Provided is compatibility between adhesion to a substrate (lower layer) and durability improvement. An optical element includes a phosphor layer facing a lower layer, and a bonding layer keeping the phosphor layer in intimate contact with the lower layer. The phosphor layer includes an inorganic binder, and phosphor particle dispersed with the inorganic binder. The bonding layer includes an organic binder. The phosphor layer has a first surface facing the lower layer, a second surface opposite to the first surface, and a side surface connecting the first and second surfaces together. The bonding layer connects together the second surface, the side surface, and a surface of the lower layer to keep the phosphor layer in intimate contact with the lower layer.

A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; first and second prism array layers stacked with each other; a dichroic layer positioned between the first and second prism array layers and the plurality of light sources; and a wavelength conversion layer positioned between the first and second prism array layers and the dichroic layer.

A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; first and second prism array layers stacked with each other; a dichroic layer positioned between the first and second prism array layers and the plurality of light sources; and a wavelength conversion layer positioned between the first and second prism array layers and the dichroic layer.

A light emitting device includes first and second semiconductor laser elements, a base, a surrounding part, a wavelength converting member, and first and second wiring parts. The first laser element, the converting member and the second laser element are arranged in order in a first direction. At least one of the first and second laser elements is disposed between the first and second wiring parts in a second direction perpendicular to the first direction. An outermost periphery of the converting member is between a first imaginary line and a second imaginary line in the top view. The first and second imaginary lines are both parallel to the second direction. The first imaginary line passes through an outermost periphery in the first direction of the second laser element and the second imaginary line passes through an outermost periphery in a direction opposite to the first direction of the first laser element.

A light emitting device includes first and second semiconductor laser elements, a base, a surrounding part, a wavelength converting member, and first and second wiring parts. The first laser element, the converting member and the second laser element are arranged in order in a first direction. At least one of the first and second laser elements is disposed between the first and second wiring parts in a second direction perpendicular to the first direction. An outermost periphery of the converting member is between a first imaginary line and a second imaginary line in the top view. The first and second imaginary lines are both parallel to the second direction. The first imaginary line passes through an outermost periphery in the first direction of the second laser element and the second imaginary line passes through an outermost periphery in a direction opposite to the first direction of the first laser element.

A light source includes a plurality of light emitting elements, a light blocking member and a plurality of light-transmissive members. The light blocking member collectively supports the plurality of light emitting elements with the light blocking member being disposed in regions between the plurality of light emitting elements and in an outer periphery region located outwardly of the plurality of light emitting elements in a plan view. An upper surface of each of the plurality of the light emitting elements is exposed from the light blocking member. The plurality of light-transmissive members include a plurality of first light-transmissive members respectively disposed on the plurality of light emitting elements, and a second light-transmissive member disposed on the light blocking member in the outer periphery region.

Submersible lights including housings and a multilayer stack for pressure transfer are disclosed. A transparent pressure-bearing window, a window support structure, a circuit element populated with LEDs, and a pressure support structure may be mounted inside the housing. The support structure may be structured to bear at least some of the pressure applied to the transparent window from external pressure sources. The support structures may also be adapted to transfer thermal energy to an exterior environment such as sea water.

A light conversion package for a semiconductor light source includes a light conversion block, a substrate, and an interconnector. The light conversion block is positioned to receive incident light from the semiconductor light source and acts to convert the incident light to light having a different spectral distribution. The interconnector attaches the light conversion block to the substrate and limits a thermal resistance between the light conversion block and the substrate so that the substrate can efficiently sink heat from the light conversion block. The interconnector and the substrate together may still provide high reflectivity.

A light conversion package for a semiconductor light source includes a light conversion block, a substrate, and an interconnector. The light conversion block is positioned to receive incident light from the semiconductor light source and acts to convert the incident light to light having a different spectral distribution. The interconnector attaches the light conversion block to the substrate and limits a thermal resistance between the light conversion block and the substrate so that the substrate can efficiently sink heat from the light conversion block. The interconnector and the substrate together may still provide high reflectivity.

The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.