The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.

The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.

The present invention relates to the field of LED illumination, particularly to a high power LED illuminant based on heat pipe principle. The high power LED illuminant comprises a light emitting section, a liquid storing section with liquid electric-insulation-operating-medium stored therein and a heat sink. The liquid electric-insulation-operating-medium is drawn into the light emitting section by means of capillary force and then immerses the LED chips and thus directly cools down the LED chips. The electric-insulation-operating-medium takes in heat and turns into gas and then flows into the liquid storing section through capillary channels. The heat sink is used to cool down the electric-insulation-operating-medium so that it turns into liquid. When the LED chips generate heat during its operation, the electric-insulation-operating-medium flows into the heat sink after turning into gas by absorbing heat. The electric-insulation-operating-medium turns into liquid after giving out heat through the heat sink. By means of such a cycle, the heat generated by LED chips is so transferred away via the electric-insulation-operating-medium that the temperature of the LED chips is kept within the temperature range of gaseous electric-insulation-operating-medium. In this way, the lifespan of the LED chips is extended consequently and the luminous efficiency is enhanced as well.

The present invention relates to the field of LED illumination, particularly to a high power LED illuminant based on heat pipe principle. The high power LED illuminant comprises a light emitting section, a liquid storing section with liquid electric-insulation-operating-medium stored therein and a heat sink. The liquid electric-insulation-operating-medium is drawn into the light emitting section by means of capillary force and then immerses the LED chips and thus directly cools down the LED chips. The electric-insulation-operating-medium takes in heat and turns into gas and then flows into the liquid storing section through capillary channels. The heat sink is used to cool down the electric-insulation-operating-medium so that it turns into liquid. When the LED chips generate heat during its operation, the electric-insulation-operating-medium flows into the heat sink after turning into gas by absorbing heat. The electric-insulation-operating-medium turns into liquid after giving out heat through the heat sink. By means of such a cycle, the heat generated by LED chips is so transferred away via the electric-insulation-operating-medium that the temperature of the LED chips is kept within the temperature range of gaseous electric-insulation-operating-medium. In this way, the lifespan of the LED chips is extended consequently and the luminous efficiency is enhanced as well.

The disclosure described herein is directed to an in-grade lighting fixture with improved heat dissipation that provides greater flexibility in servicing, replacing, or installing internal components within the fixture. The in-grade lighting fixture comprises features to assist in dissipating heat generated by light sources, such as LEDs, and/or other electronic components to optimize performance and allow for increased output power for the light sources. The disclosure uses a heat sink assembly that is in thermal communication with the in-grade lighting fixture in order to dissipate heat within the lighting fixture out to the ambient, which optimizes performance and allows for increased output power for the light source.

A light fixture includes a circuit board having a plurality of light-emitting elements, and a plurality of collimators positioned adjacent the circuit board. Each of the collimators includes a first end positioned adjacent one of the light-emitting elements, a second end, and an interior wall extending between the first end and the second end. The wall is curved to internally reflect the light output of the associated light-emitting element and focus the light through the second end and provide a light distribution. The light fixture further includes a beam controlling optic positioned adjacent the second end of the plurality of collimators to modify the light output from the plurality of collimators to provide a modified light distribution.

A method is provided for removing a light-emitting diode (LED) module from a luminaire that has a controller and a housing. The housing encloses an optical system that includes the LED module and other optical devices. The method includes electrically uncoupling an LED circuit board of the LED module from the controller. The method further includes mechanically uncoupling the LED module from the luminaire without removing other optical devices of the optical system from the housing.

A method is provided for removing a light-emitting diode (LED) module from a luminaire that has a controller and a housing. The housing encloses an optical system that includes the LED module and other optical devices. The method includes electrically uncoupling an LED circuit board of the LED module from the controller. The method further includes mechanically uncoupling the LED module from the luminaire without removing other optical devices of the optical system from the housing.

A runway-embedded flash lighting device, includes a body configured to be embedded in a runway; a ceiling member including a flash emission window and disposed in an upper opening of the body and configured to be exposed to a runway surface when the body is embedded in the runway; a light guide member disposed in the flash emission window; an LED flash light source disposed inside the body and configured to emit a flash toward the light guide member; and a heat conducting member, wherein the light guide is configured to allow the flash emitted from the LED flash light source to be emitted from the flash emission window , the heat conducting member is disposed inside the body and includes a first part in contact with the LED flash light source, and a second part in contact with the ceiling member.

A runway-embedded flash lighting device, includes a body configured to be embedded in a runway; a ceiling member including a flash emission window and disposed in an upper opening of the body and configured to be exposed to a runway surface when the body is embedded in the runway; a light guide member disposed in the flash emission window; an LED flash light source disposed inside the body and configured to emit a flash toward the light guide member; and a heat conducting member, wherein the light guide is configured to allow the flash emitted from the LED flash light source to be emitted from the flash emission window , the heat conducting member is disposed inside the body and includes a first part in contact with the LED flash light source, and a second part in contact with the ceiling member.