Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures are disclosed. In one exemplary embodiment, a three-dimensional integrated circuit structure includes a plurality of integrated circuit chips stacked one on top of another to form a three-dimensional chip stack, a thermoelectric cooling daisy chain comprising a plurality of vias electrically connected in series with one another formed surrounding the three-dimensional chip stack, a thermoelectric cooling plate electrically connected in series with the thermoelectric cooling daisy chain, and a heat sink physically connected with the thermoelectric cooling plate.

A heating and cooling device is disclosed comprising at least one integral low voltage heating and cooling source and an efficient flexible heat distribution means having a thermal conductivity of from 375 to 4000 W/mK for distributing the heat and cool across a surface. Further aspects include thermal interface compounds to provide full thermal contact as well as the use of a phase change material to provide a long lasting heating and/or cooling effect without the use of external electrical input. Preferred applications include automotive and furniture seating heating and cooling, along with outdoor garments having distributed heating and cooling effects.

A heating and cooling device is disclosed comprising at least one integral low voltage heating and cooling source and an efficient flexible heat distribution means having a thermal conductivity of from 375 to 4000 W/mK for distributing the heat and cool across a surface. Further aspects include thermal interface compounds to provide full thermal contact as well as the use of a phase change material to provide a long lasting heating and/or cooling effect without the use of external electrical input. Preferred applications include automotive and furniture seating heating and cooling, along with outdoor garments having distributed heating and cooling effects.

The present invention relates to a luminous sofa cup holder comprising the cup body, the mounting base for supporting the cup body, the light source, the cooling/heating module, the temperature sensor and the control circuit for detecting the temperature of the cup body, either directly or indirectly, wherein the cup body is provided with an empty cavity, wherein the edge of the upper opening of the empty cavity is a flanging structure, which protrudes on the outer side of the cup body, wherein the light source is disposed over the outer side of the cup body; wherein the mounting base is a hollow body provided with at least one opening; wherein the cup body inserts into the mounting base through the opening provided on the mounting base; wherein the light source is held tightly by the cup body and the mounting base.

The present invention relates to a luminous sofa cup holder comprising the cup body, the mounting base for supporting the cup body, the light source, the cooling/heating module, the temperature sensor and the control circuit for detecting the temperature of the cup body, either directly or indirectly, wherein the cup body is provided with an empty cavity, wherein the edge of the upper opening of the empty cavity is a flanging structure, which protrudes on the outer side of the cup body, wherein the light source is disposed over the outer side of the cup body; wherein the mounting base is a hollow body provided with at least one opening; wherein the cup body inserts into the mounting base through the opening provided on the mounting base; wherein the light source is held tightly by the cup body and the mounting base.

A thermoelectric cooling device has first and second sides which can act as hot and cold sides. Heat exchangers are preferably in thermal conductance with the first and second sides and air may be directed by fans past the heat exchangers. Closed fluid systems may also be used. Furthermore, improved heat sink constructions are believed to improve the efficiency of the thermoelectric device.

A thermoelectric cooling device has first and second sides which can act as hot and cold sides. Heat exchangers are preferably in thermal conductance with the first and second sides and air may be directed by fans past the heat exchangers. Closed fluid systems may also be used. Furthermore, improved heat sink constructions are believed to improve the efficiency of the thermoelectric device.

A thermally controllable cupholder that is advantageously designed for marine and other outdoor implementations. The thermally controllable cupholder includes a beverage receptacle and a thermal control device configured to change a temperature of the beverage receptacle. In one embodiment, the cupholder includes a drain passageway and a drain hole that connects the beverage receptacle to the drain passageway. In one embodiment, the cupholder includes a perforated heat sink to promote the thermal conductivity of the thermal control device.

A thermally controllable cupholder that is advantageously designed for marine and other outdoor implementations. The thermally controllable cupholder includes a beverage receptacle and a thermal control device configured to change a temperature of the beverage receptacle. In one embodiment, the cupholder includes a drain passageway and a drain hole that connects the beverage receptacle to the drain passageway. In one embodiment, the cupholder includes a perforated heat sink to promote the thermal conductivity of the thermal control device.

In order to provide a cascade heat pump with which a large temperature lift can be provided with high efficiency, a cascade heat pump comprising n stages where n≥2 is proposed. Each of the n stages has a heat pump with a coolant inlet, a first coolant outlet, and a second coolant outlet. Each heat pump has a hot side and a cold side and a flow divider to divide a coolant flow entering the coolant inlet between the hot side and the cold side. The first coolant outlet of the heat pump of each stage i, where i=1 . . . n−1, is connected to the coolant inlet of the heat pump of a subsequent stage i+1. The second coolant outlet of the heat pump of at least one subsequent stage i+1 is connected by a recirculation line to the coolant inlet of the heat pump of a preceding stage.