A method for soldering electronic components includes providing a circuit substrate; providing a plurality of electronic components; placing the plurality of electronic components onto the circuit substrate; applying a conductor between the plurality of electronic components and the circuit substrate; providing an energy source which projects an energy beam with a first coverage; enlarging the energy beam and projecting the energy beam onto the circuit substrate with a second coverage; and melting the conductor within the second coverage via the energy beam and fixing the corresponding electronic components on the circuit substrate through the melted conductor. Besides, a method for manufacturing a LED display is disclosed.

A method and apparatus for an adaptable vehicle light fixture is provided to activate varying light distribution patterns based upon preconfigured operation of trigger and/or power wires. One or more trigger and/or power wires connected to one or more vehicle light fixtures are preconfigured through wired and/or wireless programming to generate specified light distribution patterns that are responsive to the preconfigurations during manual operation. Wireless preconfiguration includes the use of a handheld magnetic device or smartphone. Wired preconfiguration includes the use of a vehicle-based controller area network (CAN) bus. Any preconfigured operation may be changed at any time by the user by programmably changing the preconfiguration.

An IMS printed circuit board comprises a card edge connector with a first face and a second face, the second face being in electric contact with the metallic core and the card edge connector comprising a plurality of signal traces. At least one of the signal traces is a ground trace which is in electrical connection with a ground connection of the printed circuit board and is intended to be connected to a ground pin comprised in a card edge connector socket. The IMS printed circuit board also provides a card edge connector socket with a plurality of pins, one of the pins being a ground pin and being configured to receive the ground trace of the printed circuit board. An electronic assembly comprises the printed circuit board and the card edge connector socket and a lighting device are also provided.

A solar lamp has illumination functionality and insect control functionality. The lamp has a main body comprising a main housing, a rechargeable battery housed within lamp for powering the electronic functions of the lamp, device electronics housed within the lamp for controlling the electronic functions of the lamp in a plurality of states comprising an OFF state and an ON state, and a support attached to the lamp, the support containing solar cells for harvesting solar energy and recharging the rechargeable battery and also for detecting a level of ambient light. A transparent panel is disposed at a front of the main body, the panel disposed over a printed circuit board (PCB) on which are disposed a plurality of high-power LEDs for illumination. One or more extension housings are attached to the main body, each extension housing containing an inner grid and an outer grid for electrocuting insects and one or more insect-attracting lights for emitting insect-attracting wavelengths of light. A manual electrical switch is disposed on the lamp for manually selecting a state from the plurality of states. The solar cells, rechargable battery, manual electrical switch, inner grid, outer grid, insect-attracting lights and high-power LEDs are electrically and operatively connected to the device electronics. When the OFF state is selected by the manual electrical switch, the inner grid, outer grid, insect-attracting lights and high-power LEDs are off. When the ON state is selected, the inner grid, outer grid, and insect-attracting lights are on, and if the solar cells are detecting a level of ambient light below a predetermined level, the high-power LEDs are also on.

A lighting device disclosed in an embodiment of the invention includes a substrate; a plurality of light emitting devices on the substrate; a first reflective layer on the substrate; a resin layer on the first reflective layer and including a first surface from which light emitted from the light emitting device is extracted; a second reflective layer on the resin layer; and a light extraction layer on the first surface of the resin layer, wherein the first surface of the resin layer has a convex portion having a convex exit surface facing to each of the light emitting devices, and concave portions between the convex portions, and the light extraction layer may include a first extraction portion having protrusions on each exit surface, and second extraction portions concave between the plurality of protrusions.

A flexible light emitting diode (LED) sheet operable to (i) produce light, (ii) enhance an amount of light and/or connected light-emitting diodes and/or sheets that can be daisy chained together, and (iii) lower wattage consumption. Lighting options include single color, color changing lighting, and pixel lighting.

Method for controlling the light distribution of a traffic route luminaire (1) in a network of luminaires, which is preferably also organized as a mesh network. The luminaire has a luminaire head having a settable light module and a controller, the light distribution of the luminaire being variable. The luminaire communicates luminaire data to at least one server, the luminaire data being luminaire-specific and including the installation location of the luminaire. The method comprises the steps of: —automatically allocating a light distribution to the luminaire (1) in accordance with the communicated luminaire data; —automatically setting the light module on the basis of the allocated light distribution; and determining, by said at least one server, a light distribution class of the traffic route luminaire on the basis of a traffic route topology (2,3,4,5,6).

According to the present disclosure, a support structure for lighting devices, e.g. LED lighting devices, is provided with an electrically insulating core layer having a first and a second mutually opposed surfaces, with mounting locations for electrically-powered light radiation sources on the first surface, a network of electrically conductive lines printed on said first surface, at least some of said electrically conductive lines extending between the mounting locations and fixed locations on the first surface, and electrical distribution lines of electrically conductive material on the second surface of the core layer, and electrically conductive vias extending through core layer and electrically coupling the electrical distribution lines on the second surface with the electrically conductive lines at said fixed locations on the first surface.

A light source device 100 includes a first substrate 10 having a first mounting surface 10a, a second substrate 11 having a second mounting surface 11a that opposes the first mounting surface, a first laser diode 30a directly or indirectly supported by the first mounting surface, a second laser diode 30b directly or indirectly supported by the first mounting surface, and a third laser diode 30c directly or indirectly supported by the second mounting surface. The emission point of the third laser diode is positioned between the emission point of the first laser diode and the emission point of the second laser diode in the width direction, and in a plan view, when viewed in the direction perpendicular to the first mounting surface, at least one the first laser diode and the second laser diode at least partially overlaps the third laser diode.

The invention relates to a lighting and/or signaling device including an electroluminescent diode and a lightguide adapted to convey the light from the diode and also means for securing the diode relative to an end of the lightguide to ensure the position of an inlet face of the guide opposite the diode. The lightguide carries male securing means adapted to interact with female securing means carried by a plastics component carrying the electroluminescent diode. The plastics component further includes electric circuits produced directly on the plastics of this component in immediate proximity to the diode.