F21V9/32

Lighting apparatus
11692683 · 2023-07-04 · ·

A lighting apparatus includes light emitting elements having an emission peak wavelength of 400 to 510 nm, a first phosphor having an emission peak wavelength of 485 to 700 nm, a second phosphor having an emission peak wavelength of 510 to 590 nm, a third phosphor having an emission peak wavelength of 600 to 700 nm, and a color filter having transmittance for light with a wavelength of 600 to 730 nm that is 80% or more and transmittance for light with a wavelength of 410 to 480 nm that is 3% or more and 50% or less. The color filter transmits a part of light emitted from the first phosphor, at least a part of light emitted from the second phosphor, and at least a part of light emitted from the third phosphor. Light transmitted through the color filter is emitted to the outside.

Wavelength conversion member, light source device, and method for manufacturing wavelength conversion member

A wavelength conversion member includes a ceramic fluorescent body for converting a wavelength of incident light, a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere, and a solder layer for joining together the ceramic fluorescent body and the heat radiation member. The solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body. The protruding portion is spaced apart from a side surface formed on the outer circumferential portion of the ceramic fluorescent body. In the solder layer, the maximum value of thickness of the protruding portion is greater than the average value of thickness of the joining portion.

Wavelength conversion member, light source device, and method for manufacturing wavelength conversion member

A wavelength conversion member includes a ceramic fluorescent body for converting a wavelength of incident light, a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere, and a solder layer for joining together the ceramic fluorescent body and the heat radiation member. The solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body. The protruding portion is spaced apart from a side surface formed on the outer circumferential portion of the ceramic fluorescent body. In the solder layer, the maximum value of thickness of the protruding portion is greater than the average value of thickness of the joining portion.

Optical module having multiple laser diode devices and a support member

A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.

Optical module having multiple laser diode devices and a support member

A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.

Wavelength conversion element and projection device
20220412536 · 2022-12-29 ·

A wavelength conversion element includes a wavelength conversion plate, a fixing ring and an adhesive layer. The wavelength conversion plate has a supporting surface. The fixing ring is disposed on the supporting surface. The adhesive layer is configured to adhere the fixing ring to the wavelength conversion plate. The adhesive layer includes a first adhesive portion and a second adhesive portion, and a density of the first adhesive portion is greater than a density of the second adhesive portion. A projection device including the aforementioned wavelength conversion element is also provided. The wavelength conversion element and the projection device provided by the invention have the advantages of short manufacturing process time and low cost.

Wavelength conversion element and projection device
20220412536 · 2022-12-29 ·

A wavelength conversion element includes a wavelength conversion plate, a fixing ring and an adhesive layer. The wavelength conversion plate has a supporting surface. The fixing ring is disposed on the supporting surface. The adhesive layer is configured to adhere the fixing ring to the wavelength conversion plate. The adhesive layer includes a first adhesive portion and a second adhesive portion, and a density of the first adhesive portion is greater than a density of the second adhesive portion. A projection device including the aforementioned wavelength conversion element is also provided. The wavelength conversion element and the projection device provided by the invention have the advantages of short manufacturing process time and low cost.

IMPROVED HEAT MANAGEMENT AND DEFICIENCY FOR HIGH INTENSITY LASER PUMPED LIGHT SOURCE

The invention provides a luminescent element (1000) comprising a solid luminescent body (100), wherein the solid luminescent body (100) comprises a luminescent material (200), wherein the luminescent material (200) is configured to generate luminescent material light (201) upon excitation with light having a wavelength where the luminescent material (200) is excitable, wherein the solid luminescent body (100) comprises luminescent body faces (120), wherein the luminescent element (1000) further comprises one or more reflective elements (300) associated to at least one luminescent body face (120), wherein the one or more reflective elements (300) are metallic, and wherein a surface coverage of the at least one luminescent body face (120) with the one or more reflective elements (300) is selected from the range of 5-40%.

IMPROVED HEAT MANAGEMENT AND DEFICIENCY FOR HIGH INTENSITY LASER PUMPED LIGHT SOURCE

The invention provides a luminescent element (1000) comprising a solid luminescent body (100), wherein the solid luminescent body (100) comprises a luminescent material (200), wherein the luminescent material (200) is configured to generate luminescent material light (201) upon excitation with light having a wavelength where the luminescent material (200) is excitable, wherein the solid luminescent body (100) comprises luminescent body faces (120), wherein the luminescent element (1000) further comprises one or more reflective elements (300) associated to at least one luminescent body face (120), wherein the one or more reflective elements (300) are metallic, and wherein a surface coverage of the at least one luminescent body face (120) with the one or more reflective elements (300) is selected from the range of 5-40%.

LIGHT SOURCE MODULE

A light source module includes at least one light-emitting element, a first optical layer, a penetrating light selection layer, a second optical layer, a light splitting layer, and a wavelength conversion layer. The light-emitting element is configured to provide a beam with a wavelength falling within a first wavelength band. An exit angle at which the beam exits the first optical layer is greater than an incident angle at which the beam is incident to the first optical layer. The penetrating light selection layer may allow light with a wavelength falls within a second wavelength band to pass through and has corresponding transmittance for light with a wavelength falling within the first wavelength band and is incident at different incident angles. An exit angle at which the beam exits the second optical layer is less than an incident angle at which the beam is incident to the second optical layer.