A thermal management system includes a slurry generator, an injector pump coupled to the slurry generator, a heat exchanger reactor coupled to the injector pump, wherein the heat exchanger reactor is adapted to subject a thermally expendable heat absorption material to a temperature above 60° C. and a pressure below 3 kPa, and wherein the expendable heat absorption material endothermically decomposes into a gaseous by-product. A vapor cycle system is coupled to the heat exchanger reactor and is operatively connected to a thermal load. A thermal energy storage system may be coupled to the vapor cycle system and the thermal load. The thermal energy storage system may isolate the heat exchanger reactor from thermal load transients of the thermal load.

An evaporator includes: a container; a first supplying unit configured to supply a liquid phase refrigerant to an inside of the container; a second supplying unit configured to supply the liquid phase refrigerant along a surface of the container; a heat absorbing unit configured to be disposed on the inside, and in which the liquid phase refrigerant supplied to the inside by the first supplying unit absorbs heat supplied from an outside of the container; a storage part configured to be disposed on the inside, stores the liquid phase refrigerant absorbing the heat in the heat absorbing unit, and stores the liquid phase refrigerant obtained by cooling and condensing a gaseous phase refrigerant evaporated by heat absorption in the heat absorbing unit by using the liquid phase refrigerant supplied along the surface by the second supplying unit; and a discharging unit configured to discharge the liquid phase refrigerant stored.

Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.

A system and method for cooling an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

A heat dissipation apparatus includes a vapor chamber and multiple flow field fins. The vapor chamber includes a lower plate part and an upper plate part. The lower plate part includes multiple flow channels, a first and a second confluence areas formed on the flow channels. The upper plate part covers on the lower plate part to enclose the flow channels, the first and second confluence areas. Each flow field fin includes an inlet channel, an outlet channel, and a circuitous channel. The inlet channel communicates with the first confluence area, the outlet channel communicates with the second confluence area, and the circuitous channel communicates between the inlet channel and the outlet channel in a single flow direction. The flow field fins are collectively as an inlet surface at one side adjacent to the outlet channel and as an outlet surface at another side adjacent to the inlet channel.

A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

The present application provides a compound refrigeration system for a heat pipe of a supergravity centrifuge. The compound refrigeration system for the heat pipe of the supergravity centrifuge includes a rotor rotating around a vertical axis, an experimental cabin covering outside the rotor, and a corresponding cooling system. The rotor is provided with a shaft part which is in running fit with the experimental cabin. The shaft part is provided with a shaft top end located outside the experimental cabin. The cooling system includes a liquid cooling device and an evaporative cooling device. The liquid cooling device comprises a refrigeration source, and a first cooling medium circulating pipeline communicated with the refrigeration source and thermally coupled with a cabin wall of the experimental cabin. The evaporative cooling device includes a condensation chamber arranged outside the experimental cabin, and a heat pipe radiator thermally coupled with the rotor.

A cooling system includes a tank, a heat exchanger, a separation tank, a first tube, a second tube, a third tube, a gas storage device, a fourth tube, a first valve, a second valve and a third valve. A heating element is immersed in a dielectric liquid in the tank. The heat exchanger condenses dielectric vapor of the dielectric liquid. The separation tank is used for a separation operation. The first tube is connected to the tank and the heat exchanger. The second tube is connected to the heat exchanger and the separation tank. The third tube is connected to the separation tank and the tank. The gas storage device stores the dielectric vapor. The fourth tube is connected to the gas storage device and the separation tank.

Disclosed are thermal management for electronic devices and, more particularly, to a thermodynamic system with bi-phase fluid circuits which self-organize internal fluid movement to transfer heat from heat absorption zones to heat dissipation zones. A thermodynamic system may include a plurality of thermal energy absorption (TEA) nodes disposed adjacent to one or more heat sources which are interconnected with one another and also a plurality of thermal energy dissipation (TED) nodes through a capillary system that encloses a bi-phase fluid. As TE is absorbed into the bi-phase fluid at individual TEA nodes local condition changes such as, for example, pressure and/or volume increases induce convection of the absorbed TE away from the individual TEA nodes. As TE dissipates from the bi-phase fluid at individual TED nodes local condition changes such as, for example, pressure and/or volume decreases further induce convection of additional absorbed TE toward the individual TED nodes.

A heat pipe system including a heat pipe having a first end and a second end for transferring working fluid from the first to the second end, a first reservoir in fluid communication with the first end for holding working fluid in liquid form, a first heat exchanger for transmitting thermal energy from a heat source to working fluid in the first reservoir to vaporize the fluid, a second heat exchanger for transmitting thermal energy from vaporized working fluid to a heat sink thereby condensing the fluid, a return conduit and a pump for pumping the condensed working fluid along the return conduit, where the heat pipe, the return conduit and the first reservoir form a hermetically sealed circuit. A method of transferring thermal energy using a heat pipe system is also disclosed.