F28D1/0246

DIRECTED ENERGY DEPOSITION OF HEAT EXCHANGE FINS

A method includes forming an electronics housing defining a first flow path spaced apart from the second flow path for heat exchange through the housing between the first and second flow paths. The electronics housing is of a first material. The method includes depositing a heat exchange fin on the electronics housing. The heat exchange fin is of a second material different from the first material, wherein the heat exchange fin is grown into the second flow path to facilitate heat exchange between the first flow path and the second flow path.

HEAT EXCHANGERS AND MANUFACTURING METHODS THEREFOR

A method can include additively manufacturing a heat exchanger core having one or more fluid channels using a first additive manufacturing process and a first material. The method can also include additively manufacturing a support structure around the heat exchanger core using a second additive manufacturing process different from the first additive manufacturing process and a second material different from the first material after additively manufacturing the heat exchanger core.

FIN AND INSERT COOLING DEVICE
20210194326 · 2021-06-24 ·

A cooling device having a surface configured to allow the circulation of a heat-transfer fluid along the surface in a first direction D1, an exchange of heat being able to take place by convection between the cooling device and the fluid, the device includes n cooling fins, n being an integer greater than or equal to one, each cooling fin forming a protuberance of the device, extending primarily in a plane (P) containing the first direction (D1), in each fin, at least two inserts having a tube form and a dimension characteristic of a section of the tube and extending primarily in a second direction (D2) of the plane P distinct from the first direction (D1), the inserts having, over their greater length, a thermal resistance lower than the thermal resistance of the cooling fin along the same length, each insert being distant in the first direction (D1) from another insert by a length equal to or greater than the characteristic dimension of the section of the tube of the insert.

COOLING DEVICE

According to one embodiment, a cooling device includes a heat releasing element including a surface configured to contact a heat generating element and an internal fluid channel configured to flow a cooling medium. The cooling device also includes a plurality of cooling fins within the fluid channel, each of which extends in a direction crossing a flow direction of the cooling medium and has a zigzag, corrugated shape defined by multiple bent portions.

Dual seated by-pass valve for surface coolers

A heat exchanger circuit can include a heat exchanger having a body with a plurality of cooling fins for the heat exchanger, a plurality of core cooling channels within the body, a plurality of de-congealing channels in fluid communication with the plurality of core cooling channels, and a by-pass valve in fluid communication with the plurality of core cooling channels and the plurality of de-congealing channels.

Advanced cooling system using throttled internal cooling passage flow for a window assembly, and methods of fabrication and use thereof

A window assembly heat transfer system is disclosed in which a window member has a selected transparency to monitored or sensed light wavelengths. One or more passages are provided in the window member for flowing a single-phase or two-phase heat transfer fluid, the passages being optically non-transparent to the monitored or sensed light wavelengths. A mechanism allows either evaporation or condensation of the fluid and/or balancing of a flow of the fluid within the passages. In one embodiment, the window assembly can be made by producing passages in a top surface of a first single plate, optionally producing passages in a bottom surface of a second single plate and bonding the top surface of the first plate to a bottom surface of a second single plate to form the window member with the passage or passages. In another embodiment, the window assembly can be made by providing a core around which the window member material is grown and thereafter removing the core to produce the passage or passages.

Advanced cooling system using throttled internal cooling passage flow for a window assembly, and methods of fabrication and use thereof

A window assembly heat transfer system is disclosed in which a window member has a selected transparency to monitored or sensed light wavelengths. One or more passages are provided in the window member for flowing a single-phase or two-phase heat transfer fluid, the passages being optically non-transparent to the monitored or sensed light wavelengths. A mechanism allows either evaporation or condensation of the fluid and/or balancing of a flow of the fluid within the passages. In one embodiment, the window assembly can be made by producing passages in a top surface of a first single plate, optionally producing passages in a bottom surface of a second single plate and bonding the top surface of the first plate to a bottom surface of a second single plate to form the window member with the passage or passages. In another embodiment, the window assembly can be made by providing a core around which the window member material is grown and thereafter removing the core to produce the passage or passages.

Thermal Management Of RF Devices Using Embedded Microjet Arrays

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

Evaporator

An evaporator evaporates a working fluid by heat from a battery. The evaporator includes at least one evaporation channel connected to the battery in a thermally conductive manner. The evaporator includes a supply channel connected to an upstream end of the evaporation channel, and supplies the working fluid in liquid phase from the supply channel to the evaporation channel. The evaporator includes an outflow channel connected with a downstream end of the evaporation channel, and discharges the working fluid. The outflow channel is disposed above the supply channel, and the supply channel is disposed at a position more insulated from the heat of the battery than the evaporation channel is.

HEAT EXCHANGER OF A GAS TURBINE ENGINE OF AN AIRCRAFT
20210095597 · 2021-04-01 ·

A heat exchanger of a gas turbine engine includes a casing having a stepped incident-flow profile. An air volume flow is, in the region of the incident-flow profile, diverted such that a recirculation zone with a separation bubble forms in the flow. Downstream of the incident-flow profile, is a further stepped incident-flow profile. The flow is diverted such that, downstream of the further incident-flow profile, a further recirculation zone forms in which a separation bubble is present. In the region of the incident-flow profile and/or the further incident-flow profile, is an inlet of a flow duct which runs in the casing in the direction of a mouth. An air volume flow conducted through the flow duct emerges from the mouth at such an angle relative to the flow direction of the air volume flow that, downstream of the mouth, a recirculation zone with a separation bubble forms.