A heat exchanger module includes a condenser unit and an evaporator unit. The evaporator unit includes N pieces of parallel-flow heat exchangers arranged adjacently, and the coolant temperatures reduce gradually from the first to Nth parallel-flow heat exchangers along an air flow direction in the evaporator unit. A counter-current mounting method is adopted in the parallel-flow heat exchangers of the evaporator unit in the heat exchanger module provided by the present invention. The coolant temperature of each parallel-flow heat exchanger is lower than that of the previous one, the temperature difference between air and coolant is relatively uniform by using the counter-current method so as to reach a better heat exchange effect.

A cooling device has a heat receiving unit that has a space therein, liquid phase piping that supplies liquid phase refrigerant to the heat receiving unit, gas phase piping that discharges gas phase refrigerant from the heat receiving unit, and spacers that are disposed inside the heat receiving unit. The spacers have a higher specific gravity than the liquid phase refrigerant. The spacers have a shape allowing movement along the bottom face of the heat receiving unit. When the heat receiving unit tilts, the spacers move to the low side of the heat receiving unit. The spacers gather on the bottom face of the heat receiving unit on the low side. The liquid phase refrigerant spreads to the high side of the heat receiving unit by an amount equivalent to the volume removed due to the spacers, and uniform cooling can be performed.

A pump assisted heat pipe may combine the low mass flow rate required of latent heat pipe transfer loops with a hermetically sealed pump to overcome the typical heat pipe capillary limit. This may result in a device with substantially higher heat transfer capacity over conventional pumped single-phase loops, heat pipes, loop heat pipes, and capillary pumped loops with very modest power requirements to operate. Further, one or more embodiments overcome the gravitation limitations in the conventional heat pipe configuration, e.g., when the heat addition zone is above the heat rejection zone, the capillary forces are required to transfer the liquid from the heat rejection zone to the heat addition zone against gravity.

A heat-exchange apparatus is provided, including a first heat exchanger, a second heat exchanger, a third heat exchanger and a fourth heat exchanger. The first heat exchanger is thermally separated from the second heat exchanger. The third heat exchanger is thermally connected to the first heat exchanger. The fourth heat exchanger is thermally connected to the second heat exchanger, wherein a first air flow passes through the first heat exchanger and the second heat exchanger to be divided into a first divergent flow and a second divergent flow, the first divergent flow flows on a surface of the first heat exchanger, the second divergent flow flows on a surface of the second heat exchanger, the first divergent flow does not flow on the surface of the second heat exchanger, and the second divergent flow does not flow on the surface of the first heat exchanger.

The present disclosure provides materials and methods related to passive cooling systems. In particular, the present disclosure provides a condensorator heat exchanger with a single microchannel coil that integrates the evaporator and condenser into one assembly. The passive heat exchanger systems of the present disclosure provide enhanced cooling capacity and airflow in environments ranging from outdoor electronic enclosures to commercial and residential buildings.

A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first radiator, a second radiator, a connecting conduit, and an outlet conduit. The first radiator has a first top tank and a first bottom tank. The first top tank is coupled to the inlet conduit. The second radiator has a second top tank and a second bottom tank. The second radiator is positioned parallel to the first radiator. The first radiator and the second radiator are positioned at an angle relative to a bottom panel of the computing system. The connecting conduit has a first end coupled to the first bottom tank and a second end coupled to the second bottom tank. The outlet conduit is coupled to the second top tank.

A height-adjustable heat dissipation unit includes a main body, which has a top plate member, a bottom plate member, an extendable structure and a chamber. The extendable structure is a tapered structure located between and connected to the top and the bottom plate member, and consists of one or more folding sections. The chamber is provided on inner wall surfaces with a main body wick structure and is filled with a working fluid.

A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.

A vertical ground heat exchanger for reducing the temperature in the carbonaceous shale rock mass and preventing roadbed frost heave includes a heating mechanism, a heat releasing component respectively connected to both ends of the heating mechanism and a refrigeration heat exchange mechanism. The refrigeration heat exchange mechanism is connected to the lower end of the heating mechanism through a heat transfer pipeline and communicates with the heat releasing component. The heat releasing component includes a double-layer heat exchange tube component, a gas-liquid separator and a branch tube, wherein the double-layer heat exchange tube component is respectively connected to the both ends of the heating mechanism, the gas-liquid separator is connected to the double-layer heat exchange tube component, and the branch tube is connected between the gas-liquid separator and the refrigeration heat exchange mechanism. The double-layer heat exchange tube component includes an upper bellows and a lower bellows.

A heat conducting member includes a housing provided with a space inside, and a working medium in the space. The housing includes a first region, a second region located on one side in one direction perpendicular or substantially perpendicular to a thickness direction of the housing across the first region, and a third region located on another side in the one direction across the first region. The first region includes a first end portion connected to the second region and a second end portion connected to the third region. The first end portion is at a position in the thickness direction different from the second end portion.