Patent classifications
F28D15/0258
MULTI-LAYERED COUNTERFLOW EXPANDING MICROCHANNEL COOLING ARCHITECTURE AND SYSTEM THEREOF
Devices that have integrated cooling structures for counterflow, two-phase cooling and systems thereof are provided. In one example, a first structure can comprise a first cooling channel. The first cooling channel can have a first value of width that increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area. Also, a second structure can comprise a second cooing channel. The second cooling channel can have a second value of width that increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area.
Heat spreading module
In a heat spreading module, a plurality of hollow paths is formed in a thin plate-shaped main body so as to pass though the heating portion, and the hollow paths communicate with each other in a heating portion, a working fluid is enclosed in the hollow paths, a wick is disposed in each of the hollow paths such that a vapor flow path in which vapor of the working fluid flows is formed in each of the hollow paths, a part of each wick is positioned at the heating portion, and the vapor flow paths formed in the hollow paths communicate with each other in the heating portion.
THERMOSIPHONS FOR USE WITH TEMPERATURE-REGULATED STORAGE DEVICES
In some embodiments, a thermosiphon configured for use within a temperature-regulated storage device includes: a condenser region, including a plurality of evenly spaced condenser channels with horizontally symmetrical bifurcated branches connected to an adiabatic channel, each of the plurality of condenser channels connected at a top position to an upper channel; an evaporator region, including a plurality of evaporator channels, wherein each of the plurality of evaporator channels has a flow channel formed in a serpentine channel pattern and each subunit of the serpentine channel pattern is attached to a vapor return channel at a top of the subunit, and wherein the evaporator region has at least one lowest position connected directly to a vapor return channel; and an adiabatic region including at least one adiabatic channel connecting the evaporator channels and the condenser channels.
REMOVAL OF NON-CONDENSABLE GASES FROM A CLOSED LOOP PROCESS
A method which allows the ejection of non-condensable gases, notably air, from a closed loop power generation process or heat pump system, is disclosed. A vessel in which a working fluid is absorbed or condensed can be separated from the power generation processes by valves. Residual gas comprising C02, non-condensable gas such as air, water and alkaline materials including amines may be compressed by raising the liquid level in said vessel. The concurrent pressure increase leads to the selective absorption of C02 by alkaline materials. In simpler embodiments, mainly air is removed from one- or two-component processes. Following the compression, non-condensable gas may be vented, optionally through a filter. The method is simple and economic as vacuum pumps may be omitted. The method is useful for any power generation and Rankine cycle, and particularly useful for the power generation process known as C3 or Carbon Carrier Cycle.
Vapor chamber
A vapor chamber includes a first cover, a second cover, a sealing ring and a sealing plug. The first cover has a thermal contact surface. The second cover is coupled with the first cover so as to form an interior space together, and the second cover has a vent hole. The sealing ring has a channel and at least one opening. The opening is in fluid communication with the channel, the sealing ring is clamped between the first cover and the second cover, and the vent hole is in fluid communication with the interior space via the channel and the opening. The vent hole and the channel are plugged with the sealing plug so as to seal the interior space.
Two phase coolant management
The discussion relates to cooling computing devices and specifically to managing two-phase cooling. One example can include a two-phase liquid immersion tank containing heat generating components and a liquid phase of a coolant having a boiling point within an operating temperature range of the heat generating components. The example can also include a stratification chamber fluidly coupled to the liquid immersion tank and configured to at least partially separate a gas phase of the coolant from other gases. The example can further include a condenser chamber fluidly coupled to the stratification chamber and configured to receive the gas phase of the coolant and cause the gas phase of the coolant to phase change back into the liquid phase of the coolant.
VAPOR CHAMBER
A vapor chamber includes a first cover, a second cover, a sealing ring and a sealing plug. The first cover has a thermal contact surface. The second cover is coupled with the first cover so as to form an interior space together, and the second cover has a vent hole. The sealing ring has a channel and at least one opening. The opening is in fluid communication with the channel, the sealing ring is clamped between the first cover and the second cover, and the vent hole is in fluid communication with the interior space via the channel and the opening. The vent hole and the channel are plugged with the sealing plug so as to seal the interior space.
VAPOR CHAMBER
A vapor chamber includes a first cover, a second cover, a sealing ring and a sealing plug. The first cover has a thermal contact surface. The second cover is coupled with the first cover so as to form an interior space together, and the second cover has a vent hole. The sealing ring has a channel and at least one opening. The opening is in fluid communication with the channel, the sealing ring is clamped between the first cover and the second cover, and the vent hole is in fluid communication with the interior space via the channel and the opening. The vent hole and the channel are plugged with the sealing plug so as to seal the interior space.