A method for a refrigeration system includes applying, by a gas cooler of the refrigeration system, a first cooling stage to refrigerant circulating through the refrigeration system load. The method further comprises applying, by a heat exchanger located downstream from the gas cooler, a second cooling stage to the refrigerant, wherein the second cooling stage removes heat from the refrigerant, and applying, by the heat exchanger located downstream from the gas cooler, the heat removed during the second cooling stage to a water heating system operable to heat water.

A panel, for retaining a heating or cooling tube relative to a substrate, has a standoff extending from a primary flap, wherein the standoff includes a tube contacting surface. A lateral fold extends from the standoff and includes a jaw having a tube retaining surface, wherein the tube contacting surface and the tube retaining surface are located to define a tube retaining channel in a closed position of the jaw. The panel can be formed of a single piece of sheet metal, wherein the sheet metal and configuration of the panel bias the jaw to the closed position.

A control system for a heating system, including a blending valve configured to be connected to a heat source and a heating circuit conduit. The blending valve is configured to mix a heating water supply with the return flow from the heating circuit and supply the mixed water to the heating circuit. The blending valve has a first temperature threshold corresponding to the desired operating temperature of the heating circuit and a second temperature threshold that is substantially lower than the return temperature. An actuator is provided the switches the blending valve to the first temperature threshold to activate the heating circuit and to the second temperature circuit to deactivate the heating circuit. The actuator is connected to the pump and operates the pump when activating the heating circuit.

A support structure for a heating or cooling system includes a plurality of projections designed to be capable of retaining one or more thermal elements positioned adjacent thereto. The projections are positioned so as to form a first set of substantially parallel undulating channels, each channel having one of the projections forming at least a part of the inner radius of each undulation, with each projection having a recess formed in a side wall thereof facing said channel. The undulations of the channel ensure that a thermal element positioned in the channel will make contact with the projections each time it has to bend around one, without requiring spacing of the projections to squeeze the thermal element. The thermal element can thus be held securely without any play (unwanted lateral movement) in a channel that is slightly wider than the thermal element. Recesses in the channels at the contact points also restrict movement in the vertical direction, thus preventing the thermal element from popping out of the channel, while not requiring any restriction narrower than the thermal element.

A method for providing an electrical connection for conductive ink includes direct writing a bus bar onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit. An aircraft heated floor panel includes at least one floor panel of an aircraft. The one floor panel includes a conductive circuit having a conductive ink including a bus bar directly written onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit.

A method of forming a heating element includes depositing a conductive ink of silver particles in an epoxy resin on a dielectric film to create a conductive circuit, and heat curing the conductive circuit to achieve a resistivity of the heating element less than 1.6810.sup.6 ohm.Math.meter. An aircraft heated floor panel includes at least one floor panel of an aircraft includes a conductive circuit positioned within the floor panel having a conductive ink of silver particles in an epoxy resin on a dielectric film.