One variation of a conductive construction tape for electrifying a stack of bricks in a studded-brick building system includes: a tape substrate defining a first linear array of perforations that each define a circular cross-section configured to receive a stud extending from a brick in the studded-brick building system and offset from an adjacent perforation in the linear array by a standard stud offset distance between studs extending from the brick; and a conductive tape layer applied over the tape substrate; an electrically-conductive material extending along the first linear array of perforations and cooperating with the tape substrate to define a total nominal thickness less than a thickness of the studded building brick; wherein the perforated conductive tape is configured to transiently install horizontally between bricks in the stack of bricks to communicate electrical current laterally across the stack of bricks.

One variation of a conductive construction tape for electrifying a stack of bricks in a studded-brick building system includes: a tape substrate defining a first linear array of perforations that each define a circular cross-section configured to receive a stud extending from a brick in the studded-brick building system and offset from an adjacent perforation in the linear array by a standard stud offset distance between studs extending from the brick; and a conductive tape layer applied over the tape substrate; an electrically-conductive material extending along the first linear array of perforations and cooperating with the tape substrate to define a total nominal thickness less than a thickness of the studded building brick; wherein the perforated conductive tape is configured to transiently install horizontally between bricks in the stack of bricks to communicate electrical current laterally across the stack of bricks.

One variation of a conductive construction tape for electrifying a stack of bricks in a studded-brick building system includes: a tape substrate defining a first linear array of perforations that each define a circular cross-section configured to receive a stud extending from a brick in the studded-brick building system and offset from an adjacent perforation in the linear array by a standard stud offset distance between studs extending from the brick; and a conductive tape layer applied over the tape substrate; an electrically-conductive material extending along the first linear array of perforations and cooperating with the tape substrate to define a total nominal thickness less than a thickness of the studded building brick; wherein the perforated conductive tape is configured to transiently install horizontally between bricks in the stack of bricks to communicate electrical current laterally across the stack of bricks.

A construction set consisting of a sequence of subsets of mating blocks each subset having blocks of a smaller size than the preceding subset, all blocks being of the same general shape and enabling the construction of naturally occurring shapes such as fractal shapes. Each block has an attachment site to the next larger size blocks and at least two attachment sites to blocks of the next smaller size. The blocks can attach to each other by a variety of means including pin and hole pairs or magnets.

Described herein is a mold for making units of a dome structure, comprising: a first mold piece, a second mold piece, a third mold piece; the third mold piece is configured to be sandwiched between and assembled with the first and second mold pieces; wherein an assembly of the first mold piece, the second mold piece, and the third mold piece is configured to form a mold cavity; wherein the third mold piece comprises a plurality of sidewall plates; wherein the plurality of sidewall plates are perpendicular to a same spherical surface when the third mold piece is assembled with the first and second mold pieces. Described herein is also a method of using the mold, and the method comprises: assembling the plurality of sidewall plates to form the third mold piece; assembling the second mold piece and the third mold piece; assembling the first mold piece with the second mold piece and the third mold piece to form the mold cavity of a first-level mold; injecting a molding material into the mold cavity; forming a unit of a first-level dome structure by allowing the molding material to form into shape; opening the first-level mold; extracting the unit of the first-level dome structure.

Described herein is a mold for making units of a dome structure, comprising: a first mold piece, a second mold piece, a third mold piece; the third mold piece is configured to be sandwiched between and assembled with the first and second mold pieces; wherein an assembly of the first mold piece, the second mold piece, and the third mold piece is configured to form a mold cavity; wherein the third mold piece comprises a plurality of sidewall plates; wherein the plurality of sidewall plates are perpendicular to a same spherical surface when the third mold piece is assembled with the first and second mold pieces. Described herein is also a method of using the mold, and the method comprises: assembling the plurality of sidewall plates to form the third mold piece; assembling the second mold piece and the third mold piece; assembling the first mold piece with the second mold piece and the third mold piece to form the mold cavity of a first-level mold; injecting a molding material into the mold cavity; forming a unit of a first-level dome structure by allowing the molding material to form into shape; opening the first-level mold; extracting the unit of the first-level dome structure.

A water soluble adhesive for use in assembling toy interlocking plastic building blocks is disclosed which add strength to assembled structures yet enables easy disassembly and reuse.

A water soluble adhesive for use in assembling toy interlocking plastic building blocks is disclosed which add strength to assembled structures yet enables easy disassembly and reuse.

Disclosed are toy systems for creating and fixing an array of polygon shaped plastic beads together to form a design. The toy systems can include an upper tray, a lower tray, a plurality of beads, and a template. The plurality of beads can engage pins on the surface of the lower tray. Each of the beads can be configured to fuse or adhere to adjacent beads upon drying after the application of liquid to the plurality of beads engaged to the lower tray, forming a fixed array of beads. The upper tray can be configured to engage the pins of the lower tray between the lower tray and the plurality of beads. The upper tray can be used to remove a fixed or loose array of beads from the lower tray. The template can provide a design for the plurality of beads.

Disclosed are toy systems for creating and fixing an array of polygon shaped plastic beads together to form a design. The toy systems can include an upper tray, a lower tray, a plurality of beads, and a template. The plurality of beads can engage pins on the surface of the lower tray. Each of the beads can be configured to fuse or adhere to adjacent beads upon drying after the application of liquid to the plurality of beads engaged to the lower tray, forming a fixed array of beads. The upper tray can be configured to engage the pins of the lower tray between the lower tray and the plurality of beads. The upper tray can be used to remove a fixed or loose array of beads from the lower tray. The template can provide a design for the plurality of beads.