A water heater includes a water tank having an inlet and an outlet, and a flue extending through the tank. A nozzle is positioned near a first end of the flue, arranged so as to emit a fuel stream into the flue, and a flame holder is located within the flue in a position to receive the fuel stream and to hold a flame entirely within the flue. A controller variably controls a flow of fuel to the nozzle according to a temperature of water in the tank.

A temperature controller is provided, which includes a first temperature sensor, a heater, a logic circuit, a watchdog circuit and a second temperature sensor. The first temperature sensor may detect the environmental temperature. The heater may be turned on after the temperature controller is turned on. The logic circuit may turn on the watchdog circuit after the environmental temperature is higher than the first temperature for the watchdog circuit to keep detecting whether the main circuit of an electronic device is turned on until the main circuit is turned on. The second temperature sensor may be turned on after the main circuit is turned on and then detect the environmental temperature. The logic circuit may turn off the heater after the second temperature sensor detects the environmental temperature is higher than a second temperature, or turn on the heater when the environmental temperature is lower than a third temperature.

An on-demand hot water dispenser includes a housing, a water heating system received in the housing, and a faucet connected to the water heating system through the housing for dispensing hot water into a container. A drip tray is positioned below the faucet and a screen covers the drip tray to support the container during dispensing of the hot water.

The present description discloses a combustion type water heater that heats water by burning fuel. The combustion type water heater includes: a burner that generates combustion gas by burning the fuel; a heat exchanger that exchanges heat between the water passing through on an inside of the heat exchanger and the combustion gas flowing on an outside of the heat exchanger, an exhaust pipe that discharges the combustion gas after the heat exchange in the heat exchanger as exhaust gas; an exhaust gas temperature detector that detects a temperature of the exhaust gas flowing in the exhaust pipe as an exhaust gas temperature; a clog degree detector that detects a degree of clog in the exhaust pipe; and a scale buildup determiner that determines whether or not scale has built up inside the heat exchanger based on the exhaust gas temperature and the degree of clog in the exhaust pipe.

A column-conditioning enclosure includes a column chamber adapted to hold one or more chromatography separation columns. A duct system provides an airflow path around the column chamber such that the one or more chromatography separation columns held within the column chamber are isolated from the airflow path. An air mover disposed in the airflow path generates a flow of air within the duct system. A heat exchanger system disposed in the airflow path near the air to exchange heat with the air as the air flows past the heat exchanger system. The air circulates through the duct system around the column chamber, convectively exchanging heat with the column chamber to produce a thermally conditioned environment for the one or more chromatography separation columns held within the column chamber.

A heater system includes a heater bundle and a power supply device. The heater bundle includes a plurality of heater assemblies and a plurality of power conductors. The heater assembly includes a plurality of heater units, each heater unit defining at least one independently controlled heating zone. The power conductors are electrically connected to each of the independently controlled heating zones in each of the heater units. The power supply device is configured to modulate power to each of the independently controlled heater zones of the heater units through the power conductors.

The present invention relates to a heating system component, including a carrier unit having a dry side, a wet side, a groove provided on the dry side, and a medium leading section at least partially opposite a medium flow area on the wet side; a heating unit at least partially received in the groove; a heat conducting plate assembly that comprises a first heat capturing plate portion that is thermally coupled to the heating unit, a second heat capturing plate portion that is thermally coupled to the medium leading section of the carrier unit, a first heat releasing plate portion, and a second heat releasing plate portion; at least one printed circuit board comprising circuitry with a first sensor area and a second sensor area, wherein the circuitry is configured to sense a first temperature at the first sensor area and a second temperature at the second sensor area; a housing accommodating at least a part of the printed circuit board and at least a part of the heat conducting plate assembly in such a way that the first sensor area is thermally coupled to the first heat releasing plate portion and the second sensor area is thermally coupled to the second heat releasing plate portion.

The present invention relates to a heating system component, including a carrier unit having a dry side, a wet side, a groove provided on the dry side, and a medium leading section at least partially opposite a medium flow area on the wet side; a heating unit at least partially received in the groove; a heat conducting plate assembly that comprises a first heat capturing plate portion that is thermally coupled to the heating unit, a second heat capturing plate portion that is thermally coupled to the medium leading section of the carrier unit, a first heat releasing plate portion, and a second heat releasing plate portion; at least one printed circuit board comprising circuitry with a first sensor area and a second sensor area, wherein the circuitry is configured to sense a first temperature at the first sensor area and a second temperature at the second sensor area; a housing accommodating at least a part of the printed circuit board and at least a part of the heat conducting plate assembly in such a way that the first sensor area is thermally coupled to the first heat releasing plate portion and the second sensor area is thermally coupled to the second heat releasing plate portion.

A heat plate for a humidifier contains a thermally conductive plate having a top surface and a bottom surface opposite the top surface. A temperature sensor is affixed to the bottom surface and a thermally conductive layer is directly-affixed to the bottom surface. A ceramic heating element is directly affixed to the thermally conductive layer. A humidifier and medical device may also contain such a heater plate.

A heat plate for a humidifier contains a thermally conductive plate having a top surface and a bottom surface opposite the top surface. A temperature sensor is affixed to the bottom surface and a thermally conductive layer is directly-affixed to the bottom surface. A ceramic heating element is directly affixed to the thermally conductive layer. A humidifier and medical device may also contain such a heater plate.