A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

A temperature plate device includes a plate body and a bent structure. The plate body includes a first plate and a second plate. A chamber is defined by the first plate and the second plate. The first plate has a first step section. The second plate has a second step section corresponding to the first step section. The bent structure is connected to and traverses the first step section between the first step section and the second step section.

A thermal ground plane comprises top and bottom layers that are substantially impervious to fluid and together defining an inner space, a vapour transport mesh layer having a relatively coarse mesh structure and located within said space, and at least one liquid transport mesh layer having a relatively fine mesh structure and located between said vapour transport mesh layer and one of said top and bottom layers, the two said mesh layers being in contact with one another across substantially their entire planar extents. The top and bottom layers are sealed with a substantially fluid tight seal, and said inner space contains a liquid and is partially evacuated.

A micro-channel pulsating heat pipe, preferably closed loop, includes a plate with micro-channels with obstructions along interior walls to increase surface area, add nucleation sites for the working fluid vaporization, and otherwise enhance fluid movement and heat transfer. Various shapes of obstructions are considered on one or more of the bottom wall, the side walls, and top wall of the channel. Plating may fit over or around the plate to enhance strength and heat transfer. Ribbing, of a thermally conductive material, may set on the exterior surface of the plate and/or plating to enhance surface area to encourage heat transfer and arranged to facilitate air movement across exterior surface.

Some variations provide a leading-edge heat pipe comprising: (a) an envelope fabricated from a shell material, wherein the envelope includes at least one edge with a radius of curvature of less than 3 mm, and wherein the envelope includes, or is in thermal communication with, at least one heat-rejection surface; (b) a porous wick fabricated from a ceramic or metallic wick material, wherein the porous wick is configured within a first portion of the interior cavity, wherein at least a portion of the porous wick is adjacent to the inner surface, and wherein the porous wick has a bimodal pore distribution comprising an average capillary-pore size from 0.2 microns to 200 microns and an average high-flow pore size from 100 microns to 2 millimeters (the average high-flow pore size is greater than the average capillary-pore size); and (c) a phase-change heat-transfer material contained within the porous wick.

A vapor chamber having an adhering configuration and a manufacturing method thereof are provided. The manufacturing method includes: a dispensing step implemented by forming a ring-shaped adhesive onto an inner surface of a first metallic sheet; a filling step implemented by filling a working liquid in a space jointly defined by the inner surface of the first metallic sheet and the ring-shaped adhesive; a bonding step implemented by bonding the first metallic sheet and a second metallic sheet together in a vacuum chamber through the ring-shaped adhesive, so as to form a semi-finished product that defines an enclosed thermal flow space therein, in which the working liquid is arranged in the thermal flow space; and a solidifying step implemented by placing the semi-finished product in a solidifying environment so as to solidify the ring-shaped adhesive to form a sealing frame.

A heat dissipation net disposed on a base plate of a vapor chamber unit includes a base net portion and conduction units formed on the base net portion. Each conduction unit has a protruding area, a recessed area, and a curved section formed between the protruding area and the recessed area. When the heat dissipation net is disposed on the base plate, the existence of the recessed area and the curved section prevents the base net portion from being unduly pressed and stuck to the base plate to thereby improve a capillary action of the heat dissipation net. A space formed between each protruding area and the base plate facilitates the quick conduction of vaporized working fluid of the vapor chamber unit. Thus, the entire heat dissipation efficiency is increased.

An enhanced gravity-driven, thin film condensation heat transfer condenser is disclosed for use in a thermosyphon performing in two perpendicular orientations, as well as orientations in between. The thermosyphon includes an evaporator fluidly coupled to a first condenser configured with a plurality of fins, with each of the plurality of fins having notches adjacent to flanges, the notches forming vapor flow channels through the plurality of fins. The first condenser is fluidly coupled to a second condenser, and vapor flowing from the evaporator must first pass through the first condenser before entering the second condenser.

An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel. First and second tube parts are in fluid communication with evaporation portion.

A heat dissipating device includes a thermosyphon, a first liquid cooling tube and a first heat dissipating fin set. The thermosyphon has an evaporation portion and a condensation portion. The first liquid cooling tube is sleeved on the condensation portion. The first heat dissipating fin set is sleeved on the first liquid cooling tube.