A vehicular camera module includes a lens barrel having a plurality of optical elements accommodated therein, a front camera housing portion, and a rear camera housing portion mated with the front camera housing to form a housing that encases an imager printed circuit board and a processor printed circuit board. A heat transfer element is disposed between and in thermal conductive contact with the imager printed circuit board and a rear wall of the rear camera housing. The heat transfer element extends through an aperture of the processor printed circuit board. Circuitry of the camera module is electrically connected to electrical connecting elements that electrically connect to a wire harness of a vehicle when the camera module is disposed at the vehicle. Heat generated by operation of the vehicular camera module is drawn from the imager printed circuit board to the rear camera housing portion via the heat transfer element.

A fast-rate thermoelectric device control system includes a fast-rate thermoelectric device, a sensor, and a controller. The fast-rate thermoelectric device includes a thermoelectric actuator array disposed on a wafer, and the thermoelectric actuator array includes a thin-film thermoelectric (TFTE) actuator that generates a heating and/or a cooling effect in response to an electrical current. The sensor is configured to measure a temperature associated with the heating or cooling effect and output a feedback signal indicative of the measured temperature. The controller is in communication with the fast-rate thermoelectric device and the sensor, and is configured to control the electrical current based on the feedback signal.

Examples of systems described herein may be used to cool an electronic device. Systems include a heat exchanger in thermal communication with the electronic device. Fluid may be passed through the heat exchanger and heat transferred from the electronic device to the fluid at least in part using convection. A fluid cooling system may be provided to cool the fluid and provide cooled fluid back to the heat exchanger. The fluid cooling system may include an active cooler (e.g., a thermoelectric device) and one or more additional heat exchangers. Control systems may control a pump or fan used to propel fluid through the system and power to the active cooler to maintain a temperature of the electronic device to a desired temperature or range.

A food processor includes: a main body; and a container that forms a food-containing space for containing food items and is detachably mounted to the main body, wherein the main body comprises a cold energy generator for transmitting cold energy to the container by coming into contact with at least part of the container, with the container mounted on the main body.

A cooling system and method for using the cooling system are described. The cooling system includes an array of cooling elements and a controller. The array of cooling elements corresponds to regions of the heat-generating structure where heat is generated in response to operation of the semiconductor. The controller is configured to activate portions of the array of cooling elements based on a determination that operation of the heat-generating structure is likely to generate heat in a given region of the heat-generating structure.

The present invention relates to a cooling apparatus, having increased cooling efficiency, which has a cooling rod passing through the inside of a storage receptacle such that an object to be cooled stored inside the storage receptacle is cooled by means of the cooling rod, and in which the cooling rod or the storage receptacle is filled with an auxiliary cooling solution for increasing the cooling efficiency, thereby cooling the inside of the storage receptacle to a predetermined temperature even in an environment with a high external temperature.

A set of headphones (1) comprises a pair of speaker units (3); a pair of ear pad portions (4); a plurality of temperature change modules (24) that are provided inside the pair of ear pad portions (4), and that heat and/or cool electrically so as to convey a temperature other than normal temperature to the user; and a temperature control unit (31) that drives the plurality of temperature change modules (24) on a rotating basis while shifting the phase of operation individually or in groups.

A reactor system for use in semiconductor processing that makes use of a liquid source for deposition that needs to be maintained within a specific temperature control band or range. The reactor system includes a temperature control system that includes a heating and cooling apparatus for providing both heating and cooling of a vessel that stores the liquid source to maintain the liquid source within a desired temperature control band or range. In this manner, the heating and cooling apparatus may be used in a reactor system in which the vessel needs to be cooled, needs to be heated, or uses concurrent or alternating heating and cooling to provide enhanced control of the source temperature within a particular temperature control band.

The technology disclosed relates to modularized beverage holder for actively cooling beverages. The modularized beverage holder includes a sleeve shaped beverage container receiver having a unibody construction comprising an insulating material, an interior opening adapted to receive beverage containers of varying sizes and materials, a bottom portion adapted to receive and provide support for beverage containers inserted into the interior opening of the sleeve shaped beverage container receiver, and a sidewall including an interior surface, an exterior surface and one or more via holes. The beverage holder further includes a first modular engine for actively cooling beverages, the first modular engine being mounted to the sleeve shaped beverage container receiver, and the first modular engine including a first thermal conductor member, and a first active temperature control system.

A heating and cooling device is disclosed comprising at least one integral low voltage heating and cooling source and an efficient flexible heat distribution means having a thermal conductivity of from 375 to 4000 W/mK for distributing the heat and cool across a surface. Further aspects include thermal interface compounds to provide full thermal contact as well as the use of a phase change material to provide a long lasting heating and/or cooling effect without the use of external electrical input. Preferred applications include automotive and furniture seating heating and cooling, along with outdoor garments having distributed heating and cooling effects. Additional aspects include a thermal pad wrap and a thermally conductive liquid system for heat/cool distribution.