This heat treatment apparatus is configured such that a treating target is conveyed via an intermediate conveyance chamber and accommodated in a heating chamber. The heat treatment apparatus is provided with a gas cooling chamber that is disposed adjacent to the intermediate conveyance chamber and in which the treating target is cooled using a cooling gas containing an oxidizer.

A fire testing device for testing fire-resistance properties of a test subject includes a cavity, a heat source adapted to heat the cavity, and a removable separation plate configured to subdivide the cavity into a first chamber and a second chamber. The heat source is arranged in the first changer and adapted to preheat the first chamber. The second chamber includes an opening adapted to receive the test subject. A fire-resistance test of the test subject may include activating the removable separation plate to subdivide the cavity into the first chamber and the second chamber, arranging the test subject at an opening of the second chamber, preheating the first chamber to a defined temperature using the heat source, deactivating the removable separation plate to provide an undivided cavity, and sustaining a heat supply to the cavity using the heat source.

A fluxer includes a single, wide furnace enclosure that is sufficiently large and prewired to accommodate multiple fusion positions. The furnace includes at least one movable insulated partition that defines the actual insulated volume of the furnace.

A tube module has a tube having a bore and made of a ceramic material; a heat insulator surrounding an outer circumferential surface of the tube and made of a ceramic material; and a flange provided along an edge of each of both surfaces of the heat insulator and formed in a band shape.

Disclosed is a high-pressure annealing device including an internal chamber configured to provide an internal space, an external chamber configured to accommodate the internal chamber therein, a heating module configured to perform heat treatment and disposed in an external space provided between the internal chamber and the external chamber, and a shielding element configured to seal the lower portion of the external space, thereby preventing dispersion of particles generated from the heating module and preventing contamination of a substrate (a semiconductor wafer) due to the particles.

A heat treatment apparatus includes a heating unit, a chamber, an exhaust unit, a partition unit and a switching unit. The heating unit supports and heats a substrate on which a film of a processing liquid is formed. The chamber surrounds the substrate supported by the heating unit. The exhaust unit is configured to discharge a gas from an inner space of the chamber through a discharge opening located near the heating unit. The partition unit is configured to partition the inner space of the chamber into a first space where the substrate on the heating unit is exposed and a second space located above the first space. The switching unit is configured to switch between a first state where the gas is discharged by the exhaust unit through the first space and a second state where the gas is discharged by the exhaust unit through the second space.

A substrate processing device may include a process chamber configured to accommodate a substrate in space defined thereby; a heat treatment chamber configured to accommodate heat-treating of the substrate therein; and a substrate conveyance device configured to convey the substrate between the process chamber and the heat treatment chamber, wherein the heat treatment chamber comprises a heating chamber configured to heat the substrate in a space defined thereby; a cooling chamber configured to cool the substrate in a space defined thereby; and a heat exchanging element configured to heat the heating chamber and to cool the cooling chamber, the heat exchanging element in contact with the heating chamber and the cooling chamber.