Some embodiments of the present disclosure provides a heat exchanger, including: a plurality of flat pipes disposed at intervals, wherein the flat pipe is provided with an inlet portion and an outlet portion, and both the inlet portion and the outlet portion are located on a first end of the flat pipe; a first sealing cushion block, disposed between two adjacent flat pipes; and a flow collecting portion, provided with a first opening portion and a second opening portion, wherein the first opening portion is disposed opposite to the inlet portion, and the second opening portion is disposed opposite to the outlet portion. The first sealing cushion block includes a first sealing portion and a second sealing portion.

A heat exchanger assembly has: a front portion; a middle portion rearward of the front portion; a rear portion rearward of the middle portion, at least one of the front and rear portions being curved from the middle portion, the at least one of the front and rear portions extending below the middle portion; a top part, the top part defining at least one top recess; and a bottom part disposed below the top part and being joined to the top part, the bottom part defining at least one bottom recess. The top and bottom parts define therebetween a passage formed in part by the at least one top recess and the at least one bottom recess. The passage has an inlet and an outlet. A snowmobile having the heat exchanger assembly is also disclosed.

Stacked cooling assemblies and combustor bead ends are provided. A stacked cooling assembly includes an inlet plate defining an inlet to a coolant circuit, an outlet plate defining an outlet of the coolant circuit, and an intermediate plate disposed between the inlet plate and die outlet plate. The intermediate plate defines an intermediate cavity. A downstream surface of the inlet plate, an upstream surface of the outlet plate, and the intermediate cavity collectively define a connecting channel that fluidly couples the inlet to the outlet.

A high power-density power converter (500) employs a liquid cooling system (200) to cool its transformers (120). In an embodiment, the coils (135) of a transformer (100) are embedded in a heat-conducting solid (epoxy or resin). The resin-embedded coils (135) are in physical/thermal contact with cold plates (160), which are sandwiched between the coils (135) and/or in contact with exterior surfaces of the coils (135). The cold plates (160) may additionally or alternatively be in physical/thermal contact with the transformer core (145). Coolant fluid is pumped through the cold plates (160). In another embodiment, the transformer is (120) is immersed in a coolant fluid (740), such as oil, within a heat management enclosure (710). Cold plates (160) are in physical/thermal contact with the enclosure (710). Coolant liquid (240) pumped through the cold plates (160) conducts heat away from the oil-enclosed transformer (700).

Cooling element for vacuum pump comprising a base element wherein by the base element an internal void is defined. Further, an inlet is connected to the base element and is in fluent connection with the void. Further, an outlet is connected to the base element and in fluent connection with the void such that a coolant can flow from the inlet through the void to the outlet to dissipated heat. Therein, the base element is connected to a housing of a vacuum pump.

Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices or other devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, multi-stage microjets, microchannels, fins, wells, wells with flow passages, well with stress relief or stress propagation inhibitors, and integrated microjets and fins.

A falling film of liquid desiccant in direct contact with a gas stream is formed, which allows water vapor transfer between a gas stream (air) and the desiccant, enabling dehumidification and/or humidification of air. Thin films are created in one way by a wettable layer that is in contact with a support structure and in another way directly on the support structure. The devices can be installed on an absorber (conditioner) side or a desorber (regenerator) side or both of air conditioning systems; for example, liquid desiccant air conditioning (LDAC) applications.

A plate-type heat exchanger, in particular for motor vehicles, is described which includes plate pairs. In one example, a plate pair includes a first plate and a second plate that form a first flow path and a second flow path between the plates. In this configuration, the first and the second plate are associated with a first attachment plate and a second attachment plate, respectively. A third flow path is formed between the first plate and the second attachment plate and the first flow path is formed between the second plate and the first attachment plate. Alternatively, the third flow path is formed between the first plate and the first attachment plate and the first flow path is formed between the second plate and the second attachment plate. A spatial region for a fourth flow path may also be formed between adjacent plate pairs.

A separating element (10a, 10b) adapted to be positioned in connection to a heat exchanger unit (1, 1a, 1b, 1c) of a sectioned heat exchanger (100) is disclosed. The separating element (10a, 10b) has first openings (11a, 11b) adapted to align with first heat exchanger openings (3a, 3b) forming inlets of a first flow path (A) and a second flow path (B), respectively, through the heat exchanger unit (1, 1a, 1b, 1c). The separating element (10a, 10b) further includes second openings (11c, 11d) adapted to align with second heat exchanger openings (3c, 3d) forming outlets of the first flow path (A) and the second flow path (B), respectively. The first openings (11a, 11b) are formed with first valves (12a, 12b) adapted to close for fluid flow to the first (A) and/or the second (B) flow path through the heat exchanger unit (1, 1a, 1b, 1c), and the second openings (11c, 11d) are formed with second valves (17a, 17b) adapted to close for fluid flow from the first (A) and/or second (B) flow path. The first valves (12a, 12b) are formed with valve stems (13a, 13b), each operated by an actuator (14a, 14b), and the second valves (17a, 17b) are connected to the same valve stems (13a, 13b) as the first valves (12a, 12b), thereby providing coordinated control of the first valves (12a, 12b) and the second valves (17a, 17b).

A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.