Patent classifications
F27B5/14
TAPERED FURNACE MUFFLES
An optical fiber draw furnace muffle includes a body portion defining a substantially cylindrical cavity extending along a centerline axis of the muffle. A tapered portion has an interior surface which defines a first curved portion with a first radius of curvature and a second curved portion with a second radius of curvature. At least one of the first and second radii of curvature has a radius greater than a radius of the cylindrical cavity.
TAPERED FURNACE MUFFLES
An optical fiber draw furnace muffle includes a body portion defining a substantially cylindrical cavity extending along a centerline axis of the muffle. A tapered portion has an interior surface which defines a first curved portion with a first radius of curvature and a second curved portion with a second radius of curvature. At least one of the first and second radii of curvature has a radius greater than a radius of the cylindrical cavity.
Catalytic thermal debind furnaces with feedback control
Apparatus and methods for debinding articles. The apparatus and methods may transform binder from furnace exhaust before the exhaust is discharged to the atmosphere. The apparatus may include a furnace retort and a reactor. The furnace retort may be configured to: exclude ambient air; and receive a carrier gas. The reactor may be configured to: receive from the retort (a) the carrier gas and (b) material removed in the retort from the article; and combust, at a temperature no greater than 750? C., the material. The material may be decomposed binder. The material may be hydrocarbon from binder that is pyrolyzed in the retort. The carrier gas may include gas that is nonflammable gas.
Catalytic thermal debind furnaces with feedback control
Apparatus and methods for debinding articles. The apparatus and methods may transform binder from furnace exhaust before the exhaust is discharged to the atmosphere. The apparatus may include a furnace retort and a reactor. The furnace retort may be configured to: exclude ambient air; and receive a carrier gas. The reactor may be configured to: receive from the retort (a) the carrier gas and (b) material removed in the retort from the article; and combust, at a temperature no greater than 750? C., the material. The material may be decomposed binder. The material may be hydrocarbon from binder that is pyrolyzed in the retort. The carrier gas may include gas that is nonflammable gas.
Method of annealing metal member
A method of annealing a metal member includes: disposing a first heater in an inner space of a hollow cylindrical metal member having an inner peripheral surface provided with plural teeth protruding toward a central direction, the first heater radiating infrared light and being disposed so as to extend parallel to a direction of a central axis of the metal member; heating the metal member from the inner space with the first heater; and gradually cooling the metal member after heating.
Method of annealing metal member
A method of annealing a metal member includes: disposing a first heater in an inner space of a hollow cylindrical metal member having an inner peripheral surface provided with plural teeth protruding toward a central direction, the first heater radiating infrared light and being disposed so as to extend parallel to a direction of a central axis of the metal member; heating the metal member from the inner space with the first heater; and gradually cooling the metal member after heating.
SYSTEM AND/OR METHOD FOR HEAT TREATING CONDUCTIVE COATINGS USING WAVELENGTH-TUNED INFRARED RADIATION
Certain example embodiments relate to systems and/or methods for preferentially and selectively heat treating conductive coatings such as ITO using specifically tuned near infrared-short wave infrared (NIR-SWIR) radiation. In certain example embodiments, the coating is preferentially heated, thereby improving its properties while at the underlying substrate is kept at low temperatures. Such techniques are advantageous for applications on glass and/or other substrates, e.g., where elevated substrate temperatures can lead to stress changes that adversely effect downstream processing (such as, for example, cutting, grinding, etc.) and may sometimes even result in substrate breakage or deformation. Selective heating of the coating may in certain example embodiments be obtained by using IR emitters with peak outputs over spectral wavelengths where the conductive coating (or the conductive layer(s) in the conductive coating) is significantly absorbing but where the substrate has reduced or minimal absorption.
SYSTEM AND/OR METHOD FOR HEAT TREATING CONDUCTIVE COATINGS USING WAVELENGTH-TUNED INFRARED RADIATION
Certain example embodiments relate to systems and/or methods for preferentially and selectively heat treating conductive coatings such as ITO using specifically tuned near infrared-short wave infrared (NIR-SWIR) radiation. In certain example embodiments, the coating is preferentially heated, thereby improving its properties while at the underlying substrate is kept at low temperatures. Such techniques are advantageous for applications on glass and/or other substrates, e.g., where elevated substrate temperatures can lead to stress changes that adversely effect downstream processing (such as, for example, cutting, grinding, etc.) and may sometimes even result in substrate breakage or deformation. Selective heating of the coating may in certain example embodiments be obtained by using IR emitters with peak outputs over spectral wavelengths where the conductive coating (or the conductive layer(s) in the conductive coating) is significantly absorbing but where the substrate has reduced or minimal absorption.
APPARATUS FOR TREATING SUBSTRATE
An apparatus for treating a substrate are provided. The apparatus includes a chamber having a treatment space therein, a substrate support unit to support the substrate in the treatment space, and a heater unit to heat the substrate supported by the substrate support unit. The substrate support unit includes a support plate having a seating surface, a support protrusion provided to protrude from the seating plate and to directly support the substrate, and a sensor provided to the support protrusion to measure a temperature of the substrate.
APPARATUS FOR TREATING SUBSTRATE
An apparatus for treating a substrate are provided. The apparatus includes a chamber having a treatment space therein, a substrate support unit to support the substrate in the treatment space, and a heater unit to heat the substrate supported by the substrate support unit. The substrate support unit includes a support plate having a seating surface, a support protrusion provided to protrude from the seating plate and to directly support the substrate, and a sensor provided to the support protrusion to measure a temperature of the substrate.