An apparatus includes at least one evaporator having a surface configured for mounting of a power electronic device thereon, a condenser fluidically coupled to the at least one evaporator by at least two coolant conduits that electrically insulate the at least one evaporator from the condenser, and a dielectric coolant contained in a thermosyphon loop comprising the at least one evaporator, the condenser and the at least two coolant conduits. The at least one evaporator may include at least two evaporators fluidically coupled by at least one coupler that electrically insulates the at least two evaporators from one another. The at least one evaporator may be housed within an enclosure, and the condenser may be positioned within the enclosure or outside of the enclosure.

A heat transfer plate comprising a first port opening and a second port opening for allowing a first fluid to flow over a top surface of the heat transfer plate, a first side opening and an opposite, second side opening for allowing a second fluid to flow over a bottom surface of the heat transfer plate, a number of rows of alternating tops and grooves that extend along the heat transfer plate, where a transition between a top and an adjacent groove is formed by an inclined portion, and plate portions that extend along the heat transfer plate, between the rows of tops and grooves, thereby forming flow channels between the rows of tops and grooves.

Provided is a heat exchanger, including a plurality of heat exchange members arranged in a first direction so as to be spaced apart from each other. Each of the plurality of heat exchange members includes: a heat transfer pipe extending in a second direction intersecting with the first direction; and a heat transfer plate provided to the heat transfer pipe along the second direction. The heat transfer plate includes extending portions extending away from the heat transfer pipe in a third direction intersecting with each of the first direction and the second direction. The heat transfer plate is formed separately from the heat transfer pipe.

Provided is a heat exchanger, including a plurality of heat exchange members arranged in a first direction so as to be spaced apart from each other. Each of the plurality of heat exchange members includes: a heat transfer pipe extending in a second direction intersecting with the first direction; and a heat transfer plate provided to the heat transfer pipe along the second direction. The heat transfer plate includes extending portions extending away from the heat transfer pipe in a third direction intersecting with each of the first direction and the second direction. The heat transfer plate is formed separately from the heat transfer pipe.

This present invention is a cooled panel (23) used on the walls of blast furnaces (1) and other industrial furnaces consisting of a body (25) of copper, cast iron or other metal alloy, independent internal cooling channels (24) and protection sleeves (26) attached to the panel body and the pipes (27) that link the couplings to the internal cooling channels (24). The cooled panel (23) features the amount of internal cooling channels (24) greater than the number of coupling sets (31), which are connected to the furnace water system feeding and return (35).

A microfluidic device having a channel within a first material to thermally couple with an IC die. The channel defines an initial fluid path between a fluid inlet port and a fluid outlet port. A second material is within a portion of the channel. The second material supplements the first material to modify the initial fluid path into a final fluid path between the fluid inlet port and the fluid outlet port. The second material may have a different composition and/or microstructure than the first material.

A tube stay mounting assembly includes a press assembly having a housing and a top block configured to flatten fins on a first surface of a finned tube. A press arm is operable to move the top block vertically with respect to the housing. A bottom block is configured to flatten fins on a second surface of the finned tube when the press arm is rotated and moves the top block downwardly. A tube stay clamping assembly includes a clamping housing configured to receive a tube stay having a top, bottom, rear, and front walls, the tube stay being configured to receive a flattened portion of the finned tube. A clamping arm is connected by linking arms to a clamping block, the clamping block configured to engage and force the front wall into snap-fit engagement with the top wall of the tube stay.

A method for at least partially removing a contamination layer (24) from an optical surface (14a) of an optical element (14) that reflects EUV radiation includes: performing an atomic layer etching process for at least partially removing the contamination layer (24) from the optical surface (14a), which, in turn, includes: exposing the contamination layer (24) to a surface-modifying reactant (44) in a surface modification step, and exposing the contamination layer (24) to a material-detaching reactant (45) in a material detachment step. The optical element (14) is typically taken, before the atomic layer etching process is performed, from an optical arrangement, in particular from an EUV lithography system, in which the optical surface (14a) of the optical element (14) is exposed to EUV radiation (6), during which the contamination layer (24) is formed.

A method for at least partially removing a contamination layer (24) from an optical surface (14a) of an optical element (14) that reflects EUV radiation includes: performing an atomic layer etching process for at least partially removing the contamination layer (24) from the optical surface (14a), which, in turn, includes: exposing the contamination layer (24) to a surface-modifying reactant (44) in a surface modification step, and exposing the contamination layer (24) to a material-detaching reactant (45) in a material detachment step. The optical element (14) is typically taken, before the atomic layer etching process is performed, from an optical arrangement, in particular from an EUV lithography system, in which the optical surface (14a) of the optical element (14) is exposed to EUV radiation (6), during which the contamination layer (24) is formed.

A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.