A light cap electrical connection structure includes a driving board, a light cap body and a first electrode pin. The light cap body is a shell structure. One end of the first electrode pin is fixed on the light cap body and further including a socket. The socket is set on the driving board and includes a connection base and a first electrode. The first electrode is set on the connecting base and has a fixed end and a connecting end. The connecting end of the first electrode is an elastic structure. The other end of the first electrode pin is inserted into the light cap body and becomes an electrical connection in elastic contact with the connecting end of the first electrode. The light cap electrical connection structure has advantages of a simple structure and being easy to automate.

A smart home-care lighting system includes a lighting device having a portion that is light transmittable. The lighting device receives therein an illumination module for purpose of illumination, a detection module for detecting an outside environment, an alarm module and a sound effect module operable in combination with the detection module for indication and alarming, and an image pickup module for capturing and recording images. The lighting device also includes, arranged therein, a microprocessor and a main control module for transmitting and storing personal habits and health information. The device is arranged such that image can be captured in ranges that does not overlap to provide a surveillance range of 360-degree full view and operation can be made with the main control module for determination for proper action to be taken and may be used in combination with household appliances to construct a smart home-care system that benefit home members.

A color mixing light system comprises a pyramidal mirror assembly comprising three or more mirrors constructed and arranged in a pyramid structure and three or more color light sources. The pyramidal mirror assembly divides the light beams from the color light sources so that a first portion is reflected by the mirrors and a second portion extends beyond the mirrors to collectively form a multicolor pattern comprising plurality of overlapping color regions on a surface.

A lighting module may receive control signal having a first control scheme, the lighting module including a driver including at least one channel; and a control module; where the control module translates the received first control scheme into a predetermined second control scheme, when the first control scheme is different from the predetermined second control scheme; wherein the control module generates an identity voltage correlated with the received first control scheme; wherein the control module outputs to the driver a driver control signal including the predetermined second control scheme, and the identity voltage; and wherein the driver generates a driver output based on the identity voltage and the driver control signal.

Described are systems and methods for providing improved indoor reception of OTA (Over-the-Air) broadcast signals. The systems described include antenna systems with one or more network interfaces for providing a transport stream received by an antenna to a network.

A portable LED spotlight comprises a main light, a connecting frame, side light assemblies and a base is provided. Slots are formed in two sides of the connecting frame. Positioning pins are disposed at the bottoms of the slots. Mounting plates matched with the slots are disposed on the side light assemblies which are connected to the connecting frame through the mounting plates. Each mounting plate includes a connecting block. Grooves allowing the positioning pins to be clamped in the each mounting plate are formed in the connecting blocks. Contacts are disposed on two sides of the grooves. A rotary knob is disposed on the base.

A light tube with wire guide includes a hollowed tube body, two caps, a wire guide, and a plurality of wires. The two caps respectively cover two ends of the hollowed tube body. The wire guide is located at an outer side wall of one of the two caps. The wire guide includes a guiding slot communicating with the hollowed tube body. The wires are disposed in the wire guide and extended along the guiding slot. One ends of the wires are located in the hollowed tube body or located in one of the two caps, and the other ends of the wires extend to the guiding slot and are exposed out of the hollowed tube body.

A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes a plurality of electrodes that each corresponds to a contact on the substrate. The plurality of electrodes are exposed to one or more laser beams for coupling the LED chip to the substrate. The laser beams may be directed to one or more edges or corners of the plurality of electrodes, where the edges or corners lie outside emission areas of LEDs on the LED chip.

The present disclosure describes light systems in which the intensity of base color LEDs configured to emit light within a target color region is increased using additional white LEDs and the emitted light is filtered so that a dominant portion of light passing through the filter at a particular viewing angle is within the target color region. The present disclosure also describes methods for forming a printed circuit board with an integral heat sink arrangement by depositing additional solder on solder pads that are not used to connect electronic components so that the additional solder acts as a heat sink.

A circuit board having a high reflectivity includes a wiring board, a first solder resist layer, and a second solder resist layer. The wiring board includes a wiring layer on an outer side, the wiring layer including wiring and a bond pad spaced from the wiring. The first solder resist layer, with opening and groove, covers the wiring layer, the bond pad is exposed from the opening but spaced from the first solder resist layer. The second solder resist layer infills the groove and covers the first solder resist layer but does not make contact with the mounting surface of the bond pad. A method for manufacturing such circuit board is also disclosed.