Examples are described for predicting a thermal profile of a product in an oven using temperature measurements for each zone of the oven. An example method of producing a predicted thermal profile of a product in an oven includes measuring the temperature of each oven zone using a zone temperature sensor as the product transitions through the zone, and calculating the predicted thermal profile of the product using a baseline temperature profile and the measured temperatures of each zone at the time the product is in each zone. Parameters of the predicted thermal profile may be compared to thermal targets corresponding to a process specification for the product in order to determine whether the product was processed according to the process specification.

Examples are described for predicting a thermal profile of a product in an oven using temperature measurements for each zone of the oven. An example method of producing a predicted thermal profile of a product in an oven includes measuring the temperature of each oven zone using a zone temperature sensor as the product transitions through the zone, and calculating the predicted thermal profile of the product using a baseline temperature profile and the measured temperatures of each zone at the time the product is in each zone. Parameters of the predicted thermal profile may be compared to thermal targets corresponding to a process specification for the product in order to determine whether the product was processed according to the process specification.

A method for heating ware in a kiln. The ware space of the kiln includes a plurality of temperature control zones oriented in a first direction, and a plurality of temperature control zones oriented in a second direction. The method includes heating the ware space in a first heating stage, a second heating stage, and a third heating stage. At least one of the following conditions is satisfied: (i) in one of the heating stages, a temperature control zone oriented in the first direction has a setpoint temperature that is different from a setpoint temperature of one other temperature control zone oriented in the first direction; and (ii) in one of the heating stages, one temperature control zone oriented in the second direction has a setpoint temperature that is different from a setpoint temperature of one other temperature control zone oriented in the second direction.

A method for heating ware in a kiln. The ware space of the kiln includes a plurality of temperature control zones oriented in a first direction, and a plurality of temperature control zones oriented in a second direction. The method includes heating the ware space in a first heating stage, a second heating stage, and a third heating stage. At least one of the following conditions is satisfied: (i) in one of the heating stages, a temperature control zone oriented in the first direction has a setpoint temperature that is different from a setpoint temperature of one other temperature control zone oriented in the first direction; and (ii) in one of the heating stages, one temperature control zone oriented in the second direction has a setpoint temperature that is different from a setpoint temperature of one other temperature control zone oriented in the second direction.

A rapid thermal processing method and a rapid thermal processing device are provided. The rapid thermal processing method includes the following operations. A wafer is provided. A first heating operation is performed on the wafer to heat the wafer to a first temperature. The wafer is controlled to start rotating. The first temperature is maintained for a first predetermined time. A second heating operation is performed on the wafer to heat the wafer from the first temperature to a second temperature, and the second temperature is maintained for a second predetermined time. A third heating operation is performed on the wafer to heat the wafer from the second temperature to a third temperature, and the third temperature is maintained for a third predetermined time.

A rapid thermal processing method and a rapid thermal processing device are provided. The rapid thermal processing method includes the following operations. A wafer is provided. A first heating operation is performed on the wafer to heat the wafer to a first temperature. The wafer is controlled to start rotating. The first temperature is maintained for a first predetermined time. A second heating operation is performed on the wafer to heat the wafer from the first temperature to a second temperature, and the second temperature is maintained for a second predetermined time. A third heating operation is performed on the wafer to heat the wafer from the second temperature to a third temperature, and the third temperature is maintained for a third predetermined time.

Moving metal strips can be heat treated with any number or combination of dimensionally variable tempers across widths, lengths, or thicknesses of a metal strip. To provide dimensionally variable heat treatment, an apparatus can include one or more heating units suitable to increase the temperature of a metal strip moving proximate the apparatus to a heat treatment temperature. The apparatus can also include one or more cooling units positioned near the heating units to absorb heat and cool the metal strip to minimize the amount of heat transferred from a first region of the metal strip that is to be treated to a second region of the metal strip that is not to be treated.

Moving metal strips can be heat treated with any number or combination of dimensionally variable tempers across widths, lengths, or thicknesses of a metal strip. To provide dimensionally variable heat treatment, an apparatus can include one or more heating units suitable to increase the temperature of a metal strip moving proximate the apparatus to a heat treatment temperature. The apparatus can also include one or more cooling units positioned near the heating units to absorb heat and cool the metal strip to minimize the amount of heat transferred from a first region of the metal strip that is to be treated to a second region of the metal strip that is not to be treated.

A method for open-loop and/or closed-loop control of a heating of a cast or rolled metal product, includes the steps of determining the total enthalpy of the metal product from a sum of the free molar enthalpies (Gibbs energy) of all phases and/or phase fractions currently present in the metal product; determining a temperature distribution within the metal product by means of a dynamic temperature calculation model using the total enthalpy determined; and open-loop and/or closed-loop controlling of the heating of the metal product as a function of at least one output variable of the temperature calculation model.

A method for open-loop and/or closed-loop control of a heating of a cast or rolled metal product, includes the steps of determining the total enthalpy of the metal product from a sum of the free molar enthalpies (Gibbs energy) of all phases and/or phase fractions currently present in the metal product; determining a temperature distribution within the metal product by means of a dynamic temperature calculation model using the total enthalpy determined; and open-loop and/or closed-loop controlling of the heating of the metal product as a function of at least one output variable of the temperature calculation model.