F28D15/0208

Memory module cooler with rotatable cooling tube

An example memory module cooler may include a first liquid manifold, a second liquid manifold, and a cooling tube connected to the first and second liquid manifolds such that. The cooling tube may be connected to the manifolds such that (1) liquid coolant can flow from the first liquid manifold through the cooling tube to the second liquid manifold, and (2) the cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the cooling tube. The cooling tube may have an oblong cross-sectional profile.

Gas turbine engine with heat pipe system

A gas turbine engine includes a rotor section proximate to a combustor section, where the rotor section is subject to bowing effects due to thermal differences and heat transfer at engine shutdown. The gas turbine engine also includes a heat pipe system. The heat pipe system includes one or more heat pipes installed between an upper portion of the rotor section and a lower portion of the rotor section. The heat pipe system is operable to accept heat at a hot side of the heat pipe system at the upper portion, flow heat from the hot side to a cold side of the heat pipe system, and reject heat from the cold side of the heat pipe system at the lower portion to reduce a thermal differential between the upper portion and the lower portion at engine shutdown.

THERMALLY-ENHANCED AND DEPLOYABLE STRUCTURES

An apparatus includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid and a body. The structure also includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more oscillating heat pipes embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.

SLEEVE-TYPE HEAT CONDUCTING STRUCTURE
20190301813 · 2019-10-03 ·

A sleeve-type heat conducting structure includes a heat conducting device (1), a sleeve (2), and a heat pipe (3). The heat conducting device (1) has a working portion (10) and a sleeve-connecting portion (11); a fitting hole (110) is disposed in the sleeve-connecting portion (11) such that the sleeve (2) is fastened in the fitting hole (110). The heat pipe (3) has an end disposed movably in the sleeve (2) and the other end exposed out of the sleeve (2) in which the end of the heat pipe (3) sleeved into the sleeve (2) can slide axially in the sleeve (2) and the heat pipe (3) can rotate with respect to the heat conducting device (1) through the sleeve (2).

Heat pipe in turbine engine rotor

The present disclosure is directed to a rotating component for a turbine engine. The rotating component defines a surface and includes a heat pipe positioned on the surface of the rotating component or within the rotating component. The heat pipe includes a working fluid and an outer perimeter wall.

Cooling system and electronic equipment
10408545 · 2019-09-10 · ·

A cooling system includes a heat absorbing device which has a first pipe port and absorbs heat discharged from equipment by using refrigerant; a radiator which has a second pipe port placed higher than the first pipe port and cools the refrigerant; a first flexible pipe whose one end is connected with the first pipe port and whose another end is connected with the second pipe port and through which the refrigerant flows and which can bend freely; and a loading table having a surface which becomes higher in a vertical direction as approaching from one end of the surface to another end, and on which the first flexible pipe is placed so as to become higher in the vertical direction as approaching from a side of the first flexible pipe, which is connected with the first pipe port, to a side of the first flexible pipe which is connected with the second pipe port.

TORSIONAL HEAT PIPE

Particular embodiments described herein provide for an electronic device that can be configured to include a torsional heat pipe. The torsional heat pipe can include a first housing static portion located in a first housing of an electronic device, where the first housing static portion is coupled to a heat source, a second housing static portion located in a second housing of the electronic device, where the second housing static portion is coupled to a heat spreader, and a torsion portion located in a hinge of the electronic device, where the hinge rotatably couples the first housing to the second housing and the torsion portion rotates as the second housing rotates relative to the first housing and the torsion portion couples the first housing static portion to the second housing static portion.

Heat exchange system reactive to internal and external temperatures

The present invention includes a heat exchanger reactive to external and internal temperatures for carrying a working fluid, including two pairs of nested pipes; each pair including one pipe with a channel portion and a stress relief portion and a second pipe with just a channel portion, one of said pipes enclosing the other with an interference fit and both pipes having different coefficients of thermal expansion. The first pair of pipes positioned co-axially with and encompassing the second pair. A fluid is positioned in the space defined by the inner surface of outer pair of pipes and the outer surface of inner pair of pipes. The two pipe pairs have positions responsive to the internal and external temperatures in which the space defined by pipe pairs is either minimized or maximized by expansion and contraction of the pipe pairs caused by differences in coefficients of thermal expansion.

MEMORY MODULE COOLER WITH ROTATABLE COOLING TUBE
20190056179 · 2019-02-21 ·

An example memory module cooler may include a first liquid manifold, a second liquid manifold, and a cooling tube connected to the first and second liquid manifolds such that. The cooling tube may be connected to the manifolds such that (1) liquid coolant can flow from the first liquid manifold through the cooling tube to the second liquid manifold, and (2) the cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the cooling tube. The cooling tube may have an oblong cross-sectional profile.

Heat exchanger reactive to internal and external temperatures

The present invention includes a heat exchanger reactive to external and internal temperatures for carrying a working fluid, including two pairs of nested pipes; each pair including one pipe with a channel portion and a stress relief portion and a second pipe with just a channel portion, one of said pipes enclosing the other with an interference fit and both pipes having different coefficients of thermal expansion. The first pair of pipes positioned co-axially with and encompassing the second pair. A fluid is positioned in the space defined by the inner surface of outer pair of pipes and the outer surface of inner pair of pipes. The two pipe pairs have positions responsive to the internal and external temperatures in which the space defined by pipe pairs is either minimized or maximized by expansion and contraction of the pipe pairs caused by differences in coefficients of thermal expansion.