Patent classifications
F28D2015/0225
Heat transfer mediums
The disclosure generally relates to compositions, methods, and systems for heat transfer and methods of preparing heat transfer mediums. In various embodiments are described heat transfer mediums comprising a plurality of microparticles suspended in a bulk material with each microparticle containing a phase change material. In other embodiments are described fluids comprising of a slurry of microparticles containing phase change fluid in a carrier liquid for a fast charger system.
Photovoltaic panel system assembly method
A cooling system for a photovoltaic panel including micro flat heat pipes (HP) integrated with thermoelectric generators (TEG) and a cooled water reservoir for cooling the working fluid in heat pipes. The cooled water in the reservoir is pumped from the condensate pan of an air conditioner. Experimental results show that cooling system reduced the average temperature of the panel by as much as 19? C. or 25%. Further, the output power of the photovoltaic panel increased by 44% when the photovoltaic panel was used in a very hot climate (30-40? C.). An additional two watts of power was generated by the TEGs.
PASSIVE NANO-HEAT PIPES FOR COOLING AND THERMAL MANAGEMENT OF ELECTRONICS AND POWER CONVERSION DEVICES
A cooling device for a heat source, such as an electronic component, has a single or set of nano- and/or micro-sized channel(s) connected to a single or multiple reservoir(s). The heat source causes nucleation within a channel, and a vapor bubble forms removing heat from the heat source via evaporation of liquid to vapor in the bubble and condensation of the generated vapor at the cooler ends of the bubble. Thus, the channel operates as a passive heat pipe and removes heat from the source by passively circulating the cooling fluid between the vapor bubble and the reservoir(s).
LOOP HEAT PIPE AND ELECTRONIC DEVICE
A loop heat pipe includes a first heat pipe portion and a second heat pipe portion. The first heat pipe portion includes a first evaporator, a first condenser, a first vapor tube, and a first liquid tube. The second heat pipe portion includes a second evaporator, a second condenser, a second vapor tube, and a second liquid tube. The loop heat pipe further includes a connecting portion that connects the first condenser and the second condenser.
Method for assembling a photovoltaic panel cooling system
A cooling system for a photovoltaic panel including micro flat heat pipes (HP) integrated with thermoelectric generators (TEG) and a cooled water reservoir for cooling the working fluid in heat pipes. The cooled water in the reservoir is pumped from the condensate pan of an air conditioner. Experimental results show that cooling system reduced the average temperature of the panel by as much as 19? C. or 25%. Further, the output power of the photovoltaic panel increased by 44% when the photovoltaic panel was used in a very hot climate (30-40? C.). An additional two watts of power was generated by the TEGs.
Wickless capillary driven constrained vapor bubble heat pipes for application in display devices
A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in display devices are disclosed. An example embodiment includes: a display device layer fabricated from a substrate, the display device layer including a plurality of in-built channels integrated therein; and a plurality of wickless capillary driven constrained vapor bubble heat pipes being embedded into the plurality of in-built channels, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.
Heat transfer device for high heat flux applications and related methods thereof
A device and related method that provides a two-phase heat transfer device with a combination of enhanced evaporation and increase cooling capacity. A recess topology is used to increase suction of working fluid toward a heat source. A non-wetting coating or structure may be used to keep working fluid away from the spaces between elongated members of an evaporator and a wetting coating or structure may be used to form thin films of working fluid around the distal regions of elongated members. The devices and method described herein may be used to cool computer chips, the skin of a hypersonic flying object, a parabolic solar collector, a turbine engine blade, or other heat sources that require high heat flux.
Heat pipe and method of manufacturing the same
A method of manufacturing a heat pipe, including the steps of: forming in a substrate a cylindrical opening provided with a plurality of ring-shaped recessed radially extending around a central axis of the opening; arranging in the recesses separate ring-shaped strips made of a material catalyzing the growth of carbon nanotubes; and growing carbon nanotubes in the opening from said ring-shaped strips.
HEAT PIPE
A heat pipe containing a working fluid includes a first metal layer and a second metal layer. The first metal layer includes an upper surface and bottomed holes depressed from the upper surface. The second metal layer includes a lower surface that is joined with the upper surface of the first metal layer and a recess that is depressed from the lower surface. The recess forms a vapor layer in which vapor vaporized from the working fluid moves. Adjacent bottomed holes are in communication with each other so that the bottomed holes form a liquid layer in which the working fluid liquefied from the vapor moves.
Heat Transfer Mediums
The disclosure generally relates to compositions, methods, and systems for heat transfer and methods of preparing heat transfer mediums. In various embodiments are described heat transfer mediums comprising a plurality of microparticles suspended in a bulk material with each microparticle containing a phase change material. In other embodiments are described fluids comprising of a slurry of microparticles containing phase change fluid in a carrier liquid for a fast charger system.