The present disclosure proposes an LED lamp with omnidirectional heat dissipation, which includes an LED lamp housing including a power supply component inside, and a heat sink supporting an LED chip. The LED lamp housing and the heat sink are separated by a heat insulation member to block thermal influence between each other. The LED lamp of the present disclosure adds a heat insulation plate between the LED lamp housing for placing the power supply component and the heat sink, to block and weaken the mutual influence between the heat generated by the LED chip and the heat generated by the power supply component. The design improves the problem of excessively high ambient temperature inside the power supply cavity of the traditional LED lamps, effectively avoids damage to the power supply device due to long-term working in a high-temperature environment, and improves the service life of the LED lamp.

Provided is a lighting apparatus that is suitable as a substitute for a conventional halogen lamp when positively utilizing leaked light. The lighting apparatus comprises: a heat dissipator 12 that is in one of a bottomed cylindrical shape and a bowl shape, and that has a bottom portion, a circumferential wall portion, and an opening; and a light-emitting device 18b that is provided inside the heat dissipator 12 at the bottom portion and is operable to emit light, wherein the heat dissipator 12 has one or more windows 19 for leaking the emitted light outside the heat dissipater 12.

A light source includes a socket connection, a base connected to the socket connection, an LED unit, a mount and a heat conductive material. The socket connection is capable of connecting to a source of electricity. The mount is disposed into the base, and has a top surface on which the LED unit are disposed and a side surface devoid of the LED unit. The heat conductive material directly contacts the LED unit and the side surface of the mount. The heat conductive material enters into a space flanked by the mount and the base and is substantially translucent or transparent such that light emitted from the LED unit is able to pass through the heat conductive material.

A LED light that is configured to provide heat dissipation so as to allow the light to accept a higher input current so as to increase the amount of light generation. The LED light includes a body wherein the body has a wall. The wall defines the shape of the body and the body further has an interior volume. The interior volume extends between a first end and second end of the body. A LED filament is centrally disposed within the interior volume of the body and extends between the first end and second end. The interior volume is filled with a fill material wherein the fill material has a thermal conductivity that promotes heat dissipation from the body. The fill material is a transparent material so as to not interfere with the light production of the light.

A light source cooling body (100), a light source assembly, a luminaire and a method to manufacture a light source cooling body or a light source assembly are provided. The light source cooling body comprises a homogeneous body (104) made of a thermally conductive material. The homogenous body comprises an open space that comprises a wick structure, a condenser (112) and an evaporator (116). Near the evaporator the light source cooling body has an interface area (102) to thermally couple with a light source and to receive heat from the light source. The condenser is arranged away from the interface area. A portion 114 of the open space is tubular shaped. The open space may hold a cooling liquid partially in the gaseous phase and partially in the liquid phase and the wick structure is configured to transport the cooling material in the liquid phase towards the evaporator.

The present disclosure provides a PCB board, a manufacturing method of a PCB board, and an electrical device, where the PCB board includes an insulating dielectric layer which is a glass substrate layer including a top surface and a bottom surface disposed oppositely; a conductive wiring layer which is disposed on a top surface of the insulating dielectric layer; and a top ink layer which is coated on the conductive wiring layer. According to the technical solution provided by the embodiment of the disclosure, the PCB board does not generate the phenomenon of deformation warping, and the conductive wiring layer is not easily peeled off from the insulating medium layer, and the use performance of the PCB board is good.

A phosphor element includes a phosphor part including an incident face of the excitation light, opposing face opposing the incident face, and side face, the phosphor part converting at least a part of the excitation light incident onto the incident face to fluorescence and emitting the fluorescence from the opposing face or incident face, and a heat dissipating substrate provided on the side face of the phosphor part. The heat dissipating substrate is composed of a metal plating film composed of a metal having a thermal conductivity of 200 W/mK or higher.

The present disclosure relates to a lighting fixture that is configured to transfer heat that is generated by a light source and any associated electronics toward the front of the lighting fixture. The lighting fixture includes a heat spreading cup that is formed from a material that efficiently conducts heat and a light source that is coupled inside the heat spreading cup. The heat spreading cup has a bottom panel, a rim, and at least one sidewall extending between the bottom panel and the rim. The light source is coupled inside the heat spreading cup to the bottom panel and configured to emit light in a forward direction through an opening formed by the rim. Heat generated by the light source during operation is transferred radially outward along the bottom panel and in a forward direction along the at least one sidewall toward the rim of the heat spreading cup.

An LED lighting fixture includes a housing; a substrate located within the housing; a plurality of LED groups of various colors mounted on the substrate, each LED color group including multiple LED components; at least one circuit communicating with a power supply and adapted for powering the LED components; and an optical component located at an output end of the housing. The LED components are arranged along first and second directions orthogonal to one another, such that no two LED of the same color reside adjacent one another along both of the first and second directions, and each LED component is spaced-apart from an adjacent LED component a distance no greater than 1.0 mm.

An LED lighting device provided by this application includes: a light source carrier, configured to carry an LED light source module; and at least one circuit carrier, configured to carry a circuit electrically connected to the LED light source module. The light source carrier and the circuit carrier are both made of a ceramic material and have an extremely high insulation coefficient and thermal conductivity.