A cooler includes an evaporator and a condenser. The evaporator includes a housing, a wick, and a groove member having a plurality of vapor flow channels through which working fluid changed in phase from a liquid phase to a gas phase flows, the groove member being coupled to the wick. The housing includes a heat receiver to which the heat is transferred from a cooling target. The groove member includes a plurality of plate-like members, arranged side by side along a predetermined direction, and constituting the plurality of vapor flow channels. Each of the plate-like members includes a bent part formed by bending a part of the plate-like member, the bent part being coupled to the heat receiver.

An apparatus includes first and second microchannel heat exchangers and first and second pipes. The first heat exchanger includes a first inlet, a second inlet, a first tube, a second tube, a first outlet, and a second outlet. Refrigerant at the first inlet is directed through the first tube to the first outlet and the first pipe. Refrigerant at the second inlet is directed through the second tube to the second outlet and the second pipe. The second heat exchanger includes a third inlet, a fourth inlet, a third tube, a fourth tube, a third outlet, and a fourth outlet. The third inlet directs refrigerant from the first pipe through the third tube towards the third outlet. The fourth inlet directs the refrigerant from the second pipe through the fourth tube towards the fourth outlet. The first pipe overlaps the second pipe between the two heat exchangers.

A micro heat transfer component includes a bottom metal plate; a top metal plate; a plurality of sidewalls each having a top end joining the top metal plate and a bottom end joining the bottom metal plate, wherein the top and bottom metal plates and the sidewalls form a chamber in the micro heat transfer component; a plurality of metal posts in the chamber and between the top and bottom metal plates, wherein each of the metal posts has a top end joining the top metal plate and a bottom end joining the bottom metal plate; a metal layer in the chamber, between the top and bottom metal plates and intersecting each of the metal posts, wherein a plurality of openings are in the metal layer, wherein a first space in the chamber is between the metal layer and bottom metal plate and a second space in the chamber is between the metal layer and top metal plate; and a liquid in the first space in the chamber.

Methods and devices are disclosed for reacting and separating components. An elongated vessel has a microchannel heat pipe with a hollow space inside the microchannel heat pipe being surrounded by inner walls. A feed stream and a reactant stream are passed into the hollow space, the reactant reacting, resulting in a product stream. A first end of the microchannel heat pipe is heated and an opposite end of the microchannel heat pipe is cooled, producing a gas phase and a liquid phase in reflux. The liquid phase attaches to the inner walls via capillary forces and the vapor phase makes up the balance of the hollow space. The reflux separates components in the product stream, a first portion passing out of a first end of the heat pipe as a liquid stream and a second portion passing out of a second end of the heat pipe as a vapor stream.

The present invention is related to a thin heat dissipation device and a method for manufacturing the same. The device of the present invention mainly comprises a hollow body having an enclosed chamber and a working fluid with which the enclosed chamber is filled. The enclosed chamber comprises a first fluid channel and a second fluid channel. The first and second fluid channels extend in the longitudinal direction of the hollow body, are juxtaposed in the width direction of the hollow body and communicated with each other, and an interface between the first fluid channel and the second fluid channel has a height of about 0.1 mm or less. As such, a novel capillary structure which is capable of greatly reducing the entire thickness, enhancing heat transfer efficiency and reducing cost and which is reliable and durable is provided.

A vapor chamber structure including a thermally conductive shell, a capillary structure layer, and a working fluid is provided. The thermally conductive shell includes a first thermally conductive portion and a second thermally conductive portion. The first thermally conductive portion has at least one first cavity. The second thermally conductive portion and the first cavity define at least one sealed chamber, and a pressure in the sealed chamber is lower than a standard atmospheric pressure. The capillary structure layer covers an inner wall of the sealed chamber. The working fluid is filled in the sealed chamber.

A device and method are provided for more efficient thermal management of optoelectronic devices. A microfluidic distribution apparatus embedded with the optoelectronic device uses a working fluid in phase change to passively remove heat from an optoelectronic device. The working fluid undergoes phase change through various conversions between a liquid state and a two-phase liquid-vapor state to facilitate evaporation and condensation processes as the working fluid is distributed through micro-structures in the embedded microfluidic distribution apparatus. Passive two-phase cooling provides high thermal performance due to the use of the latent heat of a fluid in phase change, as well as the presence of favorable two-phase flow regimes at micro-scale dimensions.

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.

Methods, systems, and device for two-phase thermal management are provided in accordance with various embodiments. For example, some embodiments include a two-phase thermal management device that may include: a liquid chamber; one or more inlets configured to deliver a liquid to the liquid chamber; an evaporator chamber; a capillary layer positioned within the evaporator chamber and configured to spread the liquid from the liquid chamber; a liquid manifold configured to deliver the liquid from the liquid chamber to at least the capillary layer or the evaporator chamber; and/or one or more outlets configured to remove at least a vapor or a portion of the liquid from the evaporator chamber. Some embodiments that may include a two-phase thermal management device coupled with at least: a heat exchanger, a pump, a heat recuperator, a pre-heater, and/or a variable volume reservoir. Some embodiments include a two-phase thermal management method.

A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.