Provided is a polymer-based pulsating heat pipe that has high flexibility and is applicable to a flexible electronic device. In addition, by surrounding a channel by a multilayer film including a first blocking layer and coating a bonding part with a second blocking layer in order to prevent air from penetrating through the bonding part between upper and lower films, an inner portion of the channel may be maintained in a vacuum state and heat performance of the polymer-based pulsating heat pipe may be maintained. In addition, although the polymer-based pulsating heat pipe according to the present invention has high flexibility, it is lightweight and has heat performance superior to that of copper, thereby effectively cooling the flexible electronic device.

A heat pipe, a heat pipe assembly and a method for assembling the heat pipe assembly. The heat pipe includes a main body part and an insertion part. The insertion part is connected to the main body part. The main body part and the insertion part together form a single hollow pipe. The insertion part has an outer surface and at least one recessed part formed on the outer surface.

A heat transfer system includes a housing, an annealed heat pipe coupled to the housing, and a heat source coupled to the housing. The heat pipe exerts a biasing force in a direction toward the heat source when the heat pipe is in thermal communication with the heat source.

A heat dissipation device has a frame assembly, a gravity loop thermosyphon, and a dissipating fin assembly. The gravity loop thermosyphon has a heat exchanger, a condenser, two bendable tubes, and working fluid. One end of each bendable tube communicates with the heat exchanger and another end of each bendable tube communicates with the condenser and thus the working fluid may circulate therein. After the bendable tubes are bent, the condenser can be moved to an appropriate location or tilted to an appropriate angle according to the environment, and then the location and the angle are fixed via the frame assembly so the gravity loop thermosyphon can adapt for different dissipation assemblies.

Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.

A flexible vapor chamber for an electronic device includes an upper cover, a lower cover, an accommodation space, a capillary structure, plural support structures and a working fluid. The upper cover is made of a first flexible material. The lower cover is made of a second flexible material. The accommodation space is arranged between the upper cover and the lower cover. The capillary structure is disposed on the lower cover and accommodated within the accommodation space. The plural support structures are disposed on the upper cover and accommodated within the accommodation space. The plural support structures are contacted with the capillary structure. The working fluid is accommodated within the accommodation space. The flexible vapor chamber is permitted to be subjected to a flexural action in a flexible range. Consequently, the installation of the flexible vapor chamber complies with a shape of the electronic device.

A heat dissipation device includes two connected components and a flexible metal conduit. Each connected component is selected from a manifold, a quick connector, an evaporator, a condenser or a pump. The two connected components are in communication with each other through the flexible metal conduit. The use of the flexible metal conduit is effective to absorb the designing tolerance. In addition, the flexible metal conduit is recyclable.

A height-adjustable heat dissipation unit includes a main body, which has a top plate member, a bottom plate member, an extendable structure and a chamber. The extendable structure is a tapered structure located between and connected to the top and the bottom plate member, and consists of one or more folding sections. The chamber is provided on inner wall surfaces with a main body wick structure and is filled with a working fluid.

A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.

A loop heat pipe includes a first loop heat pipe including a first evaporator, a first condenser, a first liquid pipe, and a first vapor pipe forming a first loop together with the first liquid pipe, a second loop heat pipe including a second evaporator, a second condenser, a second liquid pipe, and a second vapor pipe forming a second loop together with the second liquid pipe, and a connecting part to connect the first condenser and the second evaporator. The first loop and the second loop are separate and independent from each other. The first loop heat pipe, the second loop heat pipe, and the connecting part are integrally formed by a metal.