An immersion cooling tank includes a tank body and a liquid flow tube. The tank body holds a coolant and an electronic device. The tank body defines an inlet and an outlet. The inlet and the outlet are respectively located at opposite ends of the electronic device for inputting and outputting the coolant. The coolant flows through the electronic device. The liquid flow tube includes at least one adjuster. The liquid flow tube is located inside the tank body and coupled to at least one of the inlet or the outlet. The at least one adjuster faces the electronic device for controlling an amount of the coolant flowing in or out of the tank body.

A liquid immersion cooling tank includes a reservoir and a liquid flow tube. The reservoir contains an insulating coolant to immerse an electronic device. The liquid flow tube includes an adjusting member. The reservoir includes an inlet and an outlet. The inlet and the outlet are respectively arranged at opposite ends of the electronic device. The liquid flow tube is located inside the reservoir. The liquid flow tube is coupled to at least one of the inlet and the outlet. The adjusting member faces the electronic device to control an amount of inflow or outflow of the insulating coolant. When the electronic device is immersed in the reservoir for cooling, the insulating coolant flows through the electronic device. The liquid flow tube coupled to the inlet or the outlet of the reservoir uses the adjusting member to control the amount of inflow or outflow of the insulating coolant.

A PCCS condenser may include a first and a second stage condenser. Each of the first and second stage condensers may include channels in fluid communication between an inlet and an outlet header. The inlet header of the first stage condenser may be configured to receive a fluid mixture through a first inlet opening. The channels may be configured to condense water from the fluid mixture flowing through the channels from the inlet header to the outlet header, respectively, of the first and second stage condenser. The PCCS condenser may include a catalyst in at least one of the outlet header of the first stage condenser or the inlet header of the second stage condenser. The catalyst may catalyze a reaction for forming water from hydrogen and oxygen in the fluid mixture. The outlet header of the second stage condenser may be in fluid communication with a combined vent-and-drain line.

A system for condensing steam from an autoclave sterilizer includes a cooling tank and a condensing coil extending into the cooling tank. Cooling water from a source of water flows into the tank to cool the condensing coil when the temperature of the coolant in the cooling tank exceeds a predetermined value. A waste water drain is in fluid communication with the cooling tank. An air gap is located between the tank and the source of cooling water. The air gap includes an opening to atmospheric air and is configured to avoid back flow from a waste water drain toward the water source. A check valve may be used with or in lieu of an air gap to prevent back flow toward the water source.

A liquid immersion cooling tank includes a reservoir and a liquid flow tube. The reservoir contains an insulating coolant to immerse an electronic device. The liquid flow tube includes an adjusting member. The reservoir includes an inlet and an outlet. The inlet and the outlet are respectively arranged at opposite ends of the electronic device. The liquid flow tube is located inside the reservoir. The liquid flow tube is coupled to at least one of the inlet and the outlet. The adjusting member faces the electronic device to control an amount of inflow or outflow of the insulating coolant. When the electronic device is immersed in the reservoir for cooling, the insulating coolant flows through the electronic device. The liquid flow tube coupled to the inlet or the outlet of the reservoir uses the adjusting member to control the amount of inflow or outflow of the insulating coolant.

An evaporator includes an inlet in a lower manifold, an outlet in an upper manifold, and a multiport tube extending between the lower manifold and the upper manifold. The multiport tube provides a flow path between the lower manifold and the upper manifold. One of the outer side walls of the multiport tube is provided with a first evaporator section with a first heat receiving surface and a second evaporator section with a second heat receiving surface, the first and second evaporator sections passing a heat load received via the respective first and second heat receiving surfaces to a fluid in said multiport tube. The first and second heat receiving surfaces form an angle with each other to align with and contact different surfaces of an object to be cooled.

A cooling device includes a substrate defining a substrate upper surface, and a fin positioned on the substrate upper surface, the fin including a deformable encapsulating layer coupled to the substrate upper surface and defining an interior region, and a phase-change material encapsulated within the interior region, where the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer.

A steam generator that reduces the thermal and hydraulic unevenness in the steam generator, improves the filling capacity of the steam generator with heat exchange tubes, organizes an economizer portion of the heat exchange surface in the steam generator, and reduces the concentration of corrosive impurities in the weld zone of the primary circuit to the horizontal shell. To solve the task in such steam generator containing the horizontal shell and other component, the heat exchange tubes are located in vertical planes, and the inlet and outlet manifolds of the primary circuit are arranged horizontally. The steam generator can also be equipped with at least two output manifolds of the primary circuit furthers, the feed water dispenser can be located below the heat exchange tubes of the steam generator.

Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.

Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.