The disclosure relates to a pulsating heat pipe including channel plate. The channel plate includes first surface, second surface, first channels, second channels, first passages, second passages, at least one chamber, and at least one third passage. The first channels and the chamber are formed on the first surface, the channels are formed on the second surface, and the first passages, the second passages, and the third passage penetrate through the first and second surfaces. The chamber has a closed end located opposite to the third passage and connected to at least one of the second channels via the third passage. The first and second channels are connected via the first and second passages. The chamber has a hydraulic diameter of D.sub.h which satisfies the following condition: $D_h>2\sqrt{\frac{\sigma }{\mathrm{\Delta \rho }g}},$
wherein σ is surface tension, Δρ is difference in density between liquid and vapor, and g is gravitational acceleration.

A rotor system includes a rotor hub, a plurality of rotor blades supported by the rotor hub, and a fairing mounted to the rotor hub. The fairing includes an external surface exposed to an external airflow and an internal surface defining an interior portion. One or more heat generating components are arranged in the interior portion. A cooling system is arranged in the interior portion. The cooling system includes a first heat exchanger thermally connected to each of the one or more heat generating components, a second heat exchanger mounted to the fairing, and at least one fluid conduit extending therebetween so as to remove heat generated by each of the one or more heat generating components.

The present invention discloses a defrosting device, including: a heating unit provided at a lower portion of the evaporator; and a heat pipe connected to an inlet and an outlet of the heating unit, respectively, and having at least part thereof disposed adjacent to a cooling pipe of the evaporator such that the cooling pipe of the evaporator is heated by a working fluid of high temperature which is transferred in a heated state by the heating unit, wherein the heating unit includes: a heater case extending in one direction to be arranged in a left and right direction of the evaporator, and having the inlet and the outlet at both sides thereof; and a heater provided with an active heating part accommodated within the heater case and actively generating heat to heat the working fluid, and a passive heating part extending from the active heating part and heated up to temperature lower than temperature of the active heating part, and wherein the inlet is formed at a position away from the active heating part to prevent the working fluid returned after flowing along the heat pipe from being introduced directly into the active heating part.

A siphon-based heat sink for a server comprises a heat absorbing mechanism, a siphon mechanism, and a heat sink. The heat absorbing mechanism comprises a base plate and a cover plate. The base plate comprises a bottom plate and multiple sets of heat dissipating fins, and is in contact with the central processing unit. The heat sink comprises a cooling cavity and cooling fins. The evaporation cavity is communicated with the cooling cavity via two siphon tubes to enable heat transfer and circulation of a thermal conductive medium. Lower ends of the two fin plates are positioned close to and fixed to the bottom plate, while upper ends thereof are bent outward to form a curved mechanism, and an included angle between the two fin plates continuously increases from bottom to top.

A two-phase cooling system with flow boiling, characterized in that a closed hydraulic circuit apparatus of a heat transfer refrigerating fluid is provided, including: a pump for a refrigerating fluid which, at least in some stretches of the circuit, is two-phase liquid-vapor or multi-phase; a heat sink-evaporator configured to transfer heat by conduction from a component to be cooled to the refrigerating fluid; a condenser, capable of condensing the vapor which develops on the evaporator while simultaneously dissipating the heat given by the refrigerating fluid both by conduction, convection and radiation and by condensation into the environment; a tank which also acts as an expansion vessel, or a tank and an expansion vessel which are distinct and connected to each other; and a plurality of sensors, including flow rate, pressure and temperature sensors and an electronic control system of the pump.

Provided is a condenser for use in an electronic assembly. The condenser includes a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall, a second vertical wall extending in the vertical direction, the second vertical wall defining a second plurality of vertical condensation channels within the second vertical wall, and a first plurality of fins extending in the vertical direction, each of the first plurality of fins connected to the first vertical wall, the second vertical wall or both the first vertical wall and the second vertical wall.

A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

The present invention provides a stack-type vertical heat dissipation device comprising an evaporator unit and a condenser unit. The evaporator unit has a side configured for direct or indirect contact with, and thereby receiving heat from, a high-temperature device in order for the heat to convert a heat conduction medium inside the evaporator unit into a gaseous state. The condenser unit is stacked on a top side of a housing of the evaporator unit, and is provided therein with a flow channel that is in communication with the evaporator unit and allows passage of the heat conduction medium so that the heat conduction medium is able to return to the evaporator unit under a force of gravity after condensing from the gaseous state into a liquid state and thereby complete a thermal cycle.

Systems, devices, and methods for providing a passive coolant distributions unit (pCDU) to promote refrigerant flow circulation, manage and monitor refrigerant inventory in a closed loop system.

A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.