A luminaire comprising a housing formed of thermally conductive polymer with an optic carried thereby, a trim carried by the optic, and a light source. The light source may comprise an LED board comprising a copper layer and a plurality of light emitting diodes (LEDs) disposed on the LED board. The luminaire may also comprise control circuitry operably coupled to the plurality of LEDs, wherein the LED board is positioned in thermal communication with the housing. The luminaire may further comprise a mounting member configured to be attached to each of the housing and an external structure. The control circuitry may be configured to operate the plurality of LEDs such that heat generated by the plurality of LEDs is dissipated by the copper layer of the LED board.

A heat dissipation light ring that includes a light source board, a heat transferred layer and an insulating layer. The insulating layer is set outside of the heat transferred layer. The heat transferred layer includes heat conductive part and heat transferred part. The heat conductive part is related to the light source board with heat and set tilted compared with the heat conductive part. The heat dissipation light ring includes heat transferred wall. One end of the heat transferred wall is related to heat conductive part with heat, and the other end of the transferred wall is related to heat transferred part. The insulating layer is set outside of the heat transferred layer and heat transferred wall. The heat dissipation light ring owns the advantage of the high thermal efficiency.

A heat dissipation light ring that includes a light source board, a heat transferred layer and an insulating layer. The insulating layer is set outside of the heat transferred layer. The heat transferred layer includes heat conductive part and heat transferred part. The heat conductive part is related to the light source board with heat and set tilted compared with the heat conductive part. The heat dissipation light ring includes heat transferred wall. One end of the heat transferred wall is related to heat conductive part with heat, and the other end of the transferred wall is related to heat transferred part. The insulating layer is set outside of the heat transferred layer and heat transferred wall. The heat dissipation light ring owns the advantage of the high thermal efficiency.

This document describes techniques directed to active thermal-control of a floodlight and associated floodlights. As described, an example floodlight includes a first heat-transfer subsystem that uses a fully enclosed heat sink to transfer heat from an array of LEDs to a first housing component of the floodlight. The floodlight further includes a second heat-transfer subsystem to transfer heat from one or more PSUs to a second housing component of the floodlight. Described techniques include using thermistors located throughout the floodlight to actively monitor a temperature profile within the floodlight and, if one or more operating-temperature thresholds are violated, reducing power consumption within the floodlight.

This document describes techniques directed to active thermal-control of a floodlight and associated floodlights. As described, an example floodlight includes a first heat-transfer subsystem that uses a fully enclosed heat sink to transfer heat from an array of LEDs to a first housing component of the floodlight. The floodlight further includes a second heat-transfer subsystem to transfer heat from one or more PSUs to a second housing component of the floodlight. Described techniques include using thermistors located throughout the floodlight to actively monitor a temperature profile within the floodlight and, if one or more operating-temperature thresholds are violated, reducing power consumption within the floodlight.

A lamp is disclosed, which has a lamp housing, having an end wall and a side wall, a lighting means device arranged in a housing interior having a lighting means carrier and at least one lighting means arranged thereon, an insulation component formed from an electrically insulating material having a main portion and an edging portion, wherein the main portion is arranged between the end wall and the lighting means device and wherein the edging portion extends from the main portion in such a way that the edging portion is arranged between the lighting means device and the side wall of the lamp housing.

A lamp is disclosed, which has a lamp housing, having an end wall and a side wall, a lighting means device arranged in a housing interior having a lighting means carrier and at least one lighting means arranged thereon, an insulation component formed from an electrically insulating material having a main portion and an edging portion, wherein the main portion is arranged between the end wall and the lighting means device and wherein the edging portion extends from the main portion in such a way that the edging portion is arranged between the lighting means device and the side wall of the lamp housing.

A heat insulation structure of one embodiment of the present disclosure includes: a heat source; a heat insulating member surrounding the heat source and having an opening; and a shape retaining member retaining a shape of the heat insulating member.

A heat insulation structure of one embodiment of the present disclosure includes: a heat source; a heat insulating member surrounding the heat source and having an opening; and a shape retaining member retaining a shape of the heat insulating member.

This application relates to an incandescent bulb-type LED lamp having a heat dissipation function. In one aspect, the LED lamp includes a globe forming an external shape of the lamp, and an LED module supported by a stem in which a gas injection portion is formed and installed inside the globe. The LED lamp may also include a power supply unit for supplying power to the LED module, and a base bonded to one side of the globe and connected to a socket to supply commercial power to the power supply unit. The LED lamp may further include a heat conduction member filled in an internal space formed by an inner surface of the base and a printed circuit board (PCB) of the power supply unit and configured to dissipate heat generated from the LED module and the power supply unit to the outside through the base.