A heat cycle system and a control method. The heat cycle system includes: driving devices, one or a plurality of outdoor units, and a plurality of indoor units, which are connected by pipelines; a bypass pipeline for the plurality of indoor units, a bypass valve being disposed in the bypass pipeline; a pressure sensor that senses a pressure difference ΔP.sub.o across the plurality of outdoor units; and a controller that is preset with a pressure difference set value ΔP.sub.set, wherein the controller calculates a pressure offset parameter ΔP=ΔP.sub.o−ΔP.sub.set and adjusts an opening degree of the bypass valve based on the pressure offset parameter ΔP so that the pressure offset parameter ΔP approaches zero, and wherein the controller is preset with a first pressure offset threshold P.sub.1, and the controller is configured such that closed indoor units enter a bypass mode one by one when ΔP>P.sub.1, until ΔP≤P.sub.1.

A heat source-side unit (10) includes a heat source-side circuit (11). The heat source-side circuit (11) includes a compression unit (20) including a lower-stage compression element (23) and a higher-stage compression element (21), an intermediate heat exchanger (17) disposed on a refrigerant path between the lower-stage compression element (23) and the higher-stage compression element (21), and a bypass passage (23c) connected to a suction pipe (23a) and a discharge pipe (23b) each connected to the lower-stage compression element (23). At startup of the compression unit (20), a first action is performed for stopping the lower-stage compression element (23) and operating the higher-stage compression element (21). This configuration thus suppresses occurrence of liquid compression at startup of a compressor.

A refrigeration device, a refrigerator, and a control method therefor, a food processing method and a control device. The refrigeration device includes a compressor, a condenser, a throttling device and an evaporator, and the compressor, the condenser, the throttling device and the evaporator are sequentially connected to form a refrigerant circulation loop; a connecting pipeline between an exhaust port of the compressor and a refrigerant inlet of the throttling device in the refrigerant circulation loop is a first connecting pipeline; and the condenser is arranged on the first connecting pipeline. The refrigeration device further includes an auxiliary heat exchange branch, and the auxiliary heat exchange branch includes a condensing heater for heating a heating region, and is arranged on the first connecting pipeline in parallel; and a first valve device is further arranged on the auxiliary heat exchange branch.

Systems and methods have demonstrated the capability of rapidly cooling the contents of pods containing the ingredients for food and drinks.

Systems and methods have demonstrated the capability of rapidly cooling the contents of pods containing the ingredients for food and drinks.

In order to provide climate control system for heating or cooling a space, in particular a vehicle interior, having a compressor for conveying a refrigerant, which can efficiently use the refrigerant CO.sub.2 for heat pump applications as well, it is proposed to arrange a high-pressure chiller for cooling the refrigerant downstream of the compressor and a low-pressure chiller for heating the refrigerant upstream of the compressor, wherein a refrigerant exiting from the high-pressure chiller can be supplied to a motive mass inlet of a first ejector and a refrigerant exiting from the low-pressure chiller can be supplied to a suction mass inlet of the first ejector, and wherein an outlet of the first ejector is connected directly or indirectly to a liquid separator.

A semiconductor wafer cooling system and method and a pressure regulating apparatus for mitigating pressure increases in a semiconductor wafer conditioning circuit are disclosed. The pressure regulating apparatus comprises: a buffer vessel, the buffer vessel comprising an inlet and outlet channel; wherein the inlet channel is configured in operation to be in fluid communication with a higher pressure location of the semiconductor wafer conditioning circuit, and the outlet channel is configured in operation to be in fluid communication with a lower pressure location. the inlet channel comprises a pressure controlled valve configured to close the inlet channel during normal operation such that the buffer vessel is isolated from the higher pressure location of the conditioning circuit and to open the inlet channel in response to the pressure within the semiconductor conditioning circuit rising above a predetermined level.

Thermoelectric enhanced hybrid heat pump systems are provided herein. A compressor increases the pressure of refrigerant within tubing. A first heat exchanger is downstream of the compressor and changes enthalpy of first fluid flow through heat exchange with refrigerant. A second heat exchanger changes enthalpy of second fluid flow through heat exchange with refrigerant. A thermoelectric device is downstream of the first heat exchanger and reduces refrigerant temperature. Expansion valves are downstream of the thermoelectric device and first heat exchanger, respectively located on first and second sides of the thermoelectric device, and expand refrigerant and reduce refrigerant pressure while conserving refrigerant enthalpy. At least one valve reverses refrigerant flow within the tubing without changing compressor operation. A control system controls the thermoelectric device and at least one valve to switch the heat pump system from heating mode to cooling mode and from cooling mode to heating mode.

A heat exchanger includes heat exchange fins, refrigerant pipes are arranged across the heat exchange fins, and connecting pipes connected to the refrigerant pipes to thereby define refrigerant passages. The connecting pipes include a first pipe portion having a first end connected to one of the refrigerant pipes, a branch pipe portion that is branched from the first pipe portion, that extends parallel to the first pipe portion, and that is connected to another of the refrigerant passages, and a second pipe that is connected to the first pipe portion and that is configured to guide gas-phase refrigerant separated from the refrigerant in the first pipe portion. The second pipe includes an inner insert portion inserted into a second end of the first pipe portion and an outlet portion that extends from the inner insert portion in direction opposite to the second end of the first pipe portion.

A refrigeration device (100) having a closed circuit (C) within which a refrigerant fluid circulates and provided with a compressor and at least one shut-off valve (105) operable between an open position and a closed position to regulate the flow of refrigerant fluid through at least one evaporator depending on the temperature required by the user, the closed circuit includes at least one secondary by-pass branch (200) having an inlet section (201) and an outlet section (202) respectively arranged downstream (D) and upstream (U) of said at least one compressor (101) for the passage of said refrigerant fluid.