A product includes a highly adsorptive structure comprising: a substrate, wherein the substrate comprises a plurality of microchannels; and a carbon aerogel adhered to the substrate. The carbon aerogel is characterized by having physical characteristics of in situ formation on the substrate. Moreover, An adsorptive cooling system includes: a first highly adsorptive structure positioned to receive thermal energy from a thermal energy source, the first highly adsorptive structure comprising: a first substrate; and a first carbon aerogel adhered to the first substrate; a second highly adsorptive structure positioned to receive thermal energy from the thermal energy source, the second highly adsorptive structure comprising: a second substrate; and a second carbon aerogel adhered to the second substrate. The first substrate and/or the second substrate independently comprise a plurality of microchannels.

A highly adsorptive structure includes: a substrate; and a metal-organic framework (MOF) comprising a plurality of metal atoms coordinated to a plurality of organic spacer molecules; wherein the MOF is coupled to at least one surface of the substrate, wherein the MOF is configured to adsorb and desorb a refrigerant under predetermined thermodynamic conditions. The refrigerant includes one or more materials selected from the group consisting of: acid halides, alcohols, aldehydes, amines, chlorofluorocarbons, esters, ethers, fluorocarbons, perfluorocarbons, halocarbons, halogenated aldehydes, halogenated amines, halogenated hydrocarbons, halomethanes, hydrocarbons, hydrochlorofluorocarbons, hydrofluoroethers, hydrofluoroolefins, inorganic gases, ketones, nitrocarbon compounds, noble gases, organochlorine compounds, organofluorine compounds, organophosphorous compounds, organosilicon compounds, oxide gases, refrigerant blends and thiols.

An adsorptive cooling system includes: a first highly adsorptive structure positioned to receive thermal energy from a thermal energy source, the first highly adsorptive structure including: a first substrate; and a first carbon aerogel adhered to the first substrate, a second highly adsorptive structure positioned to receive thermal energy from the thermal energy source, the second highly adsorptive structure including: a second substrate; and a second carbon aerogel adhered to the second substrate, a cooling unit; and a circulation system adapted for circulating the refrigerant from at least one of the first highly adsorptive structure and the second highly adsorptive structure to the cooling unit to provide cooling from the thermal energy source and to return the refrigerant from the cooling unit to at least one of the first highly adsorptive structure and the second highly adsorptive structure.

A highly adsorptive structure includes: a substrate; and a carbon aerogel adhered to the substrate, wherein the carbon aerogel is characterized by having physical characteristics of in-situ formation on the substrate, and wherein the carbon aerogel is configured to selectively adsorb and desorb one or more refrigerants selected from the group consisting of: acid halides, alcohols, aldehydes, amines, chlorofluorocarbons, esters, ethers, fluorocarbons, perfluorocarbons, halocarbons, halogenated aldehydes, halogenated amines, halogenated hydrocarbons, halomethanes, hydrocarbons, hydrochlorofluorocarbons, hydrofluoroethers, hydrofluoroolefins, inorganic gases, ketones, nitrocarbon compounds, noble gases, organochlorine compounds, organofluorine compounds, organophosphorous compounds, organosilicon compounds, oxide gases, refrigerant blends and thiols.

A highly adsorptive structure, includes: a substrate; and a metal-organic framework (MOF) comprising a plurality of metal atoms coordinated to a plurality of organic spacer molecules; wherein the MOF is coupled to at least one surface of the substrate, wherein the MOF is adapted for adsorbing and desorbing a refrigerant under predetermined thermodynamic conditions. The refrigerant includes one or more materials selected from the group consisting of: acid halides, alcohols, aldehydes, amines, chlorofluorocarbons, esters, ethers, fluorocarbons, perfluorocarbons, halocarbons, halogenated aldehydes, halogenated amines, halogenated hydrocarbons, halomethanes, hydrocarbons, hydrochlorofluorocarbons, hydrofluoroethers, hydrofluoroolefins, inorganic gases, ketones, nitrocarbon compounds, noble gases, organochlorine compounds, organofluorine compounds, organophosphorous compounds, organosilicon compounds, oxide gases, refrigerant blends and thiols.

Systems and methods for compressor-assisted sorption rate. A sorption system includes a sorber that absorbs and desorbs a refrigerant gas, such as ammonia, onto and from a coordinative complex compound. The system includes an evaporator, a condenser, and a compressor. The temperature and pressure of the gas within the sorber are monitored and the compressor is controlled to adjust the pressure to increase the absorption and desorption rates and enhance the thermal cycle speed of the sorption system for applications such as laser systems requiring rapid, periodic cooling.

Systems and methods of continuous cooling at cryogenic temperatures. One exemplary aspect involves a refrigeration system that includes: a chamber adapted to hold liquid and gaseous coolant received from a cooling pot; a first adsorption pump having an inlet end in fluid communication with the chamber, the first adsorption pump configured to capture gas from the liquid and gaseous coolant when the first adsorption pump is enabled; a second adsorption pump having an inlet end in fluid communication with the chamber, the second adsorption pump configured to capture gas from the liquid and gaseous coolant when the second adsorption pump is enabled; a means for desorbing the gas captured by the first adsorption pump; and a means for desorbing the gas captured by the second adsorption pump.

Technologies are described herein for adsorbent-based cooling systems. A cooling system is described that allows for the refrigerant to be adsorbed into the adsorbent to prevent the freezing of the refrigerant.

A cooling system is provided and includes a compressor, an expansion valve, a gas cooler through which a refrigerant received from the compressor passes toward the expansion valve in a supercritical state, an evaporator interposed between the expansion valve and the compressor and a vapor sorption subcooling system. The vapor sorption subcooling system includes a desorber disposed to remove heat from refrigerant flowing from the gas cooler toward the expansion valve.

The present invention concerns a method of refrigerating a housing to a target temperature according to which: an evaporator is placed in said housing; said evaporator is placed in fluid communication with a thermochemical reactor Ri, simultaneously, the heat produced at said reactor Ri is evacuated;

Characteristically, at least n>1 other thermochemical reactors are provided; I) the pressure Pevi in said evaporator after it is placed in fluid communication with said thermochemical reactor Ri, and the temperature of said thermochemical reactor Ri connected to said evaporator, are determined; II) when the temperature difference DTRi between the temperature of said reactor Ri connected to said evaporator and the equilibrium temperature TeSi of said reactive mixture contained in said thermochemical reactor Ri at the pressure Pevi of said evaporator is equal to a first predetermined differential and/or when the temperature difference DTev between said evaporator and the interior of said housing is equal to a second predetermined differential, said reactor Ri is isolated from said evaporator and said evaporator is placed in fluid communication with at least one thermochemical reactor Ri+1 the pressure whereof is less than Pevi and/or the temperature is less than a predetermined value, simultaneously, all or part of the heat that is produced at said reactors Ri+1 connected to said evaporator is also evacuated, III) steps I and II are repeated with reference to the thermochemical reactor Ri+1 in fluid communication with said evaporator (E) until the target temperature in said housing C is obtained.