A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

The present disclosure is an evaporation device for cooling. In an evaporation space 12 formed inside a housing 10, a wick 16 allows a working fluid to move by capillary force. As the working fluid moves from a lower portion of the evaporation space 12 to an upper portion thereof, that is, from the working fluid inlet pipe 26 to the vapor outlet pipe 28 by the wick 16, the working fluid is evaporated by heat generated from the heat source to become vapor. A partition wall 20 is provided in the evaporation space 12 to control the flow of vapor. The working fluid transferred into the evaporation space 12 is uniformly mixed with the existing working fluid in the lower portion of the evaporation space 12 by a distributor 30.

A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.

A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.

A heat exchanger includes a vapor collection pipe, a liquid collection pipe, and an exchange pipeline. The exchange pipeline includes a condensing section, an evaporation section, and a transition section. An upper end of the condensing section is connected to the vapor collection pipe. A lower end of the condensing section is connected to a first end of the transition section. An upper end of the evaporation section is connected to a second end of the transition section. A lower end of the evaporation section is connected to the liquid collection pipe. The evaporation section and the condensing section respectively extend in directions opposite to each other.

A thermosiphon device includes an evaporator section, a condenser section and a liquid path configured to deliver liquid that exits the evaporator section directly back to the evaporator inlet. The condenser section has a significantly reduced mass flow rate and lower pressure drop as compared to the evaporator section, which has an increase liquid fraction of working fluid.

The invention relates to a valve (1), comprising a valve housing (4) and a closing body (3) arranged in the valve housing (4) in such a way that the closing body can be moved longitudinally, wherein at least one inlet channel (5) and at least one outlet channel (6) are arranged in the valve housing (4). The closing body (3) interacts with a valve seat (8) formed on the valve housing (4) by means of the longitudinal motion of the closing body and thereby opens and closes at least one hydraulic connection between the at least one inlet channel (5) and the at least one outlet channel (6). The closing body (3) can be driven by means of a metal-bellows/piston unit (2), wherein the metal-bellows/piston unit (2) has a variable-length metal bellows (20) and a variable-volume working chamber (23) and wherein the metal bellows (20) bounds the working chamber (23) in a sealing manner.

Wire coils are distributed over the bottom surface of an inner chamber of a vapor chamber. The working fluid of the vapor chamber comprises ferromagnetic particles that are attracted to a wire coil as current passes through the wire coil. The resulting increase in the volumetric concentration of ferromagnetic particles in the vicinity of the activated wire coil increases the capacity of the working fluid to remove heat from an integrated circuit component attached to the vapor chamber in the region of the activated wire coil. The vapor chamber wire coils can be activated based on performance metrics associated with the processor units of an integrated circuit component, thereby allowing for the thermal resistance of the working fluid to be dynamically adjusted based on the workload executing on the integrated circuit component and power consumption transients.

A liquid-in and vapor-out composite liquid-vapor phase conversion heat dissipation device that includes a housing with a chamber connected to an inlet and outlet; a capillary structure in the chamber for maintaining a predetermined distance from the inlet and outlet, and separating the chamber into an liquid inlet chamber and a vapor outlet chamber. The liquid inlet chamber is spatially connected to the inlet, and the vapor outlet chamber is spatially connected to the outlet. A drainage structure located at the top surface of the bottom of the housing is affixed to the bottom of the capillary structure for diverting liquid from the liquid inlet chamber to the underside of the capillary structure. The bottom surface of the bottom of the housing is affixed to a heat source, and when the heat source is attached, the drainage structure is located above the heat source.

A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can include a reservoir, a pump, an inlet manifold, an outlet manifold, and flexible cooling lines extending from the inlet manifold to the outlet manifold. The flexible cooling lines can be routable within server housings and can be fluidly connected to two or more series-connected heat sink modules that are mountable on microprocessors of the servers. The flexible cooling lines can be configured to transport low-pressure, two-phase dielectric coolant. The first bypass can include a first pressure regulator configured to regulate a first bypass flow of coolant through the first bypass. The second bypass can include a second pressure regulator configured to regulate a second bypass flow of coolant through the second bypass.