A plate includes: a main body; a flow channel provided in the main body and configured to flow inert gas therein; a cover configured to cover a surface of the main body where the flow channel is formed; a buried member buried in an opening of the flow channel, the buried member including a buried portion fixed to the flow channel and made of dense ceramic, and a flow portion held by the buried portion and configured to let the inert gas flow from an inside to an outside of the main body, at least a part of the flow portion being made of porous ceramic; and a plurality of through holes provided in the flow portion. A ratio of a diameter of an outer circumference of the buried portion to a diameter of a smallest circle among circles including all of the through holes is 1.2 or higher.

A flow manifold for a heat exchanger core includes a number of fractal flow splitters arranged in a grid pattern of layers each fluidly connected to a corresponding first circuit layer, a flow plenum having a number of flow channels that are fluidly connected to an associated fractal flow splitter, one or more flow dividing vanes located in each flow channel thereby dividing the associated flow channel into two or more sub-channels, and an outer manifold surrounding the fractal flow splitters and configured to direct a first circuit flow into or out of the heat exchanger core. Each fractal flow splitter has an open end and a plenum end, and provides a transition from the open end to the flow plenum.

A window assembly heat transfer system is disclosed in which a window member has a selected transparency to monitored or sensed light wavelengths. One or more passages are provided in the window member for flowing a single-phase or two-phase heat transfer fluid, the passages being optically non-transparent to the monitored or sensed light wavelengths. A mechanism allows either evaporation or condensation of the fluid and/or balancing of a flow of the fluid within the passages. In one embodiment, the window assembly can be made by producing passages in a top surface of a first single plate, optionally producing passages in a bottom surface of a second single plate and bonding the top surface of the first plate to a bottom surface of a second single plate to form the window member with the passage or passages. In another embodiment, the window assembly can be made by providing a core around which the window member material is grown and thereafter removing the core to produce the passage or passages.

An evaporator assembly including an inlet header, an outlet header, and an evaporator body extending from the inlet header to the outlet header. The evaporator body defining a channel fluidly connected to the outlet header. The evaporator assembly further includes a feed tube including: an adapter fluidly connected to the inlet header and a perforated tube fluidly connected to the inlet header through the adapter. The perforated tube including a first end attached to the adapter, a second end opposite the first end, and a plurality of orifices fluidly connecting the perforated tube to the channel. The perforated tube extends within the channel.

An orifice insert is provided and includes a center plug and a ring feature. The center plug has first and second ends and an exterior surface extending between the first and second ends. The exterior surface defines multiple inflow channels that extend from the first end toward the second end and terminate at termination points midway between the first and second ends. The ring feature is disposed about the center plug and the multiple inflow channels to define, with the center plug, a plenum with which the termination points of the multiple inflow channels are fluidly communicative.

A method can include additively manufacturing a heat exchanger core having one or more fluid channels using a first additive manufacturing process and a first material. The method can also include additively manufacturing a support structure around the heat exchanger core using a second additive manufacturing process different from the first additive manufacturing process and a second material different from the first material after additively manufacturing the heat exchanger core.

A heat exchanger (10) for a thermochemical biomass converter, the heat exchanger (10) comprises first and second conduits (12a, 12b) that are configured to carry, in use, process medium of the converter, and a heat transfer member (14) that thermally connects the first and second conduits (12a, 12b) to one another to define a heat transfer medium between the conduits (12a, 12b). The thermal expansion coefficient of the first and second conduits (12a, 12b) is matched to the thermal expansion coefficient of the heat transfer member (14) to continually provide thermal connection between the heat transfer member (14) and conduits (12a, 12b) under changing temperature conditions.

A reliable, leak-tolerant liquid cooling system with a backup air-cooling system for computers is provided. The system may use a vacuum pump and a liquid pump and/or an air compressor in combination to provide negative fluid pressure so that liquid does not leak out of the system near electrical components. Alternatively, the system can use a single vacuum pump and a valve assembly to circulate coolant. The system distributes flow and pressure with a series of pressure regulating valves so that an array of computers can be serviced by a single cooling system. The system provides both air and liquid cooling so that if the liquid cooling system does not provide adequate cooling, the air cooling system will be automatically activated. The heat may be removed from the building efficiently with a cooling tower. A connector system is provided to automatically evacuate the liquid from the heat exchangers before they are disconnected. Various turbulators are also provided, as well as a system and method for optimizing the heat transfer characteristics of a heat exchanger to minimize total energy requirements.

Embodiments described herein relate to a heat exchanger for abating compounds produced in semiconductor processes. When hot effluent flows into the heat exchanger, a coolant can be flowed to walls of a fluid heat exchanging surface within the heat exchanger. The heat exchanging surface can include a plurality of channel regions which creates a multi stage cross flow path for the hot effluent to flow down the heat exchanger. This flow path forces the hot effluent to hit the cold walls of the fluid heat exchanging surface, significantly cooling the effluent and preventing it from flowing directly into the vacuum pumps and causing heat damage. Embodiments described herein also relate to methods of forming a heat exchanger. The heat exchanger can be created by sequentially depositing layers of thermally conductive material on surfaces using 3-D printing, creating a much smaller footprint and reducing costs.

A heat exchanger for abating compounds produced in semiconductor processes. When hot effluent flows into the heat exchanger, a coolant can be flowed to walls of a fluid heat exchanging surface within the heat exchanger. The heat exchanging surface can include a plurality of channel regions which creates a multi stage cross flow path for the hot effluent to flow down the heat exchanger. This flow path forces the hot effluent to hit the cold walls of the fluid heat exchanging surface, significantly cooling the effluent and preventing it from flowing directly into the vacuum pumps and causing heat damage. Embodiments described herein also relate to methods of forming a heat exchanger. The heat exchanger can be created by sequentially depositing layers of thermally conductive material on surfaces using 3-D printing, creating a much smaller footprint and reducing costs.