F25B2321/025

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES
20210143084 · 2021-05-13 ·

An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

Fluid or Gas Cooling and/or Condensing Apparatus, System and Method
20210095903 · 2021-04-01 ·

A fluid or gas cooling and/or condensing apparatus, system and method provides a cooling apparatus for cooling and condensing material, such as, for example, refrigerant from air conditioners, refrigerators, and other like mechanical cooling devices for collecting the same. Specifically, the cooling apparatus comprises a cold plate having a cooling coil, a heat plate with one or more heat sinks attached thereto wherein heat is transferred from the cold plate to the heat plate, and a fan for cooling the heat plate, further wherein a cooling fluid, such as water, for example, is sent through the coil, and heat is removed therefrom and transferred to the heat plate. The cooled fluid is then circulated through a condenser coil within a cooling cylinder to condense the same for easy collection within a tank or other receptacle. Other gases and/or fluids may be condensed and/or chilled in a similar fashion, such as wine, for example.

VACUUM INSULATOR IN A STOREHOUSE AND METHODS OF MAKING AND USING THE SAME

A vacuum insulator including a heat diffusion block placed in a vacuum space; a thermoelectric module, in the vacuum space, coming into contact with the heat diffusion block so as to exchange heat therewith: and a heat sink exchanging heat with the thermoelectric module and placed in a first space or a second place. High heat-insulation performance and heat-transfer performance can be obtained.

HEATING AND COOLING TECHNOLOGIES INCLUDING TEMPERATURE REGULATING PAD WRAP AND TECHNOLOGIES WITH LIQUID SYSTEM
20210041147 · 2021-02-11 ·

A heating and cooling device is disclosed comprising at least one integral low voltage heating and cooling source and an efficient flexible heat distribution means having a thermal conductivity of from 375 to 4000 W/mK for distributing the heat and cool across a surface. Further aspects include thermal interface compounds to provide full thermal contact as well as the use of a phase change material to provide a long lasting heating and/or cooling effect without the use of external electrical input. Preferred applications include automotive and furniture seating heating and cooling, along with outdoor garments having distributed heating and cooling effects. Additional aspects include a thermal pad wrap and a thermally conductive liquid system for heat/cool distribution.

Piezoelectric MEMS-based active cooling for heat dissipation in compute devices

An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

THERMALLY CONTROLLABLE CUPHOLDER
20210071946 · 2021-03-11 ·

A thermally controllable cupholder that is advantageously designed for marine and other outdoor implementations. The thermally controllable cupholder includes a beverage receptacle and a thermal control device configured to change a temperature of the beverage receptacle. In one embodiment, the cupholder includes a drain passageway and a drain hole that connects the beverage receptacle to the drain passageway. In one embodiment, the cupholder includes a perforated heat sink to promote the thermal conductivity of the thermal control device.

Vacuum insulator in a storehouse and methods of making and using the same

Disclosed is a vacuum insulator comprising: a heat diffusion block placed in a third space; a thermoelectric module coming into contact with the heat diffusion block so as to exchange heat therewith, and placed in the third space; and a heat sink exchanging heat with the thermoelectric module and placed in a first space or a second place. According to the present invention, high heat-insulation performance and heat-transfer performance can be obtained.

Thermoelectric Cooling of Consumables in a Plasma Torch
20210022235 · 2021-01-21 ·

A plasma torch that includes an electrode having an exterior surface and a tip having an interior surface spaced apart from and facing the exterior surface of the electrode. A process gas flow channel located being located between the exterior surface of the electrode and the interior surface of the tip. A thermoelectric cooler having a cold plate and a hot plate is disposed between the exterior surface of the electrode and the interior surface of the tip with the cold plate being thermally connected to the exterior surface of the electrode. According to some implementations, electrical power is deliverable to the thermoelectric cooler only up electrical power being supplied to the electrode.

CONTAINERS FOR TRANSPORT AND STORAGE OF TEMPERATURE SENSITIVE CONTENTS USING SOLID STATE HEAT PUMPS
20240003598 · 2024-01-04 · ·

Temperature controlled systems include at least one temperature controlled chamber or package for accommodating temperature-sensitive content. The system includes at least one solid state heat pump in thermal communication with the temperature controlled chamber or package. The system may include a thermal energy storage system in thermal communication with the solid state heat pump, an electrical energy source or an electrical storage system for providing electrical power to the at least one solid state heat pump, an electrical control/energy management system, and/or an input/output feature. The system maintains the temperature controlled chamber at a control temperature, and/or maintains different chambers at different control temperatures. The package may be separable from a delivery system comprising the heat pump, the thermal energy storage system, and/or the electrical energy source, wherein a thermal transport element provides thermal communication between the package and the solid state heat pump when combined.

Cooling of print device and heating of print material

In an example, a print device comprises: a heat pump (102) to extract heat from a fluid source to produce cooled fluid and to transfer the heat from the fluid source to heat a print material (108), wherein the cooled fluid is used to cool a component (106) of the print device.