A system for reclaiming water from moisture-laden building exhaust exiting a building through a vent is described herein, where the system can include one or more porous metal organic frameworks (MOFs) disposed downstream of the building exhaust vent for adsorbing water from the exiting moisture-laden building exhaust. The adsorped water can be desorped from the MOF, either naturally or aided by cooling the MOF. The desorped water can optionally be collected or directed elsewhere for use or collection.

A system for thermally conditioning and moving a fluid includes a thermoelectric device to convert electrical energy into thermal energy and produce a temperature change in response to an electrical current being applied thereto. The thermoelectric device can include a main-side and a waste side. A fluid moving device can produce a fluid flow that is in thermal communication with the thermoelectric device so that the thermal energy generated by the thermoelectric device is transferred to or from the fluid flow. A flow control valve selectively can direct the fluid flow along a main-side fluid flow path and/or a waste side fluid flow path.

A temperature control system for cryogenic tissue embedding belongs to the technical field of cryogenic tissue embedding of biological samples, which in particular relates to a temperature control system for cryogenic tissue embedding. The present invention provides a temperature control system for cryogenic tissue embedding with high operation efficiency and good use effects. The present invention comprises a heating and cooling semiconductor element and a control circuit. A control signal output port of the control circuit is connected to a control signal input port of the heating and cooling semiconductor element, and a detection signal input port of the control circuit is connected to a detection signal output port of a temperature sensor that detects the temperature of the heating and cooling semiconductor element. The control circuit comprises a CPU, a power conversion part, a system control part, a memory, a system feedback part, a display part, a Bluetooth part, and a heat-dissipation control part. A control signal output port of the CPU is connected to a control signal input port of the system control part and a control signal input port of the heat-dissipation control part, respectively.

This cooling module (14A) comprises:

an assembly of one or more Peltier cells comprising, on the inside, an internal heat transmission face and, on the outside, an external heat transmission face;

an internal heat sink (46A) and an external heat sink (48A), which are in thermal contact, respectively, with the internal heat transmission face and the external heat transmission face; and

at least one internal fan (50A) and at least one external fan (54A), which are respectively suitable to circulate an internal air flow through the internal heat sink (46A) and an external air flow through the external heat sink (48A).

A thermal management system for an enclosure containing electrical components includes a thermoelectric cooling unit for controlling temperature inside the enclosure and a controller for the cooling unit, the controller being configured so that it can be installed within and protected by the enclosure, rather than requiring its own separate secure enclosure. The controller can further be installed within a housing of the thermoelectric cooling unit, which housing does not increase the footprint of the cooling unit. The housing can include a cover that separates the space within the housing into two compartments, with the controller mounted at an angle that allows the controller to fit within one of the compartments and under the cover.

Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.

Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.

The disclosure is directed to an energy efficient thermal protection assembly. The thermal protection assembly can comprise three or more thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present disclosure further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. The transport or storage device can be configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.

A personal comfort system, for use with a bedding assembly having a mattress includes an air conditioning system configured to condition air within an air flow and a delivery system to receive and provide the conditioned air to a mattress or other desired device. The air conditioning system coupled with a housing and fan, a thermal transfer device having a thermoelectric engine operable for conditioning air within the air flow.

A food pan well includes a base defining an internal cavity and a temperature regulating system disposed within the internal cavity. The temperature regulating system includes an internal enclosure and at least one of a cooling assembly and a warming assembly. The internal enclosure is positioned within the internal cavity. The internal enclosure includes a bottom wall and a sidewall that extends around a periphery of the bottom wall. The bottom wall and the sidewall cooperatively define a temperature regulated cavity. The base is configured to support one or more food pans such that the one or more food pans are selectively suspendable within the temperature regulated cavity. The cooling assembly is positioned to facilitate cooling at least one of the one or more food pans and the warming assembly is positioned to facilitate warming at least one of the one or more food pans.