A thermoelectric cooling device includes a tank including an inlet hole and an outlet hole, a thermoelectric pad that faces an outer surface of the tank to cool liquid received in the tank, a heat dissipation unit including a heat transfer block coming into contact with the thermoelectric pad, a heat pipe that passes through the heat transfer block, a heat sink connected to the heat pipe, and a fan that blows air to the heat sink, and a controller that controls an output of the thermoelectric pad.

A refrigerator includes an inner casing that defines a storage chamber and a cooling passage, a middle plate that is disposed outside the inner casing and that defines a foam space between the middle plate and the inner casing to accommodate a thermal-insulating material, an installation bracket that is fixed to the middle plate and that contacts the inner casing, a thermoelectric module mounted on the installation bracket and outside the foam space, and a fan assembly that is installed on the inner casing in the storage chamber and that includes a cooling fan.

A refrigerator may include an inner casing having a storage chamber defined therein; and a thermoelectric module including a thermoelectric element for cooling the storage chamber, a cooling sink in contact with one surface of thermoelectric element, and a heat sink contacting the other surface of thermoelectric element, wherein the heat sink includes: a heat dissipation fin including a stack of a plurality of fins; a heat dissipation plate coupled to the heat dissipation fin; a heat dissipation pipe for connecting the heat dissipation plate to the heat dissipation fin, wherein the heat dissipation pipe is arranged to pass through the heat dissipation fin.

A preparation vessel, in particular for a food processor, has a vessel wall and a preparation area surrounded by the vessel wall. The vessel wall has a cooling device that contacts the vessel wall in a heat-conducting manner for cooling a preparation item present in the preparation area. The vessel wall in at least a partial area has a double-walled design, with an inner wall bordering the preparation area and an outer wall that is formed separately from the inner wall and spaced apart from the inner wall by a gap, wherein the gap has the cooling device and a phase change material located between the cooling device and the outer wall as viewed in a direction from the preparation area to the outer wall.

Smoking pipe with an active smoke cooling chamber. A smoking pipe with a material bowl used for the burning of smoking materials, multiple chambers that are filled with smoke as the user inhales smoke into pipe using a mouthpiece, a chamber equipped with an thermoelectric heat exchanger, a control unit to regulate temperatures within the heat exchange chamber and a system to receive and provide data to user. The cooling chamber uses thermoelectric heat exchangers to change the temperature within its walls, the lowering of the temperature within the chamber cools the smoke as it passes through. The cooling chamber connects to a mouthpiece through an aft passage, the user inhales smoke which is now at a reduced temperature using a mouthpiece.

A wafer stage includes an electrostatic chuck (ESC) plate, an upper supporting plate, a lower supporting plate and a temperature controller. The ESC plate includes a first surface that supports a wafer. The upper supporting plate is bonded to a second surface of the ESC plate opposite to the first surface. The lower supporting plate overlaps the upper supporting plate. The temperature controller is disposed between the upper supporting plate and the lower supporting plate. The ESC plate includes ceramics. The upper supporting plate includes a composite material of aluminum or aluminum alloy and ceramics or carbon. The ESC plate and the upper supporting plate are directly bonded to each other by a room temperature solid bonding process. Thus, the wafer stage has sufficient strength to withstand pressure differences between a vacuum and atmospheric pressure, improved temperature response by minimizing heat capacity, and prevents warpage of the ESC plate.

A fast-rate thermoelectric device control system includes a fast-rate thermoelectric device, a sensor, and a controller. The fast-rate thermoelectric device includes a thermoelectric actuator array disposed on a wafer, and the thermoelectric actuator array includes a thin-film thermoelectric (TFTE) actuator that generates a heating and/or a cooling effect in response to an electrical current. The sensor is configured to measure a temperature associated with the heating or cooling effect and output a feedback signal indicative of the measured temperature. The controller is in communication with the fast-rate thermoelectric device and the sensor, and is configured to control the electrical current based on the feedback signal.

The present invention provides a water-cooled radiator internally provided with a semiconductor refrigeration system and a fan, the water-cooled radiator comprising: a radiation fin, a water tank structure, water-cooled pipes, a water pump, a water-cooled gear, a semiconductor refrigeration structure and a radiator fan assembly, wherein the radiation fin, the water tank structure, the semiconductor refrigeration structure and the radiator fan assembly are connected into an integrated structure. By means of the semiconductor refrigeration structure, the water temperature of a water storage tank can be rapidly lowered, and the radiator fan assembly can dissipate the heat of and cool a semiconductor, and can dissipate the heat of and cool electronic components around a main board.

A refrigerator includes a thermoelectric element module disposed at a wall of a storing chamber and includes a heat-absorbing sink and a heat-dissipating sink; a supply duct disposed at an inner case to discharge cold air, which has exchanged heat in the heat-absorbing sink, to a storing chamber; and a cold air accumulation agent disposed in the supply duct and cooled by the cold air flowing through the supply duct.

The disclosure is directed to an energy efficient thermal protection assembly. The thermal protection assembly can comprise three or more thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present disclosure further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. The transport or storage device can be configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.