F26B25/14

Device and methods for rapid drying of porous materials

An apparatus and method for quickly drying porous materials. A sealable chamber is connected to a cold trap which is connected to a vacuum pump. A sample is placed inside the sealable chamber. The vacuum pump is turned on and air is evacuated through the cold trap to the vacuum pump. An infrared lamp may be used to heat the chamber and sample therein directly or heated air may be allowed to enter the sealable chamber. Air may be drawn directly from the sealable chamber to the vacuum pump bypassing the cold trap. Various parameters may be used to determine if the drying process is complete, including the degree of vacuum achieved in the chamber.

Device and methods for rapid drying of porous materials

An apparatus and method for quickly drying porous materials. A sealable chamber is connected to a cold trap which is connected to a vacuum pump. A sample is placed inside the sealable chamber. The vacuum pump is turned on and air is evacuated through the cold trap to the vacuum pump. An infrared lamp may be used to heat the chamber and sample therein directly or heated air may be allowed to enter the sealable chamber. Air may be drawn directly from the sealable chamber to the vacuum pump bypassing the cold trap. Various parameters may be used to determine if the drying process is complete, including the degree of vacuum achieved in the chamber.

Methods and apparatuses for drying electronic devices

Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat. Other embodiments include a desiccator for removing moisture from the air being evacuated from the electronic device prior to the air reaching an evacuation pump. Further embodiments detect humidity within the low-pressure chamber and determine when to increase and/or decrease pressure based on the humidity. Still further embodiments determine that the device is sufficiently dry to restore proper function based on the detected humidity, and in some embodiments based on the changes in humidity while pressure is being increased and/or decreased. Still further alternate embodiments automatically control some or all aspects of the drying of the electronic device. Additional embodiment disinfect the electronic device.

Methods and apparatuses for drying electronic devices

Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat. Other embodiments include a desiccator for removing moisture from the air being evacuated from the electronic device prior to the air reaching an evacuation pump. Further embodiments detect humidity within the low-pressure chamber and determine when to increase and/or decrease pressure based on the humidity. Still further embodiments determine that the device is sufficiently dry to restore proper function based on the detected humidity, and in some embodiments based on the changes in humidity while pressure is being increased and/or decreased. Still further alternate embodiments automatically control some or all aspects of the drying of the electronic device. Additional embodiment disinfect the electronic device.

On-board cleaning of tooling parts in hybrid bonding tool

Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber.

On-board cleaning of tooling parts in hybrid bonding tool

Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber.

CROP DRYING SYSTEM
20170115061 · 2017-04-27 ·

A moisture removal system having a crop drying enclosure for holding a crop product to be dried. A closed loop air circulation system is provided which includes a moisture removal enclosure for removing moisture from circulating air along with air ducting operatively connecting the moisture removal enclosure to the crop drying enclosure air inlet to form a closed loop moisture removal air system. A heat pump system, including a compressor, a first heat exchanger capable of operation as a condenser, along with two additional heat exchangers, each capable of operating as either a condenser or evaporator are positioned within the moisture removal enclosure, to remove excess moisture from the circulating air without the addition or extraction of heat from the ambient air temperature.

CROP DRYING SYSTEM
20170115061 · 2017-04-27 ·

A moisture removal system having a crop drying enclosure for holding a crop product to be dried. A closed loop air circulation system is provided which includes a moisture removal enclosure for removing moisture from circulating air along with air ducting operatively connecting the moisture removal enclosure to the crop drying enclosure air inlet to form a closed loop moisture removal air system. A heat pump system, including a compressor, a first heat exchanger capable of operation as a condenser, along with two additional heat exchangers, each capable of operating as either a condenser or evaporator are positioned within the moisture removal enclosure, to remove excess moisture from the circulating air without the addition or extraction of heat from the ambient air temperature.

DRYING DEVICE AND DRYING METHOD USING THE SAME
20170057249 · 2017-03-02 ·

The present invention provides a drying device and a drying method using the same. The drying device comprises a drying portion and a carrying portion, the carrying portion is used for carrying a substrate formed with a film layer to be dried, and the drying portion is arranged to face the film layer to be dried so as to dry the film layer to be dried.

Razor Drying Device
20170051973 · 2017-02-23 ·

A razor drying device for drying razors includes a housing having a top, a base, a back, a front, a left side and a right side defining an interior space within the housing. A wall and a divider are coupled to and positioned within the interior space of the housing, defining respectively a compartment and a chamber. A motor, power module and a processor are coupled to and positioned in the compartment. The motor has a shaft with a terminus extending through the wall. A fan is coupled to the terminus. The power module and the processor are operationally to each other and to the motor. The chamber has a screen for a bottom. The device has a tray, removable from the housing through a complimentary opening in the front. A plurality of inlets is positioned in the back of the housing and in the wall.