The light fixture connects a separable cage to a that may directly mount to the wall of a structure or which may mount to the structure through a wall plate. The cage has a frame with a roof and an open rear side that receives the backplate. A lighting assembly is connected to the front face of the backplate and is thereby housed within the interior of the cage when the unit is assembled and which can be accessed when the cage is removed. To removably attach the cage to the backplate, an aperture is provided within a ledge in the backplate that receives a tab to suspend the cage from the backplate fixedly connected to the supporting structure. Thus, the lighting assembly can be accessed by separating the cage from the backplate.

The light fixture connects a separable cage to a that may directly mount to the wall of a structure or which may mount to the structure through a wall plate. The cage has a frame with a roof and an open rear side that receives the backplate. A lighting assembly is connected to the front face of the backplate and is thereby housed within the interior of the cage when the unit is assembled and which can be accessed when the cage is removed. To removably attach the cage to the backplate, an aperture is provided within a ledge in the backplate that receives a tab to suspend the cage from the backplate fixedly connected to the supporting structure. Thus, the lighting assembly can be accessed by separating the cage from the backplate.

A luminaire comprising a heat spreader and a heat sink disposed around and thermally communicates with the heat spreader. The heat sink forms a trim plate configured to be disposed completely external of a can light fixture or an electrical junction box. The luminaire also includes an optic securely retained relative to one of the heat spreader and the heat sink on one side of a plane defined by a lower surface of the trim plate and extends to the other side of the plane defined by the lower surface of the trim plate, as well as a light source disposed on the heat spreader and comprising a plurality of light-emitting diodes (LEDs). The plurality of LEDs are positioned entirely on one side of the plane defined by the lower surface of the trim plate. The light source is in thermal communication with the heat spreader.

The disclosure discloses a light source module of a luminaire including a light source board, a heat dissipating component, a first sleeving component, and a second sleeving component, wherein the heat dissipating component includes a mounting base portion; the second sleeving component is sleeved on the first sleeving component and presses the light source board on the mounting base portion; the light source board includes illuminators; the first sleeving component has an avoidance space, and the illuminators are located in the avoidance space; and at least a region, opposing to the illuminators, of the second sleeving component is a light transmission region.

The disclosure discloses a light source module of a luminaire including a light source board, a heat dissipating component, a first sleeving component, and a second sleeving component, wherein the heat dissipating component includes a mounting base portion; the second sleeving component is sleeved on the first sleeving component and presses the light source board on the mounting base portion; the light source board includes illuminators; the first sleeving component has an avoidance space, and the illuminators are located in the avoidance space; and at least a region, opposing to the illuminators, of the second sleeving component is a light transmission region.

A light source unit disclosed in an embodiment includes a first cover which has an open region; a second cover which is coupled to the first cover; a light source module which is disposed between the first cover and the second cover, and has a light-emitting device disposed on the open region and a circuit board on which the light-emitting device is disposed; a fixing frame which is disposed between the second cover and the circuit board; and a resin member which is filled in an region between the first cover and the second cover and supports the light source module and the fixing frame. The light source module includes a moisture-proof film which covers an upper surface and side surfaces of the light-emitting device and extends to an upper surface of the circuit board.

A method for automatically producing LED lamp cap, including: leading a heat sink base out to an outlet of a first feeding device; leading a reflection bowl to an outlet of a lead-out rail of a second feeding device; feeding, by a third feeding device, a LED lamp bead to a clamping block; feeding a bottom cover into a feeding pipe of a fourth feeding device; feeding a lamb tube to a lamp tube feeding pipe; dispensing a glue in a mounting groove of the heat sink base; pushing the LED lamp wick into the mounting groove; feeding the reflection bowl to a mounting surface of the heat sink base; and allowing the bottom cover to abut against an end of the heat sink base and allowing a lead wire to be clamped in a notch of the heat sink base and an opening of the bottom cover.

A method for automatically producing LED lamp cap, including: leading a heat sink base out to an outlet of a first feeding device; leading a reflection bowl to an outlet of a lead-out rail of a second feeding device; feeding, by a third feeding device, a LED lamp bead to a clamping block; feeding a bottom cover into a feeding pipe of a fourth feeding device; feeding a lamb tube to a lamp tube feeding pipe; dispensing a glue in a mounting groove of the heat sink base; pushing the LED lamp wick into the mounting groove; feeding the reflection bowl to a mounting surface of the heat sink base; and allowing the bottom cover to abut against an end of the heat sink base and allowing a lead wire to be clamped in a notch of the heat sink base and an opening of the bottom cover.

Methods and devices are described. A device includes an optical carrier part and a heatsink bulk part. The optical carrier part has an LED mounting area configured to receive an LED and an alignment feature configured for aligning with an optical component. The heatsink bulk part is separate from the optical carrier part and joined to the optical carrier part, such that the optical carrier part and the heatsink bulk part in conjunction are configured to perform a thermal management of an LED module, including the LED, and the heatsink bulk part, in operation.

Methods and devices are described. A device includes an optical carrier part and a heatsink bulk part. The optical carrier part has an LED mounting area configured to receive an LED and an alignment feature configured for aligning with an optical component. The heatsink bulk part is separate from the optical carrier part and joined to the optical carrier part, such that the optical carrier part and the heatsink bulk part in conjunction are configured to perform a thermal management of an LED module, including the LED, and the heatsink bulk part, in operation.