Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

Examples of the disclosure relate to an oscillating heat pipe comprising for cooling components within a bendable electronic device. The oscillating heat pipe comprises at least one condenser region to be positioned in a first portion of the bendable electronic device and at least one evaporator region to be positioned in a second portion of the bendable electronic device. The oscillating heat pipe also comprises at least one bendable region provided between the condenser region and the evaporator region and configured to extend across a hinge of a bendable electronic device wherein at least one bendable region comprises a polymer tubing supported by a flexible helical support structure.

Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.

Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.

Systems and methods for thermal management using separable heat pipes and methods of manufacture thereof. Various embodiments provide a porous insert that can be used to join or connect heat pipes. Further embodiments provide thermal management systems that are modular, expandable, reparable, by allowing for joining of evaporators, condensers, and adiabatic sections via porous inserts. Various embodiments allow for two-phase thermal management systems, where liquid and gaseous phases can be transported simultaneously. Certain embodiments incorporate heat generating components with embedded evaporators and/or condensers. Many embodiments are additively manufactured, including via 3D printing.

A height-adjustable heat dissipation unit includes a main body, which has a top plate member, a bottom plate member, an extendable structure and a chamber. The extendable structure is a tapered structure located between and connected to the top and the bottom plate member, and consists of one or more folding sections. The chamber is provided on inner wall surfaces with a main body wick structure and is filled with a working fluid.

A passive heat exchanger includes an evaporator section including a heat exchange surface formed complementary to a surface of a gas turbine engine component to be cooled. The heat exchange surface is configured to be thermally coupled in conductive contact to the component surface. The heat exchanger further includes a condenser section coupled in passive convective flow communication with the evaporator section, and a working fluid contained within the evaporator section and the condenser section and configured to passively convect heat from the evaporator section to the condenser section.

A hetero-material floating heat pipe structure includes a main body and a multi-segment floating adjustment unit. The main body has a front end, a rear end and a flexible section disposed between the front end and the rear end. The flexible section has flexibility, whereby the main body is flexible. The multi-segment floating adjustment unit is disposed on an outer surface of the flexible section for restricting and protecting the flexible section. The multi-segment floating adjustment unit includes multiple adjustment members, which are pivotally connected with each other and stringed to form the multi-segment floating adjustment unit. Each of two ends of each adjustment member has a pivoted section. By means of the pivoted sections, the adjustment members are pivotally connected with each other and can be swung and bent by the same angle or by different angles to adjust the arrangement of the multi-segment floating adjustment unit.

A heat dissipation device has a frame assembly, a gravity loop thermosyphon, and a dissipating fin assembly. The gravity loop thermosyphon has a heat exchanger, a condenser, two bendable tubes, and working fluid. One end of each bendable tube communicates with the heat exchanger and another end of each bendable tube communicates with the condenser and thus the working fluid may circulate therein. After the bendable tubes are bent, the condenser can be moved to an appropriate location or tilted to an appropriate angle according to the environment, and then the location and the angle are fixed via the frame assembly so the gravity loop thermosyphon can adapt for different dissipation assemblies.

Apparatuses, systems, and techniques to cool computing devices. In at least one embodiment, a system includes a heatsink including one or more connector pins to laterally couple the heatsink to one or more computing devices.