heatsink, a light-emitting diode (LED) module and a corresponding method of manufacture are described. A heatsink includes an electrically conductive heatsink core and an electrically insulating layer covering at least the first surface of the electrically conductive heatsink core. The electrically conductive heatsink core has a first pin that is integral with the electrically conductive heatsink core and protrudes from a first surface of the heatsink core. At least the first surface of the heatsink core is covered by an electrically insulating layer, which leaves at least portions of a lateral surface of the first pin exposed from the electrically insulating layer.

Lighting systems are described. A lighting system includes a first lead frame portion and a second lead frame portion. The first lead frame portion has at least a top surface, a bottom surface, and an opening. The second lead frame portion is within the opening of the first lead frame portion and has at least a top surface and a bottom surface. Light-emitting diode (LED) devices are each mechanically and electrically coupled to the top surface of the first lead frame portion and the top surface of the second lead frame portion. An electrically insulating and optically reflective material is disposed over exposed regions of the top surfaces of the first and second lead frame portions.

Lighting systems are described. A lighting system includes a first lead frame portion and a second lead frame portion. The first lead frame portion has at least a top surface, a bottom surface, and an opening. The second lead frame portion is within the opening of the first lead frame portion and has at least a top surface and a bottom surface. Light-emitting diode (LED) devices are each mechanically and electrically coupled to the top surface of the first lead frame portion and the top surface of the second lead frame portion. An electrically insulating and optically reflective material is disposed over exposed regions of the top surfaces of the first and second lead frame portions.

The disclosure provides an electronic device, including a circuit board, multiple semiconductor components, a first light reflecting structure, and a second light reflecting structure. The circuit board includes a substrate, and the substrate may have a first surface and at least one side surface. The multiple semiconductor components are disposed on the first surface. The first light reflecting structure is disposed on the first surface. The second light reflecting structure is disposed on the first surface and the at least one side surface.

The disclosure provides an electronic device, including a circuit board, multiple semiconductor components, a first light reflecting structure, and a second light reflecting structure. The circuit board includes a substrate, and the substrate may have a first surface and at least one side surface. The multiple semiconductor components are disposed on the first surface. The first light reflecting structure is disposed on the first surface. The second light reflecting structure is disposed on the first surface and the at least one side surface.

A lighting module includes a heat sink with a sidewall and a partition defining two cavities, a LED light source disposed in one cavity to emit light, a driver module disposed in the other cavity with driver circuitry to provide electrical power to the light source, and an optical assembly to provide a desired emission profile. The optical assembly is field-changeable and includes a cover lens with snap-fit connectors to facilitate removal and replacement. The optical assembly further includes either a reflector coupled to the cover lens or an optical lens coupled to the heat sink via an optic holder. In some examples, the driver circuitry facilitates dimming of the light source. The heat sink also dissipates heat generated by the light source and the driver circuitry to maintain desired operating temperatures and thereby facilitate increased light output.

An integrated ceiling device includes a housing retaining an electronic assembly, a heat sink having a central opening, a light source coupled onto the heat sink, the housing is coupled with and disposed at least partly above the heat sink, and a central vertical axis of the housing aligns or is in proximity with the central opening of the heat sink.

The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.

The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.