Patent classifications
F25B2321/021
ACTIVE TEMPERATURE CONTROL FOR REDUCING BACKGROUND NOISE IN A LIDAR SYSTEM
An active temperature controlled laser for a LiDAR system is provided. The laser is heated to a minimum target temperature to narrow the ambient temperature range of operation. The heating can be done by a thermoelectric cooler (TEC) or a separate heating element, such as a heating resistor(s). The heater is deactivated when the temperature sensor reports an environment temperature greater than the minimum target temperature. In addition, a TEC controller is coupled to the TEC, and is configured to control the TEC so that the temperature output of the temperature measurement device stays within a designated temperature range. This limits temperature-induced variations in the wavelength of the laser beam to within a designated wavelength range, allowing the use of a narrow band pass filter to reduce environmental light noise and improve the signal-to-noise ratio of the detected signal.
THERMO-ELECTRIC HEAT PUMP SYSTEMS
The disclosure is directed to an energy efficient thermal protection assembly. The thermal protection assembly can comprise three or more thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present disclosure further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. The transport or storage device can be configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.
Methods and apparatus for mitigating temperature increases in a solid state device (SSD)
The present disclosure, in various aspects, describes technologies and techniques for a controller of a data storage device to mitigate temperature increases in the data storage device. In one example, the controller receives a command for a memory operation, analyzes the command to determine whether execution of the command with thermal throttling would have a negative impact on a user experience, and activates, if performing the thermal throttling would have the negative impact on the user experience, one or more thermoelectric cooler (TEC) devices while refraining from performing the thermal throttling. In another example, the controller monitors a temperature of one or more regions of the data storage device, determines whether the temperature exceeds a threshold temperature, activates one or more TEC devices to mitigate the temperature when the temperature exceeds the threshold temperature, and deactivates any activated TEC devices when the temperature no longer exceeds the threshold temperature.
Controller and Control Method of Thermoelectric Cooler-Heater Device
Disclosed is a controller and a control method of a thermoelectric cooler-heater device. The controller includes a switching power supply coupled to the thermoelectric cooler-heater device to provide a first driving current; and a constant-current constant-voltage power supply coupled to the thermoelectric cooler-heater device to provide a second driving current. According to a temperature detection signal, one of the switching power supply and the constant-current constant-voltage power supply operates, the first driving current is a continuous driving current flowing from an anode end to a cathode end of the thermoelectric cooler-heater device, the second driving current is a pulse driving current flowing from the cathode end to the anode end. In cooling mode, the controller uses the switching power supply to provide continuous output to improve monotonicity; in heating mode, the controller uses the constant-current constant-voltage power supply to provide pulse output to improve circuit efficiency and provide protection function.
Input mouse temperature control system
An input mouse may include a top button, a first wall rearward of the top button to underlie a palm of a user and a second wall forming an exterior of the input mouse. The first wall is formed from a material composition comprising a first polymer encapsulating thermally conductive particles. The second wall is formed from a thermally conductive material. A solid-state Peltier heat pump has a first face thermally coupled to the first wall and a second face thermally coupled to the second wall.
INPUT MOUSE TEMPERATURE CONTROL SYSTEM
An input mouse may include a top button, a first wall rearward of the top button to underlie a palm of a user and a second wall forming an exterior of the input mouse. The first wall is formed from a material composition comprising a first polymer encapsulating thermally conductive particles. The second wall is formed from a thermally conductive material. A solid-state Peltier heat pump has a first face thermally coupled to the first wall and a second face thermally coupled to the second wall.
Thermo-electric heat pump systems
The disclosure is directed to an energy efficient thermal protection assembly. The thermal protection assembly can comprise three or more thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present disclosure further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. The transport or storage device can be configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.
PRECURSOR VESSEL COOLING ASSEMBLY, SYSTEM INCLUDING THE ASSEMBLY, AND METHODS OF USING SAME
A precursor vessel cooling assembly, a reactor system including the assembly, and methods of using the assembly and system are disclosed. The precursor vessel cooling assembly includes a thermoelectric cooling device and a fluid-cooled plate to maintain a desired temperature of a precursor vessel or other portion of the precursor vessel cooling assembly.
Thermoelectric temperature controlled cooler for biomedical applications
A heat exchanger module (HEM) and system uses a flexible substrate with one or more open channels, to which a substrate cover is bonded, thereby forming closed channels in the flexible substrate. Thermoelectric coolers (TECs) are attached to optional thermally diffusing copper squares atop the substrate cover. An interface cover is attached to the TEC tops, with a compliant thermally conductive material opposite the TECs and ultimately in contact with a patient. A liquid is passed through the closed channels, which act as thermal references for the TECs. Current is supplied by a controller to the TECs to induce TEC cooling or heating relative to the liquid. One or more temperature sensors detect the temperature of the interface cover, which are used as inputs to the control of the TEC supply current. The HEM may be used for heating, cooling, or cycling between heating and cooling for various medical uses.
Fine-grain dynamic solid-state cooling system
A cooling system includes a controller, a plurality of sensor sub-units, a plurality of solid-state cooling sub-units and a heat exchanger. The sensor sub-units are configured to be thermally connected to a heat source. The heat source has a plurality of sub-regions that correspond with each of the sensor sub-units. Each solid-state cooling sub-unit corresponds with and thermally connects to one of the sensor sub-units and is configured to dissipate heat from the sub-regions of the heat source. The heat exchanger is configured to dissipate heat from the sub-regions of the heat source and waste heat. The controller, based on temperatures sampled from the plurality of sensor sub-units and predictions made by an optimizer, is configured to determine the one or more sub-regions of the heat source to cool.